Workpiece processing system
Abstract
A workpiece processing system for processing semiconductor wafers and other flat media includes a standalone processing unit having two or more modules vertically stacked on top of one another. A first module includes an ozone generator, a DI water supply, a purge gas/drying gas supply, and optionally includes an ammonium hydroxide generator. A second module is preferably stacked on top of the first module and includes a processing chamber in communication with the devices in the first module. The processing chamber preferably includes a rotor for holding and rotating workpieces, one or more spray manifolds, an ozone destructor, an anti-static generator, and/or any other suitable workpiece-processing devices. The rotor is preferably designed to hold two workpiece-carrying cassettes each capable of holding up to 25 workpieces. A third module is preferably stacked on top of the second module and includes the system electronics and controls.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A system for processing a workpiece, comprising:
a first module including an ozone generator; a second module attached to the first module, the second module including a processing chamber for processing a workpiece, wherein the ozone generator is connected to supply ozone gas to the processing chamber; and a rotor rotatably supported within the processing chamber.
2 . The system of claim 1 wherein the rotor is adapted to hold a first cassette and a second cassette, with each cassette holding a batch of workpieces.
3 . The system of claim 1 wherein the ozone generator produces ozone gas at a rate of at least 90 grams/hour.
4 . The system of claim 1 wherein the first, second, and third modules all have approximately the same width and length.
5 . The system of claim 1 further comprising a source of NH4OH connecting into the processing chamber.
6 . The system of claim 1 further comprising a manually operated door moveable from an open position, for loading and unloading workpieces into the rotor, to a closed position, for processing.
7 . The system of claim 1 further comprising an ozone destructor connecting with the processing chamber for converting ozone in exhaust gases flowing out from the processing chamber into oxygen.
8 . The system of claim 1 wherein the ozone destructor includes:
an inlet and an outlet adjacent to the upper end;
a chamber exhaust line connecting from the processing chamber to the inlet of the ozone destructor; and
a system exhaust line connecting to the outlet of the ozone destructor.
9 . The system of claim 7 wherein the ozone destructor contains a catalyst.
10 . The system of claim 1 further comprising at least one spray manifold in the processing chamber for spraying a process liquid onto the workpieces.
11 . The system of claim 1 further comprising a DI water supply in the first module connecting into the processing chamber.
12 . The system of claim 11 further comprising a heater in the first module for heating the DI water.
13 . The system of claim 1 further comprising an anti-static generator in the processing chamber.
14 . The system of claim 1 further comprising a purge gas generator in the first module, with the purge gas generator connecting into the processing chamber.
15 . The system of claim 14 wherein the purge gas generator comprises an N 2 gas generator.
16 . The system of claim 1 further comprising a compressed dry air supply in the first module connecting into the processing chamber.
17 . A standalone system for processing a workpiece, comprising:
a first module including a processing fluid supply; a second module on top of and attached to the first module, the second module including a processing chamber for processing a workpiece, wherein the processing fluid supply is in communication with the processing chamber; and a third module on top of and attached to the second module.
18 . The system of claim 17 wherein the first module has a footprint of 6-12 square feet.
19 . The system of claim 17 wherein the height of the system is more than double the width of the system.
20 . The system of claim 17 with the third module including a system controller.
21 . The system of claim 17 wherein the processing fluid supply comprises an ozone generator for supplying ozone gas into the processing chamber.
22 . A method for processing a wafer comprising the steps of:
loading a first cassette of wafers into a rotor in a process chamber; loading a second cassette of wafers into the rotor; wetting the wafers with water heated to 30-95 degrees C.; rotating the rotor; introducing ozone gas into the process chamber, with ozone gas diffusing through a layer of the heated water on; purging the ozone gas from the chamber; and drying the wafers.
23 . The method of claim 22 further comprising the step of rinsing the wafers.
24 . A system for processing articles, comprising:
support means for supporting a batch of articles within a process chamber; liquid supply means for supplying a heated liquid onto the articles; ozone supply means for supplying ozone into the process chamber; and rotation means for rotating the articles within the chamber.
25 . The system of claim 24 further comprising a device for destroying ozone, including:
a container having an upper end and a lower end;
a container inlet in the container, adjacent to the upper end of the container;
a container outlet in the container, adjacent to the upper end of the container;
a canister within the container, with the canister having an upper end and a lower end;
a canister inlet adjacent to the lower end of the canister;
a canister outlet adjacent to the upper end of the canister, with the canister outlet leading into the container outlet; and
a catalyst within the canister, above the canister inlet and below the canister outlet.Cited by (0)
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