Laminated light-emitting diode display device and manufacturing method thereof

Abstract

A laminated light-emitting diode display device and a manufacturing method thereof are described. The laminated light-emitting diode display device has an insulator, a circuitry device placed on the insulator and having of a plurality of circuits interconnected with each other, and a plurality of SMT-type light-emitting diodes electrically connected to the circuits of the circuitry unit.

1 . A laminated light-emitting diode (LED) display device, comprising: 
 an insulator;    a circuitry unit placed on the insulator and consisting of a plurality of circuits interconnected with each other; and    a plurality of SMT-type light-emitting diodes electrically connected to the circuits of the circuitry unit.    
     
     
         2 . The display device in  claim 1 , wherein the insulator is made of a glass, a paper or a transparent plastic thin film.  
     
     
         3 . The display device in  claim 1 , wherein the circuitry unit is disposed on the insulator by printing, electroplating or chemical deposition.  
     
     
         4 . The display device in  claim 1 , wherein the light-emitting diodes are arranged as a character or a graphic.  
     
     
         5 . The display device in  claim 1 , wherein the circuits of the circuitry unit are connected to a plurality of resistors.  
     
     
         6 . The display device in  claim 1 , wherein the circuits of the circuitry unit are connected to a controlling integrated circuit (IC).  
     
     
         7 . The display device in  claim 1 , wherein the insulator, the circuitry unit and the light-emitting diodes are encapsulated by a protective thin film.  
     
     
         8 . The display device in  claim 1 , wherein the circuits of the circuitry unit are connected to a solar power device.  
     
     
         9 . A manufacturing method for a laminated light-emitting diode display device, comprising: 
 preparing an insulator;    placing a circuitry unit having a plurality of circuits on the insulator; and    electrically connecting a plurality of SMT-type light-emitting diodes to the circuits of the circuitry unit.    
     
     
         10 . The method in  claim 9 , wherein the insulator is made of a glass, a paper or a transparent plastic thin film.  
     
     
         11 . The method in  claim 9 , wherein the circuitry is formed on the insulator by printing, electroplating or chemical deposition.  
     
     
         12 . The method in  claim 9 , further comprising a step of electrically connecting a plurality of resistors to the circuits of the circuitry unit.  
     
     
         13 . The method in  claim 9 , further comprising a step of electrically connecting a controlling integrated circuit (IC) to the circuits of the circuitry unit.  
     
     
         14 . The method in  claim 9 , further comprising a step of encapsulating the insulator, the circuitry unit and the light-emitting diodes with a protective thin film.