Inventor · disambiguated record
Akihisa Hongo
Also filed as: HONGO AKIHISA
30 granted patents·14 pending applications·1,636 citations·filing 1996–2010
98Inventor score
Top patents by PatentIndex Score
44 records- 0198US5728223AReactant gas ejector head and thin-film vapor deposition apparatusEBARA CORP·Filed 1996·Granted Mar 17, 1998·674 cites·28 claims
- 0297US7682225B2Polishing apparatus and substrate processing apparatusEBARA CORP·Filed 2005·Granted Mar 23, 2010·46 cites·5 claims
- 0395US6419462B1Positive displacement type liquid-delivery apparatusEBARA CORP·Filed 2000·Granted Jul 16, 2002·169 cites·12 claims
- 0492US6615854B1Wafer cleaning apparatusEBARA CORP·Filed 2000·Granted Sep 9, 2003·55 cites·25 claims
- 0591US7862402B2Polishing apparatus and substrate processing apparatusEBARA CORP·Filed 2010·Granted Jan 4, 2011·10 cites·13 claims
- 0691US6921466B2Revolution member supporting apparatus and semiconductor substrate processing apparatusEBARA CORP·Filed 2001·Granted Jul 26, 2005·48 cites·3 claims
- 0790US6294059B1Substrate plating apparatusEBARA CORP·Filed 1998·Granted Sep 25, 2001·83 cites·72 claims
- 0888US6627066B1Method of measuring the concentration of a leveler in a plating liquidEBARA CORP·Filed 2000·Granted Sep 30, 2003·22 cites·4 claims
- 0985US6036783ALiquid material vaporizer apparatus and gas ejection deviceEBARA CORP·Filed 1997·Granted Mar 14, 2000·63 cites·20 claims
- 1084US6558518B1Method and apparatus for plating substrate and plating facilityEBARA CORP·Filed 2000·Granted May 6, 2003·36 cites·17 claims
- 1184US6517689B1Plating deviceEBARA CORP·Filed 1999·Granted Feb 11, 2003·57 cites·29 claims
- 1284US5862605AVaporizer apparatusEBARA CORP·Filed 1997·Granted Jan 26, 1999·62 cites·38 claims
- 1383US6716330B2Electroless plating apparatus and methodEBARA CORP·Filed 2001·Granted Apr 6, 2004·23 cites·5 claims
- 1483US6544585B1Method and apparatus for plating a substrateEBARA CORP·Filed 1998·Granted Apr 8, 2003·65 cites·33 claims
- 1581US6730596B1Method of and apparatus for forming interconnectionEBARA CORP·Filed 2000·Granted May 4, 2004·19 cites·9 claims
- 1681US6517894B1Method for plating a first layer on a substrate and a second layer on the first layerEBARA CORP·Filed 1999·Granted Feb 11, 2003·49 cites·125 claims
- 1778US6365017B1Substrate plating deviceEBARA CORP·Filed 1999·Granted Apr 2, 2002·31 cites·34 claims
- 1873US7172979B2Substrate processing apparatus and methodEBARA CORP·Filed 2002·Granted Feb 6, 2007·15 cites·14 claims
- 1973US6811658B2Apparatus for forming interconnectsEBARA CORP·Filed 2001·Granted Nov 2, 2004·14 cites·20 claims
- 2072US6793794B2Substrate plating apparatus and methodEBARA CORP·Filed 2002·Granted Sep 21, 2004·7 cites·8 claims
- 2169US7037853B2Wafer cleaning apparatusEBARA CORP·Filed 2003·Granted May 2, 2006·10 cites·13 claims
- 2263US6908534B2Substrate plating method and apparatusEBARA CORP·Filed 2001·Granted Jun 21, 2005·7 cites·12 claims
- 2363US2007102285A1Apparatus for managing a plating liquidISAYAMA YASUSHI·Filed 2006·Application pending·0 cites
- 2458US6269548B1Spin processing apparatusEBARA CORP·Filed 1998·Granted Aug 7, 2001·22 cites·19 claims
- 2557US7172683B2Method of managing a plating liquid used in a plating apparatusEBARA CORP·Filed 2003·Granted Feb 6, 2007·1 cites·4 claims
- 2657US2009026068A1Revolution member supporting apparatus and semiconductor substrate processing apparatusHONGO AKIHISA·Filed 2008·Application pending·0 cites
- 2754US6582580B1Substrate plating apparatusEBARA CORP·Filed 1999·Granted Jun 24, 2003·18 cites·5 claims
- 2854US2007113977A1Revolution member supporting apparatus and semiconductor substrate processing apparatusHONGO AKIHISA·Filed 2007·Application pending·0 cites
- 2952US6929722B2Substrate plating apparatusEBARA CORP·Filed 2001·Granted Aug 16, 2005·2 cites·49 claims
- 3048US2006144714A1Substrate plating method and apparatusHONGO AKIHISA·Filed 2006·Application pending·0 cites
- 3147US7297210B2Plating apparatusEBARA CORP·Filed 2002·Granted Nov 20, 2007·1 cites·6 claims
- 3245US7033463B1Substrate plating method and apparatusEBARA CORP·Filed 1999·Granted Apr 25, 2006·10 cites·14 claims
- 3344US2005087441A1Revolution member supporting apparatus and semiconductor substrate processing apparatusFiled 2004·Application pending·0 cites
- 3443US6495004B1Substrate plating apparatusEBARA CORP·Filed 1999·Granted Dec 17, 2002·9 cites·16 claims
- 3543US2004163947A1Substrate plating apparatusFiled 2004·Application pending·0 cites
- 3643US2004161529A1Electroless plating apparatus and methodFiled 2004·Application pending·0 cites
- 3742US2005098439A1Substrate plating method and apparatusFiled 2004·Application pending·0 cites
- 3841US2004200728A1Method and apparatus for forming interconnects, and polishing liquid and polishing methodFiled 2004·Application pending·0 cites
- 3939US2004226654A1Substrate processing apparatus and substrate processing methodFiled 2003·Application pending·0 cites
- 4038US6500317B1Plating apparatus for detecting the conductivity between plating contacts on a substrateEBARA CORP·Filed 1998·Granted Dec 31, 2002·8 cites·5 claims
- 4138US2004154931A1Polishing liquid, polishing method and polishing apparatusFiled 2003·Application pending·0 cites
- 4238US2004237896A1Plating apparatusFiled 2002·Application pending·0 cites
- 4338US2003186540A1Method and apparatus for forming fine circuit interconnectsFiled 2003·Application pending·0 cites
- 4437US2004234696A1Plating device and methodFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →