Data processing apparatus for semiconductor processing apparatus

Abstract

A semiconductor processing method in which a sample wafer is disposed inside of a chamber for processing and process data is detected by using a generated plasma generated which includes data concerning emission light generated. Information data corresponding to the processing data is selectively sent to one of first and second data storing devices in accordance with a predetermined condition. The selective sending of the information data includes selectively sending the information data to one of the first and second data storing devices until an amount of the information data which has been sent to and stored in the one of the storing devices reaches a predetermined amount of processing of the sample wafer as the predetermined condition, and thereafter selectively sending the information data corresponding to a succeeding process to the other of the first and second data storing devices.

1 . A semiconductor processing method, comprising the steps of: 
 disposing a sample wafer as a processing object inside of a chamber;    detecting process data during processing of the sample wafer which is performed by using a plasma generated inside of the chamber, the process data including data concerning emission light generated within the chamber during the processing; and    selectively sending information data corresponding to the processing data to one of first and second data storing devices in accordance with a predetermined condition;    wherein the step of selectively sending information data includes a substep of selectively sending the information data to one of the first and second data storing devices until an amount of the information data which has been sent to and stored in the one of the storing devices reaches a predetermined amount of processing of the sample wafer as the predetermined condition, and selectively sending the information data corresponding to a succeeding process to the other of the first and second data storing devices after the amount of the information data reaches the predetermined amount of processing.    
   
   
       2 . A semiconductor processing method according to  claim 1 , wherein in the substep, the information data is sent to the one of the first and second data storing devices until the information data of one of (a) a predetermined data and a time period, (b) a predetermined time period, and (c) a predetermined at least one lot of the sample wafer, has been sent to and stored in the one of the first and second data storing devices.  
   
   
       3 . A semiconductor processing method according to  claim 1 , wherein the second data storing device is configured so as to be able to read the information data which is stored therein and which is to be analyzed while the first data storing device stores the information data corresponding to the process data which is generated during processing of at least the sample wafer which is to be analyzed.  
   
   
       4 . A semiconductor processing method according to  claim 2 , wherein the second data storing device is configured so as to be able to read the information data which is stored therein and which is to be analyzed while the first data storing device stores the information data corresponding to the process data which is generated during processing of at least the sample wafer which is to be analyzed.  
   
   
       5 . A semiconductor processing method according to  claim 4 , further comprising the step of sending the information data to one of the first storing device and second data storing device through a first path and reading the information data thus stored through a second path.  
   
   
       6 . A semiconductor processing method according to  claim 5 , further comprising the steps of: 
 reading the information data stored in one of the first data storing device and the second data storing device and analyzing information data thus read; and    adjusting the processing of the sample wafer in accordance with a result of the analyzing.    
   
   
       7 . A semiconductor processing method according to  claim 4 , further comprising the steps of: 
 reading the information data stored in one of the first data storing device and the second data storing device and analyzing information data thus read; and    adjusting the processing of the sample wafer in accordance with a result of the analyzing.    
   
   
       8 . A semiconductor processing method according to  claim 3 , further comprising the step of: 
 sending the information data to one of the first storing device and second data storing device through a first path and reading the information data thus stored through a second path.    
   
   
       9 . A semiconductor processing method according to  claim 3 , further comprising the steps of: 
 reading the information data stored in one of the first data storing device and the second data storing device and analyzing information data thus read; and    adjusting the processing of the sample wafer in accordance with a result of the analyzing.