CMP composition containing silane-modified abrasive particles

Abstract

A polishing composition comprising a dispersion of silane-modified abrasive particles formed by combining at least one metal oxide abrasive having at least one surface metal hydroxide with at least one silane compound and methods for polishing substrate features such as metal features and oxide features using the polishing compositions.

1 . A method for polishing a substrate that includes at least one surface feature comprising the steps of: 
 (a) preparing a chemical mechanical polishing slurry comprising a solvent selected from water and an organic solvent, and the product of the combination of a metal oxide abrasive including at least one surface metal hydroxide and at least one silane compound having the formula:    Y—Si—(X 1 X 2 R)    and dimers, trimers and oligomers thereof, wherein y is hydroxy (—OH) or a hydrolyzable substituent, X 1  and X 2  are each independently selected from hydroxy, a hydrolyzable substituent, and a non-hydrolyzable substituent, and R is a non-hydrolyzable substituent wherein the non-hydrolyzable moieties are each independently selected from the group consisting of alkyl, cycloalkyl, aromatic, functionalized alkyl, functionalized aromatic, and functionalized cycloalkyl, one or more of which carbon atoms may be substituted with one or more atoms selected from oxygen, nitrogen, sulfur, phosphorous, halogen and combinations thereof wherein the silane is not an aminosilane;    (b) applying the chemical mechanical composition to a polishing pad; and    (c) moving the substrate surface feature into contact with the polishing pad and moving the polishing pad in relationship to the substrate surface feature until at least a portion of the feature is removed from the substrate:    
     
     
         2 . The method of  claim 1  wherein the polishing composition is applied to the polishing pad during polishing at a time selected from before the substrate surface feature is moved into contact with the polishing pad, after the substrate surface feature is moved into contact with the polishing pad, and a combination thereof.  
     
     
         3 . The method of  claim 1  wherein the solvent is water.  
     
     
         4 . The method of  claim 1  wherein X 1  and X 2  are each selected from the group consisting of hydroxy or a hydrolyzable substituent.  
     
     
         5 . The method of  claim 4  wherein R is a non-hydrolyzable substituent selected from the group of compounds including alkyl and functionalized alkyl.  
     
     
         6 . The method of  claim 5  wherein the silane compound is selected from the group consisting of glycidoxypropyltrialkoxysilane, isocyanatopropyltrialkoxysilane, ureidopropyltrialkoxysilane, mercaptopropyltrialkoxysilane, cyanoethyltrialkoxysilane, 4,5-dihydro-1-(3-trialkoxysilylpropyl)imidazole, 3-(trialkoxysilyl)-methyl ester propanoic acid, trialkoxy[3-(oxiranylalkoxy)propyl]-silane, 2-methyl, 3-(trialkoxysilyl)propyl ester 2-propenoic acid, [3-(trialkoxysilyl)propyl]urea, and mixtures thereof.  
     
     
         7 . The method of  claim 1  wherein one substituent selected from X 1  and X 2  is a non-hydrolyzable substituent.  
     
     
         8 . The method of  claim 7  wherein R and the non-hydrolyzable substituent selected from X 1  and X 2  are each independently selected from the group of compounds including alkyl, functionalized alkyl, and mixtures thereof.  
     
     
         9 . The method of  claim 8  wherein the silane is selected from the group consisting of chloropropylmethyldialkoxysilane, 1,2-ethanediylbis[alkoxydimethyl]silane, dialkoxymethylphenyl silane, and mixtures thereof.  
     
     
         10 . The method of  claim 1  wherein X 1  and X 2  are each non-hydrolyzable moieties.  
     
     
         11 . The method of  claim 10  wherein R, X 1  and X 2  are each independently selected from the group of compounds including alkyl, functionalized alkyl, and mixtures thereof.  
     
     
         12 . The method of  claim 11  wherein the alkyl and functionalized alkyl have from 2 to 25 carbon atoms.  
     
     
         13 . The method of  claim 12  wherein each non-hydrolyzable substituent is a functionalized alkyl selected from the group consisting of alkylnitriles, alkylamides, alkylcarboxylic acids, alkyl halide, alcohol, alkyluriedo, and mixtures thereof.  
     
     
         14 . The method of  claim 13  wherein at least one of the non-hydrolyzable moieties is functionalized propyl alkyl.  
     
     
         15 . The method of  claim 10  wherein the silane is selected from the group consisting of cyanopropyldimethylalkoxysilane, N,N′-(alkoxymethylsilylene)bis[N-methyl-benzamide], chloromethyldimethylalkoxysilane, and mixtures thereof.  
     
     
         16 . The method of  claim 1  wherein the silane is selected from the group consisting of glycidoxypropyltrialkoxysilane, isocyanatopropyltrialkoxysilane, ureidopropyltrialkoxysilane, mercaptopropyltrialkoxysilane, cyanoethyltrialkoxysilane, 4,5-dihydro-1-(3-trialkoxysilylpropyl)imidazole, 3-(trialkoxysilyl)-methyl ester propanoic acid, trialkoxy[3-(oxiranylalkoxy)propyl]-silane, 2-methyl, 3-(trialkoxysilyl)propyl ester 2-propenoic acid, [3-(trialkoxysilyl)propyl]urea, chloropropylmethyldialkoxysilane, 1,2-ethanediylbis[alkoxydimethyl]silane, dialkoxymethylphenyl silane, cyanopropyldimethylalkoxysilane, N,N′-(alkoxymethylsilylene)bis[N-methyl-benzamide], chloromethyldimethylalkoxysilane, and mixtures thereof.  
     
     
         17 . The method of  claim 1  wherein the metal oxide abrasive having at least one surface metal hydroxide is selected from alumina, silica, ceria, germania, titania, and combinations thereof.  
     
     
         18 . The method of  claim 1  wherein the abrasive is selected from silica.  
     
     
         19 . The method of  claim 1  wherein the substrate surface feature is a material selected from the group consisting of an oxide, an adhesion material, a metal layer or layers including a combination thereof.  
     
     
         20 . The method of  claim 1  wherein the substrate includes a plurality of surface features with each surface feature being a material selected from the group consisting of an oxide, an adhesion material, a metal, and combinations thereof.  
     
     
         21 . The method of  claim 1  wherein the substrate surface feature is an oxide feature.  
     
     
         22 . The method of  claim 1  wherein the substrate feature is a copper or copper alloy feature.  
     
     
         23 . The method of  claim 1  wherein the silane selected reduces oxide feature polishing rates in the presence of a metal feature.  
     
     
         24 . The method of  claim 1  wherein the substrate surface feature is a metal feature.  
     
     
         25 . The method of  claim 1  wherein the silane compound promotes substrate metal feature polishing.  
     
     
         26 . A method for polishing a substrate that includes at least one surface feature comprising the steps of: 
 a. combining water and at least one metal oxide abrasive including at least one surface metal hydroxide;    b. adding at least one silane selected from aminosilane, dimers, trimers and oligomers thereof to the product of step (a) to form a chemical mechanical polishing slurry;    c. applying the chemical mechanical polishing slurry to a polishing pad; and    d. moving the substrate surface feature into contact with the polishing pad and moving the polishing pad in relationship to the substrate surface feature until at least a portion of the feature is removed from the substrate.