Inspection device and method of controlling temperature of probe card

Abstract

An inspection device for inspecting an inspection target substrate includes a probe card, a tester, a plurality of conductive lines, and a resistor. The probe card has probes to be in contact with the inspection target substrate. The tester is configured to transmit and receive electric signals for an inspection to and from the inspection target substrate through the probes. The conductive lines electrically connect the probe card with the tester, and at least a part of the conductive lines is electrically connected to the probes. The resistor is formed at the probe card and serves as an electrical resistor. The tester is further configured to measure a resistance of the resistor based on the electric signals transmitted and received through the conductive lines.

What is claimed is: 
     
       1. An inspection device for inspecting an inspection target substrate, comprising:
 a probe card having probes to be in contact with the inspection target substrate; 
 a tester configured to transmit and receive electric signals for an inspection to and from the inspection target substrate through the probes; 
 a plurality of conductive lines that electrically connect the probe card with the tester, at least a part of the conductive lines being electrically connected to the probes; and 
 a resistor configured to short-circuit a pair of the conductive lines and serve as an electrical resistor, 
 wherein the tester is further configured to measure a resistance of the resistor between the pair of the conductive lines before the inspection is performed. 
 
     
     
       2. The inspection device of  claim 1 , wherein the tester is further configured to determine whether or not the probes are positionally stable based on a measurement result of the resistance. 
     
     
       3. The inspection device of  claim 1 , wherein the tester is further configured to estimate a temperature of the probe card based on a measurement result of the resistance. 
     
     
       4. The inspection device of  claim 1 , wherein the resistor is formed on at least one of the probe side of the probe card, the tester side of the probe card, or inside the probe card. 
     
     
       5. The inspection device of  claim 1 , wherein the probe card is divided into a plurality of areas and the resistor is disposed in each of the divided areas of the probe card. 
     
     
       6. The inspection device of  claim 1 , wherein the resistor is a short-circuit line configured to short-circuit the pair of the conductive lines and the short-circuit line has a linear and thin film shape. 
     
     
       7. The inspection device of  claim 6 , wherein a length of the short-circuit line is greater than a distance between ends of the pair of the conductive lines on the probe card side. 
     
     
       8. The inspection device of  claim 7 , wherein the short-circuit line is repeatedly extended and folded in a radial direction of the probe card. 
     
     
       9. The inspection device of  claim 1 , wherein the tester is further configured to predict a state of a member disposed around the probe card based on a measurement result of the resistance. 
     
     
       10. The inspection device of  claim 9 , wherein the tester is further configured to control the member based on the predicted state of the member. 
     
     
       11. A method of controlling a temperature of a probe card provided in an inspection device for inspecting an inspection target substrate before an inspection is performed,
 wherein the inspection device includes: 
 a tester configured to transmit and receive electric signals for the inspection to and from the inspection target substrate through probes of the probe card; 
 a plurality of conductive lines that electrically connect the probe card with the tester, at least a part of the conductive lines being electrically connected to the probes; and 
 a resistor configured to short-circuit a pair of the conductive lines and serves as an electrical resistor, 
 the method comprising: 
 heating or cooling the probe card; 
 measuring a resistance of the resistor between the pair of the conductive lines; and 
 determining whether or not a temperature of the probe card is stable based on a measurement result of the resistance.