Method of forming fine patterns

Abstract

It is disclosed a method of forming fine patterns comprising: subjecting a substrate having photoresist patterns to a hydrophilic treatment, covering the substrate having photoresist patterns with an over-coating agent for forming fine patterns, applying heat treatment to cause thermal shrinkage of the over-coating agent so that the spacing between adjacent photoresist patterns is lessened by the resulting thermal shrinking action, and removing the over-coating agent substantially completely.

1 . A method of forming fine patterns comprising: subjecting a substrate having photoresist patterns to a hydrophilic treatment, covering the substrate having photoresist patterns with an over-coating agent for forming fine patterns, applying heat treatment to cause thermal shrinkage of the over-coating agent so that the spacing between adjacent photoresist patterns is lessened by the resulting thermal shrinking action, and removing the over-coating agent substantially completely.  
   
   
       2 . The method of forming fine patterns according to  claim 1 , wherein the hydrophilic treatment is performed by applying a hydrophilic solvent on the substrate having photoresist patterns.  
   
   
       3 . The method of forming fine patterns according to  claim 2 , wherein the hydrophilic solvent is at least one member selected from the group consisting of pure water, a water-soluble surfactant aqueous solution, and an alcohol aqueous solution.  
   
   
       4 . The method of forming fine patterns according to  claim 3 , wherein the hydrophilic solvent is pure water.  
   
   
       5 . The method of forming fine patterns according to  claim 1 , wherein the over-coating agent contains a water-soluble polymer.  
   
   
       6 . The method of forming fine patterns according to  claim 5 , wherein the water-soluble polymer is at least one member selected from the group consisting of alkylene glycolic polymers c ilulosic derivatives, vinyl polymers, acrylic polymers, urea polymers, epoxy polymers, melamine polymers and amide polymers.  
   
   
       7 . The method of forming fine patterns according to  claim 1 , wherein the over-coating agent is an aqueous solution having a solids content of 3-50 mass %.  
   
   
       8 . The method of forming fine patterns according to  claim 1 , wherein the heat treatment is performed at a temperature that does not cause thermal fluidizing of the photoresist patterns on the substrate.