Inventor · disambiguated record
Jonnie Chuang
Also filed as: CHUANG JONNIE
40 granted patents·32 pending applications·308 citations·filing 2003–2011
97Inventor score
Top patents by PatentIndex Score
72 records- 0193US7563641B2Laminated light-emitting diode display device and manufacturing method thereofHARVATEK CORP·Filed 2006·Granted Jul 21, 2009·21 cites·6 claims
- 0288US8137999B2Package for a light emitting diode and method for fabricating the sameWANG BILY·Filed 2011·Granted Mar 20, 2012·8 cites·8 claims
- 0388US7140753B2Water-cooling heat dissipation device adopted for modulized LEDsHARVATEK CORP·Filed 2004·Granted Nov 28, 2006·41 cites·3 claims
- 0484US7237938B2Backlight moduleHARVATEK CORP·Filed 2005·Granted Jul 3, 2007·14 cites·9 claims
- 0582US7671374B2LED chip package structure with a plurality of thick guiding pins and a method for manufacturing the sameHARVATEK CORP·Filed 2007·Granted Mar 2, 2010·9 cites·5 claims
- 0680US7671373B2LED chip package structure using a ceramic material as a substrate and a method for manufacturing the sameHARVATEK CORP·Filed 2007·Granted Mar 2, 2010·9 cites·17 claims
- 0780US7049639B2LED packaging structureHARVATEK CORP·Filed 2004·Granted May 23, 2006·33 cites·5 claims
- 0879US7211882B2LED package structure and method for making the sameHARVATEK CORP·Filed 2005·Granted May 1, 2007·8 cites·7 claims
- 0978US7834365B2LED chip package structure with high-efficiency light-emitting effect and method of packing the sameHARVATEK CORP·Filed 2007·Granted Nov 16, 2010·7 cites·11 claims
- 1078USD511328SLight-emitting diodeHARVATEK CORP·Filed 2004·Granted Nov 8, 2005·26 cites·1 claims
- 1175US7828464B2LED lamp structure and system with high-efficiency heat-dissipating functionHARVATEK CORP·Filed 2007·Granted Nov 9, 2010·11 cites·26 claims
- 1274US6784458B1Random partitionable dot matrix LED displayHARVATEK CORP·Filed 2003·Granted Aug 31, 2004·20 cites·9 claims
- 1372US6841934B2White light source from light emitting diodeHARVATEK CORP·Filed 2003·Granted Jan 11, 2005·22 cites·9 claims
- 1471US7803641B2Mold structure for packaging LED chips and method thereofHARVATEK CORP·Filed 2007·Granted Sep 28, 2010·5 cites·17 claims
- 1569US7804162B2Multi-wavelength white light-emitting structureHARVATEK CORP·Filed 2009·Granted Sep 28, 2010·4 cites·13 claims
- 1667US7485480B2Method of manufacturing high power light-emitting device package and structure thereofHARVATEK CORP·Filed 2006·Granted Feb 3, 2009·3 cites·10 claims
- 1766US7255463B2Lighting moduleHARVATEK CORP·Filed 2005·Granted Aug 14, 2007·8 cites·6 claims
- 1864US7142181B2Circuit board for large screen LED matrix array displayHARVATEK CORP·Filed 2003·Granted Nov 28, 2006·4 cites·2 claims
- 1963US7737635B2High efficiency white light emitting diode and method for manufacturing the sameHARVATEK CORP·Filed 2007·Granted Jun 15, 2010·2 cites·6 claims
- 2062US7662661B2Method of manufacturing a substrate structure for increasing cutting precision and strength thereofHARVATEK CORP·Filed 2005·Granted Feb 16, 2010·1 cites·5 claims
- 2161US7655997B2Wafer level electro-optical semiconductor manufacture fabrication mechanism and a method for the sameHARVATEK CORP·Filed 2005·Granted Feb 2, 2010·2 cites·11 claims
- 2260US6919584B2White light sourceHARVATEK CORP·Filed 2003·Granted Jul 19, 2005·9 cites·4 claims
- 2359US7951621B2LED chip package structure with high-efficiency light-emitting effect and method of packaging the sameHARVATEK CORP·Filed 2009·Granted May 31, 2011·1 cites·21 claims
- 2458USD509809SMetal base design for surface mount device LEDHARVATEK CORP·Filed 2004·Granted Sep 20, 2005·10 cites·1 claims
- 2557US7923745B2LED chip package structure with high-efficiency light-emitting effect and method of packaging the sameHARVATEK CORP·Filed 2007·Granted Apr 12, 2011·1 cites·10 claims
- 2657US2006038485A1Laminated light-emitting diode display device and manufacturing method thereofHARVATEK CORP·Filed 2004·Application pending·0 cites
- 2756US2006044796A1Mixing light boardHARVATEK CORP·Filed 2004·Application pending·0 cites
- 2855USD506187SMetal base design for surface mount device LED (light emitting diode)HARVATEK CORP·Filed 2004·Granted Jun 14, 2005·9 cites·1 claims
- 2954USD506732SLight-emitting diodeHARVATEK CORP·Filed 2004·Granted Jun 28, 2005·8 cites·1 claims
- 3053US8003413B2Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the sameHARVATEK CORP·Filed 2008·Granted Aug 23, 2011·0 cites·10 claims
- 3153US7824938B2Method for manufacturing an LED chip package structureHARVATEK CORP·Filed 2009·Granted Nov 2, 2010·0 cites·12 claims
- 3253US2009239319A1Package for a light emitting diode and a process for fabricating the sameWANG BILY·Filed 2009·Application pending·0 cites
- 3352US7749781B2Method for manufacturing a light-emitting diode having high heat-dissipating efficiencyHARVATEK CORP·Filed 2007·Granted Jul 6, 2010·1 cites·11 claims
- 3452US2009246897A1LED chip package structure and method for manufacturing the sameWANG BILY·Filed 2009·Application pending·0 cites
- 3551US7741648B2Penetrating hole type LED chip package structure using a ceramic material as a substrate and method for manufacturing the sameHARVATEK CORP·Filed 2007·Granted Jun 22, 2010·0 cites·9 claims
- 3651US2010271844A1Light-guiding structure with phosphor material layersHARVATEK CORP·Filed 2009·Application pending·0 cites
- 3751US2009014745A1Method of manufacturing high power light-emitting device package and structure thereofWANG BILY·Filed 2008·Application pending·0 cites
- 3850US7303984B2Semiconductor substrate structure and processing method thereofHARVATEK CORP·Filed 2005·Granted Dec 4, 2007·0 cites·5 claims
- 3950US2011170317A1Light-guiding structure with phosphor material layersWANG BILY·Filed 2011·Application pending·0 cites
- 4049US2007290220A1Package for a light emitting diode and a process for fabricating the sameWANG BILY·Filed 2006·Application pending·0 cites
- 4147US7842964B2Front and rear covering type LED package structure and method for packaging the sameHARVATEK CORP·Filed 2007·Granted Nov 30, 2010·0 cites·27 claims
- 4247US6885037B1IC package with stacked sheet metal substrateHARVATEK CORP·Filed 2003·Granted Apr 26, 2005·2 cites·8 claims
- 4347US2008012035A1LED chip package structure and method for manufacturing the sameWANG BILY·Filed 2006·Application pending·0 cites
- 4446US7276782B2Package structure for semiconductorHARVATEK CORP·Filed 2004·Granted Oct 2, 2007·4 cites·16 claims
- 4546US2006261455A1LED package structure and method making of the sameWANG BILY·Filed 2006·Application pending·0 cites
- 4646US2007297177A1Modular lamp structureWANG BILY·Filed 2006·Application pending·0 cites
- 4746US2006261488A1Wafer level electro-optical simiconductor manufacture fabrication mechanism and a method for the sameHARVATEK CORP·Filed 2006·Application pending·0 cites
- 4846US2012094407A1Wafer level led package structure for increasing light-emitting efficiency and heat-dissipating effect and method for manufacturing the sameWANG BILY·Filed 2011·Application pending·0 cites
- 4946US2007133209A1Electrical lamp apparatusHARVATEK CORP·Filed 2005·Application pending·0 cites
- 5044US7701124B2White light-emitting device having a cap layer formed from a mixture of silicon and a phosphor blendHARVATEK CORP·Filed 2007·Granted Apr 20, 2010·0 cites·11 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →