LED package structure and method making of the same

Abstract

An LED package structure and a method for making the same are described. The LED package structure has at least one LED die, at least one metallic frame relating to the LED die, and an insulative body packaging the LED die and the metallic frame. The metallic frame has a first contact corresponding to the LED die and a second contact being relative to the first contact. The first and the second contacts inside the insulative body are electrically isolated from each other. The first contact has at least one recess around the LED die, and the second contact has at least one groove formed thereon.

1 - 6 . (canceled)  
   
   
       7 . A method for making an LED package structure, comprising: 
 preparing a metallic frame;    developing and etching the metallic frame as first and second contacts isolated from each other;    arranging an LED die on the first contact;    connecting a plurality of bonding wires between the LED die, the first contact and the second contact; and    packaging the LED die and the metallic frame via an insulative body;    wherein the first contact has a recess around the LED die, the second contact has a groove formed thereon, and the first and the second contacts are electrically isolated from each other by the insulative body.    
   
   
       8 . The method as claimed in  claim 7 , wherein the step for etching the metallic frame includes: 
 (a) etching the metallic frame to a first predetermined depth, so as to form the recess and the groove; and    (b) etching the metallic frame to a second predetermined depth, so as to separate the first contact from the second contact.    
   
   
       9 . The method as claimed in  claim 8 , wherein step (b) includes: 
 etching at least one through hole with the second predetermined depth in the metallic frame.    
   
   
       10 . The method as claimed in  claim 8 , wherein the insulative body is made of epoxy.