Substrate plating method and apparatus

Abstract

A method and apparatus for plating a substrate is provided, wherein fine pits formed in the substrate, such as fine channels for wiring, are filled with a copper, copper alloy, or other material with low electrical resistance. The method is performed on a wafer W having fine pits ( 10 ) to fill the fine pits with a metal ( 13 ) and includes performing a first plating process ( 11 ) by immersing the wafer in a first plating solution having a composition superior in throwing power; and performing a second plating process ( 12 ) by immersing the substrate in a second plating solution having a composition superior in leveling ability.

1 - 8 . (canceled)  
     
     
         9 . A method of plating a substrate having a surface with fine pits formed thereon, comprising: 
 forming a first plating layer within the fine pits by immersing the substrate in a first bath containing a first plating solution;    washing a surface of the first plating layer on the substrate in a first washing station;    forming a second plating layer on the first plating layer by immersing the substrate in a second bath containing a second plating solution different from the first plating solution;    washing a surface of the second plating layer on the first plating layer in a second washing station; and    drying the surface of the second plating layer.    
     
     
         10 . The method of  claim 9 , further comprising: 
 preprocessing the surface of the substrate with an aqueous sulfuric acid solution prior to forming a first plating layer.    
     
     
         11 . A method of plating a substrate, comprising: 
 supplying a first plating solution to a plating bath via a first plating solution supply;    supplying a second plating solution different from the first plating solution to said plating bath via a second plating solution supply; and    switching the supply of said first plating solution from said first plating solution supply and said second plating solution from said second plating solution supply to said plating bath on and off.    
     
     
         12 . The method of  claim 11 , wherein said plating bath is connected to a wash water supply device.  
     
     
         13 . The method of  claim 12 , wherein said switching is performed by a valve.  
     
     
         14 . The method of  claim 13 , wherein said switching is performed by a timer for opening and closing said valve.  
     
     
         15 . A method of plating a metal within fine pits in a surface of the substrate, comprising: 
 forming a first plating layer of the metal by electroplating with a first current density within the fine pits formed in the surface of the substrate while immersing the substrate in a first plating bath containing a first plating solution; and    forming a second plating layer of the metal by electroplating with a second current density on the first plating layer while immersing the substrate in a second plating bath containing a second plating solution different from the first plating solution;    wherein said second current density is larger than said first current density.    
     
     
         16 . The method of  claim 15 , wherein the first plating solution is supplied via a pump and a shut-off valve disposed upstream of the pump, and the second plating solution is supplied via a pump and a shut-off valve disposed upstream of the pump.  
     
     
         17 . The method of  claim 15 , further comprising: 
 washing the substrate with the first plating layer prior to forming the second plating layer.    
     
     
         18 . A method of plating a plurality of fine pits covered with a barrier layer in a surface of a substrate, comprising: 
 forming a first plating layer directly on the entire surface of the barrier layer within the fine pits by immersing the substrate in a first plating bath containing a first plating solution; and    forming a second plating layer on the first plating layer by immersing the substrate in a second plating bath containing a second plating solution.    
     
     
         19 . The method of  claim 18 , wherein the first plating solution is supplied via a pump and a shut-off valve, which is disposed upstream from the pump, from a first plating solution supplying section, and the second plating solution is supplied via a pump and a shut-off valve, which is disposed upstream from the pump, from a second plating solution supplying section.