Heated and cooled vacuum chamber shield

Abstract

The invention is directed to method for processing substrates and chamber for the same. In one embodiment, a method for processing substrates includes transferring a substrate to a substrate support disposed in a processing chamber, controlling a temperature of a liner lining a sidewall of the processing chamber, and processing the substrate in the processing chamber.

1 . A method for processing substrates, comprising: 
 positioning a substrate in a processing chamber;    processing the substrate in the processing chamber; and    controlling a temperature of a liner lining a sidewall of the processing chamber.    
     
     
         2 . The method of  claim 1 , wherein the step of controlling the temperature of the liner further comprises: 
 heating the liner.    
     
     
         3 . The method of  claim 1 , wherein the step of controlling the temperature of the liner further comprises: 
 maintaining the temperature of the liner to minimize stress in a material deposited on the substrate.    
     
     
         4 . The method of  claim 1  further comprising: 
 heating the liner after the substrate has been processed in the chamber; and    removing the processed substrate from the processing chamber;    transferring a second substrate into the processing chamber; and    cooling the liner during processing of the second substrate.    
     
     
         5 . The method of  claim 1 , wherein the step of controlling the temperature of the liner further comprises: 
 applying power to a resistive heater disposed in a passage formed in the liner.    
     
     
         6 . The method of  claim 5 , wherein the step of controlling the temperature of the liner further comprises: 
 flowing a gas through the passage formed in the liner.    
     
     
         7 . The method of  claim 1 , wherein the step of controlling the temperature of the liner further comprises: 
 flowing gas through the passage formed in the liner.    
     
     
         8 . The method of  claim 7 , wherein the step of flowing the gas through the passage formed in the liner further comprises: 
 flowing at least one of air, nitrogen or argon through the passage.    
     
     
         9 . The method of  claim 1  further comprising: 
 electrically biasing the liner relative to the sidewall.    
     
     
         10 . The method of  claim 1 , wherein the step of controlling the temperature of the liner occurs during at least a portion of the processing step.  
     
     
         11 . The method of  claim 1 , wherein the step of controlling the temperature of the liner occurs during at least a portion of a bake-out procedure performed prior to the processing step.  
     
     
         12 . The method of  claim 1 , wherein the step of processing the substrate in the processing chamber further comprises: 
 depositing a layer of material on the substrate, wherein the material is at least one of aluminum, tantalum, indium tin oxide or polysilicon.    
     
     
         13 . A method for processing substrates, comprising: 
 positioning a substrate in a processing chamber having a shield lining a least a portion of an internal volume of the processing chamber;    regulating a temperature of a passage formed in the shield; and    processing a substrate disposed in the processing chamber.    
     
     
         14 . The method of  claim 13 , wherein the step of regulating the temperature further comprises: 
 applying power to a resistive heater disposed in the passage formed in the shield.    
     
     
         15 . The method of  claim 13 , wherein the step of regulating the temperature further comprises: 
 flowing a gas through the passage formed in the shield.    
     
     
         16 . The method of  claim 13 , wherein the step of regulating the temperature further comprises: 
 controlling a characteristic of a material deposited on the shield.    
     
     
         17 . The method of  claim 15 , wherein the step of regulating the temperature further comprises: 
 heating the shield during processing of the substrate.    
     
     
         18 . The method of  claim 13 , wherein the step of regulating the temperature further comprises: 
 cooling the shield during processing of the substrate.    
     
     
         19 . The method of  claim 13  further comprising: 
 replacing the shield after a number of substrate processing cycles.    
     
     
         20 . The method of  claim 19  further comprising: 
 heating an internal passage within a replacement shield prior to resuming substrate processing.    
     
     
         21 . A processing chamber comprising; 
 a chamber body having an internal wall defining an internal volume;    a substrate support disposed in the internal volume;    a removable liner disposed in the internal volume adjacent to the wall and circumscribing the liner; and    a temperature control passage formed the liner.    
     
     
         22 . The processing chamber of  claim 21  further comprising: 
 a resistive heater disposed in the temperature control passage.    
     
     
         23 . The processing chamber of  claim 22  further comprising: 
 a controller containing instructions, that when executed by the controller, cause a temperature of the passage formed through the liner to be controlled in a manner that regulates a temperature of a side of the liner facing the substrate support.    
     
     
         24 . The processing chamber of  claim 23 , wherein the instructions, when executed by the controller, further cause the temperature of the side of the liner facing the substrate support to be maintained at a temperature that minimizes flaking of material deposited on the liner.  
     
     
         25 . A processing chamber comprising; 
 a chamber body having an internal wall defining an internal volume;    a substrate support disposed in the internal volume;    a removable liner disposed in the internal volume adjacent to the wall and circumscribing the liner;    a temperature control passage formed the liner; and    a temperature control medium circulating through the liner.