Substrate on substrate structure and electronic device comprising the same

Abstract

A substrate-on-substrate structure and an electronic device including the same are provided, and the substrate-on-substrate structure includes: a first printed circuit board having a first side and a second side, opposite to the first side; a second printed circuit board disposed on the second side of the first printed circuit board, and having a first side connected to the second side of the first printed circuit board and a second side opposite to the first side connected to the second side of the first printed circuit board; a first structure disposed on the second side of the first printed circuit board, and disposed around the second printed circuit board; a second structure disposed on the second side of the second printed circuit board; and a third structure disposed on the first and second structures, and connected to each of the first and second structures.

What is claimed is: 
     
       1. A substrate-on-substrate structure, comprising:
 a first printed circuit board having a first side and a second side, opposite to the first side; 
 a second printed circuit board disposed on the second side of the first printed circuit board, the second printed circuit board having a first side connected to the second side of the first printed circuit board, and the second printed circuit board having a second side, opposite to the first side of the second printed circuit board; 
 a first structure disposed on the second side of the first printed circuit board, and disposed around the second printed circuit board; 
 a second structure disposed on the second side of the second printed circuit board; and 
 a third structure disposed on the first and second structures, and connected to each of the first and second structures, 
 wherein the first printed circuit board includes a plurality of first pads having a first pitch in the first side of the first printed circuit board, 
 the second printed circuit board includes a plurality of second pads having a second pitch in the first side of the second printed circuit board and a plurality of third pads having a third pitch in the second side of the second printed circuit board, and 
 the second pitch is less than the first pitch and greater than the third pitch. 
 
     
     
       2. The substrate-on-substrate structure of  claim 1 , wherein the first structure is a reinforcing member including at least one of a metal or a ceramic,
 the second structure is a reinforcing member including at least one of a metal or a ceramic, and 
 the third structure is a heat dissipation member including metal. 
 
     
     
       3. The substrate-on-substrate structure of  claim 1 , wherein the first structure has a first through portion in which the second printed circuit board is disposed. 
     
     
       4. The substrate-on-substrate structure of  claim 1 , further comprising:
 an electronic component disposed on the second side of the second printed circuit board, 
 wherein the second structure is disposed around the electronic component. 
 
     
     
       5. The substrate-on-substrate structure of  claim 4 , wherein the second structure has a second through portion in which the electronic component is disposed. 
     
     
       6. The substrate-on-substrate structure of  claim 1 , wherein the third structure covers the second side of each of the first and second printed circuit boards. 
     
     
       7. The substrate-on-substrate structure of  claim 1 , wherein the first structure is attached to the first printed circuit board through a first adhesive member,
 the first structure is attached to the third structure through a second adhesive member, 
 the second structure is attached to the second printed circuit board through a third adhesive member, and 
 the second structure is attached to the third structure through a fourth adhesive member. 
 
     
     
       8. The substrate-on-substrate structure of  claim 1 , wherein the first printed circuit board is a core type printed circuit board, and
 the second printed circuit board is a coreless type printed circuit board. 
 
     
     
       9. The substrate-on-substrate structure of  claim 8 , wherein the first printed circuit board is thicker than the second printed circuit board. 
     
     
       10. The substrate-on-substrate structure of  claim 1 , wherein a planar area of the first printed circuit board is wider than the second printed circuit board. 
     
     
       11. The substrate-on-substrate structure of  claim 1 , further comprising:
 a plurality of electrical connection metals disposed between the second side of the first printed circuit board and the first side of the second printed circuit board, and connecting the second printed circuit board to the second side of the first printed circuit board. 
 
     
     
       12. The substrate-on-substrate structure of  claim 11 , further comprising:
 a passive component mounted on the first side of the second printed circuit board; and 
 an underfill resin disposed between the second side of the first printed circuit board and the first side of the second printed circuit board, and covering at least a portion of each of the plurality of electrical connection metals and the passive component. 
 
     
     
       13. An electronic device, comprising:
 a mainboard; and 
 the substrate-on-substrate structure of  claim 1  disposed on the mainboard. 
 
     
     
       14. The electronic device of  claim 13 , wherein the first printed circuit board is mounted on the mainboard through a plurality of first electrical connection metals having the first pitch,
 the second printed circuit board is mounted on the first printed circuit board through a plurality of second electrical connection metals having the second pitch, and 
 the electronic component is mounted on the second printed circuit board through a plurality of third electrical connection metals having the third pitch. 
 
     
     
       15. An electronic device, comprising:
 a first printed circuit board; 
 a second printed circuit board disposed on the first printed circuit board; 
 an electronic component disposed on the second printed circuit board, the second printed circuit board being disposed between the first printed circuit board and the electronic component; 
 a first structure disposed on the first printed circuit board and surrounding side surfaces of the second printed circuit board; 
 a second structure disposed on the second printed circuit board and surrounding side surfaces of the electronic component; 
 a plurality of electrical connection metals disposed between the first printed circuit board and the second printed circuit board, and connecting the second printed circuit board to the first printed circuit board; and 
 a passive component mounted on the second printed circuit board and between the second printed circuit board and the first printed circuit board, 
 wherein the second structure is disposed between the electronic component and the first structure, and is spaced apart from the first structure and the electronic component, and 
 the passive component is spaced apart from the plurality of electrical connection metals. 
 
     
     
       16. The electronic device of  claim 15 , further comprising a third structure disposed on the first and second structures, and covering the first and second structures and the electronic component. 
     
     
       17. The electronic device of  claim 15 , wherein the first structure and the second structure are made of a metal or a ceramic. 
     
     
       18. The electronic device of  claim 15 , wherein each of an elastic modulus of the first structure and of an elastic modulus of the second structure is greater than each of an elastic modulus of a build-up layer of the first printed circuit board and an elastic modulus of a build-up layer of the second printed circuit board.