Inventor · disambiguated record
Megumi Maruyama
Also filed as: MARUYAMA MEGUMI
9 granted patents·3 pending applications·184 citations·filing 1999–2019
89Inventor score
Top patents by PatentIndex Score
12 records- 0196US10378641B2Power systemHONDA MOTOR CO LTD·Filed 2017·Granted Aug 13, 2019·12 cites·12 claims
- 0295US6800188B2Copper plating bath and plating method for substrate using the copper plating bathEBARA UDYLITE KK·Filed 2002·Granted Oct 5, 2004·81 cites·33 claims
- 0388US6627066B1Method of measuring the concentration of a leveler in a plating liquidEBARA CORP·Filed 2000·Granted Sep 30, 2003·22 cites·4 claims
- 0481US6517894B1Method for plating a first layer on a substrate and a second layer on the first layerEBARA CORP·Filed 1999·Granted Feb 11, 2003·49 cites·125 claims
- 0576US10728414B2Detection apparatus, control method, and storage mediumCANON KK·Filed 2019·Granted Jul 28, 2020·1 cites·17 claims
- 0673US10871091B2Power systemHONDA MOTOR CO LTD·Filed 2017·Granted Dec 22, 2020·1 cites·10 claims
- 0763US6908534B2Substrate plating method and apparatusEBARA CORP·Filed 2001·Granted Jun 21, 2005·7 cites·12 claims
- 0863US2007102285A1Apparatus for managing a plating liquidISAYAMA YASUSHI·Filed 2006·Application pending·0 cites
- 0957US7172683B2Method of managing a plating liquid used in a plating apparatusEBARA CORP·Filed 2003·Granted Feb 6, 2007·1 cites·4 claims
- 1048US2006144714A1Substrate plating method and apparatusHONGO AKIHISA·Filed 2006·Application pending·0 cites
- 1145US7033463B1Substrate plating method and apparatusEBARA CORP·Filed 1999·Granted Apr 25, 2006·10 cites·14 claims
- 1242US2005098439A1Substrate plating method and apparatusFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →