Apparatus and methods for electrochemical processing of microelectronic workpieces

Abstract

An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.

1 - 90 . (canceled)  
   
   
       91 . A method of electrochemically processing microelectronic workpieces in a reaction vessel having a workpiece processing zone, the method comprising: 
 passing a processing fluid through a distributor in the reaction vessel by flowing the processing fluid through a first channel of the distributor and a second channel of the distributor;    receiving the processing fluid from the first channel in a first electrode compartment in the reaction vessel in which a first electrode is positioned and flowing the processing fluid through the first electrode compartment;    receiving the processing fluid from the second channel in a second electrode compartment in the reaction vessel in which a second electrode is positioned and flowing the processing fluid through the second electrode compartment;    applying a first electrical potential to the first electrode and applying a second electrical potential to the second electrode that is different than the first electrical potential; and    inhibiting matter in the processing fluid from passing out of the first and second electrode compartments and to the processing zone.    
   
   
       92 . The method of  claim 91 , further comprising changing at least one of the first electrical potential and/or the second electrical potential while processing a workpiece.  
   
   
       93 . The method of  claim 91 , further comprising directing a primary fluid flow through the reaction vessel toward the processing zone, and wherein the processing fluid flowing through the first and second channels of the distributor comprises a secondary flow of processing fluid that is separated from the primary fluid flow through at least a portion of the reaction vessel.  
   
   
       94 . The method of  claim 93  wherein the primary fluid flow comprises a catholyte and the secondary fluid flow comprises an anolyte.  
   
   
       95 . The method of  claim 94 , further comprising contacting a surface of a microelectronic workpiece with the catholyte.  
   
   
       96 . The method of  claim 95 , further comprising changing at least one of the first electrical potential and/or the second electrical potential while contacting the surface of the microelectronic workpiece with the catholyte.  
   
   
       97 . The method of  claim 91 , further comprising: 
 directing a primary fluid flow of a catholyte through the reaction vessel toward the processing zone;    contacting a surface of a microelectronic workpiece with the catholyte; and    separating the primary fluid flow of the catholyte from the processing fluid flowing through the first and second electrode compartments, wherein the processing fluid flowing through the first and second electrode compartment comprises an anolyte and defines a secondary fluid flow.    
   
   
       98 . The method of  claim 97  wherein separating the primary fluid flow from the secondary fluid flow comprises providing an ion-membrane in the reaction vessel located between the processing zone and at least one of the first and second electrode compartments.  
   
   
       99 . A method of electrochemically processing a microelectronic workpiece in a reaction vessel having a workpiece processing zone, the method comprising: 
 directing an electrolytic processing fluid through a portion of the reaction vessel by passing the processing fluid through an inlet in the reaction vessel, flowing a first portion of the processing fluid from the inlet and through a first channel in the reaction vessel to a first electrode compartment in the reaction vessel, and flowing a second portion of the processing fluid from the inlet and through a second channel in the reaction vessel to a second electrode compartment in the reaction vessel;    inhibiting matter in the processing fluid from passing out of the electrode compartments and flowing to the processing zone;    applying a first electrical potential to a first electrode in the first electrode compartment and applying a second electrical potential to a second electrode in the second electrode compartment, wherein the first electrical potential is different than the second electrical potential; and    subjecting a surface of a microelectronic workpiece to an electrical field established by the first and second electrodes.    
   
   
       100 . The method of  claim 99 , further comprising changing at least one of the first electrical potential and/or the second electrical potential while subjecting the workpiece to the electrical field.  
   
   
       101 . The method of  claim 99 , further comprising directing a primary fluid flow through the reaction vessel toward the processing zone, and wherein the processing fluid flowing through the first and second channels of the distributor comprises a secondary flow of processing fluid that is separated from the primary fluid flow through at least a portion of the reaction vessel.  
   
   
       102 . The method of  claim 101  wherein the primary fluid flow comprises a catholyte and the secondary fluid flow comprises an anolyte.  
   
   
       103 . The method of  claim 102  wherein subjecting the surface of the microelectronic workpiece to the electrical field established by the first and second electrodes comprises contacting the surface of a microelectronic workpiece with the catholyte.  
   
   
       104 . The method of  claim 103 , further comprising changing at least one of the first electrical potential and/or the second electrical potential while contacting the surface of the microelectronic workpiece with the catholyte.  
   
   
       105 . The method of  claim 99 , further comprising: 
 directing a primary fluid flow of a catholyte through the reaction vessel toward the processing zone; and    separating the primary fluid flow of the catholyte from the processing fluid flowing through the first and second electrode compartments, wherein the processing fluid flowing through the first and second electrode compartment comprises an anolyte and defines a secondary fluid flow.    
   
   
       106 . The method of  claim 105  wherein separating the primary fluid flow from the secondary fluid flow comprises providing an ion-membrane in the reaction vessel located between the processing zone and at least one of the first and second electrode compartments.  
   
   
       107 . A method of electrochemically processing a microelectronic workpiece in a reaction vessel having a workpiece processing zone, the method comprising: 
 directing a primary fluid flow through the reaction vessel and to the processing zone;    contacting a surface of a microelectronic workpiece with the primary fluid flow;    directing a secondary fluid flow through at least a portion of the reaction vessel such that a first portion of the secondary fluid flow passes through a first electrode compartment in the reaction vessel in which a first electrode is positioned and a second portion of the secondary fluid flow passes through a second electrode compartment in the reaction vessel in which a second electrode is positioned; and    inhibiting matter in the secondary fluid flow from passing into the primary fluid flow.    
   
   
       108 . The method of  claim 107 , further comprising: 
 applying a first electrical potential to the first electrode and applying a second electrical potential to the second electrode; and    changing at least one of the first electrical potential and/or the second electrical potential while processing a workpiece.    
   
   
       109 . The method of  claim 107  wherein the secondary fluid flow is separated from the primary fluid flow through at least a portion of the reaction vessel.  
   
   
       110 . The method of  claim 109  wherein the primary fluid flow comprises a catholyte and the secondary fluid flow comprises an anolyte.  
   
   
       111 . The method of  claim 107 , further comprising separating the primary fluid flow from the secondary fluid flow by providing an ion-membrane in the reaction vessel located between the processing zone and at least one of the first and second electrode compartments.