Platen with patterned surface for chemical mechanical polishing

Abstract

A platen having a patterned upper surface for supporting a polishing material in a chemical mechanical polishing system is provided. In one embodiment, a platen for supporting a polishing material in a chemical mechanical polishing system includes a body adapted to support a polishing material during processing and having a substantially rigid non-planar upper support surface for supporting the polishing material during polishing.

1 . A platen for supporting the polishing material in a chemical mechanical polishing system, comprising: 
 a body adapted to support a polishing material during processing; and    a substantially rigid non-planar upper support surface defining an upper surface of the body for supporting the polishing material.    
     
     
         2 . The platen of  claim 1 , wherein the upper support surface is concave.  
     
     
         3 . The platen of  claim 1 , wherein the upper support surface is convex.  
     
     
         4 . The platen of  claim 1 , wherein the upper support surface includes both convex and concave portions.  
     
     
         5 . The platen of  claim 1 , wherein the upper support surface includes an inner region and at least one outer region, wherein the inner region and outer region are at different elevations.  
     
     
         6 . The platen of  claim 1 , wherein the body is rotatable.  
     
     
         7 . The platen of  claim 1 , wherein the body is fixed.  
     
     
         8 . The platen of  claim 1 , wherein the upper surface of the body is textured.  
     
     
         9 . The platen of  claim 8 , wherein the texture upper surface further comprises: 
 a plurality of grooves formed in the upper surface of the body.    
     
     
         10 . The platen of  claim 1 , wherein the upper surface of the body further comprises: 
 one or more raised portions on the upper surface defining a mounting surface; and    a recessed area defined by the one or more raised portions.    
     
     
         11 . The platen of  claim 1 , wherein the body further comprises: 
 magnetic device for coupling the polishing material to the upper surface.    
     
     
         12 . The platen of  claim 11 , wherein the magnetic device further comprises: 
 at least one of a magnetic or electromagnet.    
     
     
         13 . The platen of  claim 12  further comprising: 
 a magnetically couplable material coupled, embedded or fixed to the polishing material.  
 
     
     
         14 . The platen of  claim 1 , wherein the body further comprises: 
 vacuum port open to the upper surface.    
     
     
         15 . The platen of  claim 1 , wherein the body further comprises: 
 polishing fluid delivery port open to the upper surface.    
     
     
         16 . A platen for supporting the polishing material in a chemical mechanical polishing system, comprising: 
 a body adapted to support a polishing material during processing;    a substantially rigid non-planar upper support surface defining an upper surface of the body for supporting the polishing material; and    a plurality of recesses formed in the upper support surface.    
     
     
         17 . The platen of  claim 16 , wherein the recesses are grooves.  
     
     
         18 . The platen of  claim 17 , wherein the upper support surface has at area having a concave cross section.  
     
     
         19 . A chemical mechanical polishing system comprising: 
 a platen having a non-planar, substantially rigid upper support surface;    a polishing material disposed on the upper support surface; and    a polishing head adapted to retain a substrate against a working portion of the polishing material during processing.    
     
     
         20 . The chemical mechanical polishing system of  claim 19 , wherein the upper support surface further comprises: 
 at least one recessed area formed therein;    at least one area projecting above the recessed are and defining the non-planar surface.    
     
     
         21 . The chemical mechanical polishing system of  claim 19 , wherein a distance between the upper support surface and a plane defined by a lower surface of the polishing head is not uniform: