Microfeature workpiece processing system for, e.g., semiconductor wafer analysis

Abstract

The present disclosure suggests apparatus and methods that can be used to chemically process microfeature workpieces, e.g., semiconductor wafers. One implementation of the invention provides a method in which a surface of a microfeature workpiece is contacted with an etchant liquid. The wall of the processing chamber may be highly transmissive of an operative wavelength range of radiation, but the etchant liquid is absorptive of the operative wavelength range. The etchant liquid is heated by delivering radiation through the wall of a processing chamber. This permits processing chambers to be formed of materials (e.g., fluoropolymers) that cannot be used in conventional systems that must conduct heat through the wall of the processing chamber.

1 - 28 . (canceled)  
   
   
       29 . A microfeature workpiece processing system comprising: 
 a processing chamber having a wall and an interior adapted to hold an etchant liquid, the wall comprising a polymer that is substantially non-reactive with the etchant liquid;    an unheated support adapted to support a microfeature workpiece in the interior of the processing chamber for processing; and    a heating system positioned outside the processing chamber and adapted to selectively heat the etchant liquid, the heating system comprising a radiation source adapted to generate radiation in an operative wavelength range and oriented to direct the radiation through the wall of the processing chamber, the wall being substantially transparent to the operative wavelength range of the radiation and the etchant absorbing the operative wavelength range of the radiation.    
   
   
       30 . The microfeature workpiece processing system of  claim 29  wherein the processing chamber has an open configuration adapted for introducing a microfeature workpiece to the interior of the processing chamber and a processing configuration adapted for enclosing a microfeature workpiece in the interior for processing.  
   
   
       31 . The microfeature workpiece processing system of  claim 29  wherein the polymer comprises a fluoropolymer.  
   
   
       32 . The microfeature workpiece processing system of  claim 29  wherein the polymer comprises a fluoropolymer selected from the group consisting of perfluoroalkoxylalkane (PFA), polytetrafluoroethylene (PTFE), and fluorinated ethylene-propylene (FEP).  
   
   
       33 . The microfeature workpiece processing system of  claim 29  wherein the polymer comprises a first fluoropolymer and wherein the processing chamber includes a removable cover comprising a second fluoropolymer that is different from the first fluoropolymer.  
   
   
       34 . The microfeature workpiece processing system of  claim 29  wherein the operative wavelength is between about 700 nm and about 1 mm.  
   
   
       35 . The microfeature workpiece processing system of  claim 29  wherein the radiation source comprises an infrared radiation source.  
   
   
       36 . The microfeature workpiece processing system of  claim 29  wherein the radiation source is substantially the only heat source for heating the etchant liquid in the processing chamber.  
   
   
       37 . The microfeature workpiece processing system of  claim 29  wherein the radiation source is adapted to deliver radiation substantially uniformly across the surface of the microfeature workpiece.  
   
   
       38 . The microfeature workpiece processing system of  claim 29  wherein the radiation generated by the radiation source comprises the operative wavelength range and wavelengths outside the operative wavelength range.  
   
   
       39 . The microfeature workpiece processing system of  claim 29  further comprising a conduit for delivering the etchant liquid to the processing chamber prior to heating the etchant liquid with the heating system.  
   
   
       40 . The microfeature workpiece processing system of  claim 29  further comprising a programmable controller operatively coupled to the heating system, the controller being programmed to control the radiation source to heat the etchant in the processing chamber from a first temperature to a higher second temperature to promote etching.  
   
   
       41 . A microfeature workpiece processing system comprising: 
 a processing chamber having a wall and defining an interior in which a microfeature workpiece can be enclosed, the wall comprising a fluoropolymer;    a support adapted to support the microfeature workpiece in the interior of the processing chamber;    a conduit adapted to deliver a processing liquid to the interior of the processing chamber for contact with a surface of the microfeature workpiece;    an infrared radiation source positioned outside the processing chamber and oriented to direct infrared radiation through the wall of the processing chamber, the infrared radiation source comprising substantially the sole heat source for heating the processing liquid; and    a programmable controller, the controller being programmed to control the infrared radiation source to heat the processing liquid in the interior of the processing chamber from a first temperature to a higher second temperature to promote processing of the surface of the microfeature workpiece with the processing liquid.    
   
   
       42 . The microfeature workpiece processing system of  claim 41  wherein the processing liquid comprises an etchant liquid and the fluoropolymer is substantially non-reactive with the etchant liquid.  
   
   
       43 . The microfeature workpiece processing system of  claim 41  wherein the processing chamber has an open configuration adapted for introducing a microfeature workpiece to the interior of the processing chamber and a processing configuration adapted for enclosing a microfeature workpiece in the interior for processing.  
   
   
       44 . The microfeature workpiece processing system of  claim 41  wherein the fluoropolymer is selected from the group consisting of perfluoroalkoxylalkane (PFA), polytetrafluoroethylene (PTFE), and fluorinated ethylene-propylene (FEP).  
   
   
       45 . The microfeature workpiece processing system of  claim 41  wherein the processing fluid is an etchant liquid and the fluoropolymer is substantially non-reactive with the etchant liquid.  
   
   
       46 . The microfeature workpiece processing system of  claim 41  wherein the fluoropolymer of the wall comprises a first fluoropolymer and wherein the processing chamber includes a removable cover comprising a second fluoropolymer that is different from the first fluoropolymer.  
   
   
       47 . The microfeature workpiece processing system of  claim 41  wherein the infrared radiation source is adapted to deliver radiation substantially uniformly across the surface of the microfeature workpiece.  
   
   
       48 . The microfeature workpiece processing system of  claim 41  wherein the infrared radiation source is adapted generate radiation that comprises the infrared radiation and non-infrared radiation.