Molded ball grid array

Abstract

A BGA and a system implementing a BGA. Specifically, a BGA package is encapsulated after the balls are attached to the package. The backside of the package having the balls disposed thereon may be completely covered by the encapsulant. The encapsulant is disposed in direct contact about a portion of the balls. A liner is provided to facilitate the formation of an unencapsulated portion of each ball. The unencapsulated portion may be used to couple the package to a system.

1 . A molded ball grid array comprising: 
 a substrate having a first surface and a second surface;    a plurality of conductive balls coupled to the first surface of the substrate;    a semiconductor device coupled to the second surface of the substrate; and    an encapsulant disposed over the first surface of the substrate and disposed conformally about the conductive balls, wherein the encapsulant conforms to the shape of the plurality of conductive balls and covers only a portion of the surface area of the plurality of conductive balls.    
   
   
       2 . The molded ball grid array, as set forth in  claim 1 , wherein the semiconductor device comprises a memory device.  
   
   
       3 . The molded ball grid array, as set forth in  claim 1 , wherein the semiconductor device is electrically coupled to the substrate.  
   
   
       4 . The molded ball grid array, as set forth in  claim 1 , wherein the encapsulant is disposed on at least a portion of the semiconductor device.  
   
   
       5 . The molded ball grid array, as set forth in  claim 1 , wherein the plurality of conductive balls comprises a plurality of solder balls.  
   
   
       6 . The molded ball grid array, as set forth in  claim 1 , wherein the encapsulant comprises a molding compound.  
   
   
       7 . The molded ball grid array, as set forth in  claim 1 , wherein the encapsulant comprises a resin.  
   
   
       8 . The molded ball grid array, as set forth in  claim 1 , wherein the encapsulant is disposed conformally around the conductive balls and covers a portion of the conductive balls, wherein the portion is a surface area defined by about 40% to about 85% of the diameter of the conductive balls.  
   
   
       9 . The molded ball grid array, as set forth in  claim 1 , wherein the encapsulant is disposed conformally around the conductive balls and covers a portion of the conductive balls, wherein the portion is a surface area defined by about 50% to about 70% of the diameter of the conductive balls.  
   
   
       10 . The molded ball grid array, as set forth in  claim 1 , wherein the encapsulant is disposed conformally around the conductive balls and covers a portion of the conductive balls, wherein the portion is a surface area defined by greater than 50% of the diameter of the conductive balls.  
   
   
       11 . A system comprising: 
 a processor; and    a package operatively coupled to the processor, wherein the package comprises: 
 a substrate having a first surface and a second surface;  
 a plurality of conductive balls coupled to the first surface of the substrate;  
 a semiconductor device coupled to the second surface of the substrate; and  
 an encapsulant disposed over the first surface of the substrate and disposed conformally about the conductive balls, wherein the encapsulant conforms to the shape of the plurality of conductive balls and covers a portion of the surface area of the plurality of conductive balls.  
   
   
   
       12 . The system, as set forth in  claim 11 , wherein the semiconductor device comprises a memory device.  
   
   
       13 . The system, as set forth in  claim 11 , wherein the semiconductor device is electrically coupled to the substrate.  
   
   
       14 . The system, as set forth in  claim 11 , wherein the encapsulant is disposed on at least a portion of the semiconductor device.  
   
   
       15 . The system, as set forth in  claim 11 , wherein the plurality of conductive balls comprises a plurality of solder balls.  
   
   
       16 . The system, as set forth in  claim 11 , wherein the encapsulant comprises a molding compound.  
   
   
       17 . The system, as set forth in  claim 11 , wherein the encapsulant comprises a resin.  
   
   
       18 . The system, as set forth in  claim 11 , wherein the encapsulant is disposed conformally around the conductive balls and covers a portion of the conductive balls, wherein the portion is a surface area defined by about 40% to about 85% of the diameter of the conductive balls.  
   
   
       19 . The system, as set forth in  claim 11 , wherein the encapsulant is disposed conformally around the conductive balls and covers a portion of the conductive balls, wherein the portion is a surface area defined by about 50% to about 70% of the diameter of the conductive balls.  
   
   
       20 . The system, as set forth in  claim 11 , wherein the encapsulant is disposed conformally around the conductive balls and covers a portion of the conductive balls, wherein the portion is a surface area defined by greater than 50% of the diameter of the conductive balls.