Assignee
WANG BILY
TW·24 granted patents·38 pending applications·111 citations·filing 1998–2012
Top patents by PatentIndex Score
62 records- 0191US8398275B2Lamp head assembly and lighting lamp tubeWANG BILY·Filed 2011·Granted Mar 19, 2013·41 cites·20 claims
- 0288US8555492B2Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approachWANG BILY·Filed 2011·Granted Oct 15, 2013·9 cites·4 claims
- 0388US8137999B2Package for a light emitting diode and method for fabricating the sameWANG BILY·Filed 2011·Granted Mar 20, 2012·8 cites·8 claims
- 0478US8519458B2Light-emitting element detection and classification deviceWANG BILY·Filed 2011·Granted Aug 27, 2013·4 cites·14 claims
- 0573US8710387B2LED package chip classification systemWANG BILY·Filed 2011·Granted Apr 29, 2014·3 cites·16 claims
- 0672US8556463B2Simple detachable illumination structure and lamp tubeWANG BILY·Filed 2011·Granted Oct 15, 2013·5 cites·14 claims
- 0772US8079737B2Reflection-type light-emitting module with high heat-dissipating and high light-generating efficiencyWANG BILY·Filed 2009·Granted Dec 20, 2011·8 cites·17 claims
- 0871US8686310B2Packaged chip detection and classification deviceWANG BILY·Filed 2011·Granted Apr 1, 2014·2 cites·11 claims
- 0967US8263876B2Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the sameWANG BILY·Filed 2009·Granted Sep 11, 2012·0 cites·16 claims
- 1065US8623680B2LED chip package structure using sedimentation and method for making the sameWANG BILY·Filed 2011·Granted Jan 7, 2014·2 cites·12 claims
- 1164US8873920B2Light-guiding cover structureWANG BILY·Filed 2012·Granted Oct 28, 2014·2 cites·14 claims
- 1264US8138508B2LED chip package structure with different LED spacings and a method for making the sameWANG BILY·Filed 2008·Granted Mar 20, 2012·5 cites·22 claims
- 1362US8198800B2LED chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the sameWANG BILY·Filed 2008·Granted Jun 12, 2012·2 cites·3 claims
- 1453US2009239319A1Package for a light emitting diode and a process for fabricating the sameWANG BILY·Filed 2009·Application pending·0 cites
- 1553US2010127292A1Wafer level led package structure for increasing light-emitting efficiency and method for making the sameWANG BILY·Filed 2009·Application pending·0 cites
- 1652US2012009699A1Wafer level led package structure for increase light-emitting efficiency and method for making the sameWANG BILY·Filed 2011·Application pending·0 cites
- 1752US2009246897A1LED chip package structure and method for manufacturing the sameWANG BILY·Filed 2009·Application pending·0 cites
- 1851US8107720B2Detection system for detecting appearances of many electronic elements and methods of using the sameWANG BILY·Filed 2009·Granted Jan 31, 2012·1 cites·18 claims
- 1951US2009014745A1Method of manufacturing high power light-emitting device package and structure thereofWANG BILY·Filed 2008·Application pending·0 cites
- 2050US8421884B2GPS device with a display function and method for using the sameWANG BILY·Filed 2009·Granted Apr 16, 2013·0 cites·12 claims
- 2150US2010264435A1White light-emitting diode package structure for simplifying package process and method for making the sameWANG BILY·Filed 2009·Application pending·0 cites
- 2250US2011170317A1Light-guiding structure with phosphor material layersWANG BILY·Filed 2011·Application pending·0 cites
- 2350US2009224265A1LED chip package structure with a high-efficiency heat-dissipating substrate and method for making the sameWANG BILY·Filed 2008·Application pending·0 cites
- 2449US8162510B2LED chip package structure with multifunctional integrated chips and a method for making the sameWANG BILY·Filed 2008·Granted Apr 24, 2012·0 cites·2 claims
- 2549US2009206759A1Controlling system for illumination of a golf course and controlling method thereofWANG BILY·Filed 2008·Application pending·0 cites
- 2649US2009224266A1LED chip package structure applied to a backlight module and method for making the sameWANG BILY·Filed 2008·Application pending·0 cites
- 2749US2007290220A1Package for a light emitting diode and a process for fabricating the sameWANG BILY·Filed 2006·Application pending·0 cites
- 2848US8162514B2Illumination device with a fire-fighting functionWANG BILY·Filed 2008·Granted Apr 24, 2012·0 cites·18 claims
- 2948US2010006880A1Led chip package structure using sedimentation and method for making the sameWANG BILY·Filed 2009·Application pending·0 cites
- 3048US2006250343A1Drive circuit of LCD and method for the sameWANG BILY·Filed 2006·Application pending·0 cites
- 3148US2007282173A1Vital sign sending method and a sending apparatus thereofWANG BILY·Filed 2006·Application pending·0 cites
- 3248US2007273629A1Display drive circuit and drive method for the sameWANG BILY·Filed 2006·Application pending·0 cites
- 3347US2008012035A1LED chip package structure and method for manufacturing the sameWANG BILY·Filed 2006·Application pending·0 cites
- 3446US2006261455A1LED package structure and method making of the sameWANG BILY·Filed 2006·Application pending·0 cites
- 3546US2007297177A1Modular lamp structureWANG BILY·Filed 2006·Application pending·0 cites
- 3646US2012049212A1Led chip package structure with a high-efficiency heat-dissipating substrate and method for making the sameWANG BILY·Filed 2011·Application pending·0 cites
- 3746US2012122254A1White light-emitting diode package structure for simplifying package process and method for making the sameWANG BILY·Filed 2011·Application pending·0 cites
- 3846US2012094407A1Wafer level led package structure for increasing light-emitting efficiency and heat-dissipating effect and method for manufacturing the sameWANG BILY·Filed 2011·Application pending·0 cites
- 3945US8183065B2LED chip package structure with high-efficiency light emission by rough surfaces and method of making the sameWANG BILY·Filed 2010·Granted May 22, 2012·0 cites·26 claims
- 4045USD660259SStrip LEDWANG BILY·Filed 2011·Granted May 22, 2012·5 cites·1 claims
- 4145US2011304020A1Wafer level diode package structureWANG BILY·Filed 2011·Application pending·0 cites
- 4244US2008246397A1Manufacturing method of white light led and structure thereofWANG BILY·Filed 2007·Application pending·0 cites
- 4344US2008001816A1Portable wireless earphone apparatus with a global positioning systemWANG BILY·Filed 2006·Application pending·0 cites
- 4444US2008246185A1Composition of led frame body and manufacturing method thereofWANG BILY·Filed 2007·Application pending·0 cites
- 4544US2009096462A1Wafer testing methodWANG BILY·Filed 2008·Application pending·0 cites
- 4643US2006244825A1Multi-function communication and navigation system and method for using the sameWANG BILY·Filed 2006·Application pending·0 cites
- 4742US2006251355A1Photoelectric chip array package structureWANG BILY·Filed 2006·Application pending·0 cites
- 4842US2006252173A1Method for manufacturing photoelectric package having control chipWANG BILY·Filed 2006·Application pending·0 cites
- 4942US2006249656A1Manufacturing method for photoelectric package structure having two-layered substrate and control chipWANG BILY·Filed 2006·Application pending·0 cites
- 5041US2006249739A1Multi-wavelength white light emitting diodeWANG BILY·Filed 2006·Application pending·0 cites
Showing the top 50 of 62 patent records by PatentIndex Score.
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