Scanning exposure method and apparatus

Abstract

An exposure apparatus for transferring a pattern formed on a mask to a photosensitive substrate is provided with an illumination optical system for illuminating a local area on the mask with a light beam, a projection optical system for projecting the pattern of the mask to the photosensitive substrate and a relative scanning device for relatively scanning the mask and the photosensitive substrate in a perpendicular direction to the optical axis of the projection optical system so as to transfer the pattern of the mask to the photosensitive substrate. The apparatus further has an adjusting device for adjusting at least one of the scanning speeds of the mask and substrate, the intensity of the light beam to be incident on the photosensitive substrate and the width of a projection area of the pattern of the mask by the projection optical system in the relative scanning direction in accordance with the change of the sensitivity characteristic of the photosensitive substrate or the change of the intensity distribution of the light beam passing a Fourier transform plane in the illumination optical system with respect to the pattern surface of the mask.

1 . A scanning exposure apparatus in which a mask and a substrate are moved synchronously during scanning exposure, the apparatus comprising: 
 an optical system, the substrate being exposed with exposure light from said optical system;    a first optical member, disposed in said optical system, which has a plurality of movable members and a driving system to move the plurality of movable members and which defines an illumination area of the exposure light, the plurality of movable members of the first optical device being fixed during the scanning exposure; and    a second optical device, disposed in said optical system, which has a plurality of movable members and a driving system to move the plurality of movable members during the scanning exposure, the plurality of movable members of the second optical device preventing undesired light from projecting onto the substrate during the scanning exposure.    
     
     
         2 . A scanning exposure apparatus according to  claim 1 , wherein the plurality of movable members of the second optical device are disposed in a plane conjugate with a pattern surface of the mask.  
     
     
         3 . A scanning exposure apparatus according to  claim 2 , wherein the plurality of movable members of the first optical device are arranged in the vicinity of the plane conjugate with the pattern surface.  
     
     
         4 . A scanning exposure apparatus according to  claim 2 , wherein the plurality of movable members of the first optical device are arranged in the vicinity of the mask.  
     
     
         5 . A scanning exposure apparatus according to  claim 1 , wherein the plurality of movable members of the first optical device are arranged in a plane apart from a plane conjugate with the pattern surface.  
     
     
         6 . A scanning exposure apparatus according to  claim 1 , further comprising: 
 a measurement device, disposed on an image plane side of a projection system, which measures width of the illumination area defined by the first optical system.    
     
     
         7 . A scanning exposure apparatus according to  claim 1 , further comprising: 
 a light source,    wherein the movable members of said first and second optical devices are disposed between the light source and the mask.    
     
     
         8 . A scanning exposure method in which a mask and a substrate are moved synchronously, the method comprising: 
 synchronously moving the mask and the substrate to expose the substrate;    defining a rectangular illumination area of exposure light, the illumination area being defined by a first optical device having a plurality of movable members that are fixed during the synchronous movement; and    moving, during the synchronous movement, a plurality of movable members of a second optical device to prevent undesired light from projecting onto the substrate.    
     
     
         9 . A scanning exposure method according to  claim 8 , wherein the plurality of movable members of the second optical device are disposed in a plane conjugate with a pattern surface of the mask.  
     
     
         10 . A scanning exposure method according to  claim 9 , wherein the plurality of movable members of the first optical device are arranged in the vicinity of the plane conjugate with the pattern surface.  
     
     
         11 . A scanning exposure method according to  claim 9 , wherein the plurality of movable members of the first optical device are arranged in the vicinity of the mask.  
     
     
         12 . A scanning exposure method according to  claim 8 , wherein the plurality of movable members of the first optical device are arranged in a plane apart from a plane conjugate with the pattern surface.  
     
     
         13 . A scanning exposure method according to  claim 1 , further comprising: 
 measuring width of the illumination area defined by the first optical system.    
     
     
         14 . A micro-device manufacturing method in which a substrate is exposed by moving a mask and the substrate in order to form a device pattern on the substrate, the method comprising: 
 synchronously moving the mask and the substrate to expose the substrate;    defining a rectangular illumination area of exposure light, the illumination area being defined by a first optical device having a plurality of movable members that are fixed during the synchronous movement; and    moving, during the synchronous movement, a plurality of movable members of a second optical device to prevent undesired light from projecting onto the substrate.