Package for a light emitting diode and a process for fabricating the same

Abstract

A package for an LED, comprises a metal substrate, at least one LED chip, and an insulative housing, wherein the metal substrate has a first terminal and a second terminal, and the first terminal is formed with a recess. The at least one LED chip is arranged in the recess of the first terminal of the metal substrate, wherein the chip is electrically connected with the first terminal and the second terminal of the metal substrate. Since the insulative housing caps the chip and the metal substrate, and the LED package can be reduced in size.

1 . A package for a light emitting diode, the package comprising:
 a metal substrate having a first terminal and a second terminal, said first terminal formed with a recess;   at least one light emitting diode chip arranged in the recess of the first terminal of the metal substrate, wherein the chip is electrically connected with the first terminal and the second terminal of the metal substrate; and   an insulative housing capping the chip and the metal substrate.   
   
   
       2 . A package for a light emitting diode according to  claim 1 , wherein the recess of the first terminal is closed on four inner surfaces thereof. 
   
   
       3 . A package for a light emitting diode according to  claim 1 , wherein the recess of the first terminal is closed on two inner surfaces thereof. 
   
   
       4 . A package for a light emitting diode according to  claim 1 , wherein the light emitting diode chip has a first and a second electrode, the first and the second electrodes are electrically connected with the first and the second terminals, respectively. 
   
   
       5 . A package for a light emitting diode according to  claim 1 , wherein the first and the second electrodes are positioned on a top and a bottom surface of the substrate. 
   
   
       6 . A package for a light emitting diode according to  claim 1 , wherein both the first and the second electrodes are positioned on a top surface of the substrate. 
   
   
       7 . A package for a light emitting diode according to  claim 1 , wherein the insulative housing is a light converging element. 
   
   
       8 . A process for fabricating a light emitting diode package, the process comprising the following steps:
 1) providing a metal substrate;   2) etching the metal substrate to form a first terminal, a second terminal, and a trench between the first and the second terminals, wherein the first terminal is formed with a recess; and   3) filling a synthetic polymer into the trench and the recess to cover the LED chip.   
   
   
       9 . The process for fabricating a light emitting diode package according to  claim 8 , further comprising a following step prior to the step of etching: electrograining the surface of the metal substrate, wherein the step of electrograining is obtained through a chemical process or a blasting process. 
   
   
       10 . The process for fabricating a light emitting diode package according to  claim 8 , wherein the recess of the first terminal is closed on four inner surfaces thereof. 
   
   
       11 . The process for fabricating a light emitting diode package according to  claim 8 , wherein the recess of the first terminal is closed on two inner surfaces thereof. 
   
   
       12 . The process for fabricating a light emitting diode package according to  claim 8 , wherein the step of filling a synthetic polymer is a mold pressing process. 
   
   
       13 . The process for fabricating a light emitting diode package according to  claim 8 , wherein the filling a synthetic polymer further comprises a step of capping the synthetic polymer with a light converging element.