Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces

Abstract

Methods for forming a redistribution layer on microfeature workpieces, and microfeature workpieces having such a redistribution layer are disclosed herein. In one embodiment, a method includes constructing a dielectric structure on a microfeature workpiece having a substrate and a terminal carried by the substrate, and removing a section of the dielectric structure to form an opening. The opening has a first portion extending through the dielectric structure and exposing the terminal and a second portion extending to an intermediate depth in the dielectric structure. The second portion is spaced laterally apart from the terminal. The method further includes forming a conductive layer on the microfeature workpiece with the conductive layer in electrical contact with the terminal and disposed in the first and second portions of the opening.

1 - 31 . (canceled)  
     
     
         32 . A microfeature workpiece, comprising: 
 a substrate;    a microelectronic die formed in and/or on the substrate, the die including an integrated circuit and a terminal electrically coupled to the integrated circuit;    a dielectric structure including (a) a first surface facing the substrate, (b) a second surface opposite the first surface, and (c) an opening having a first portion aligned with the terminal and extending between the first and second surfaces and a second portion adjacent to the first portion and extending from the second surface to an intermediate depth; and    a conductive layer in the first and second portions of the opening and electrically coupled to the terminal.    
     
     
         33 . The microfeature workpiece of  claim 32  wherein the dielectric structure comprises a first dielectric layer on the substrate, a second dielectric layer on the first dielectric layer, and a third dielectric layer on the second dielectric layer.  
     
     
         34 . The microfeature workpiece of  claim 32  wherein the dielectric structure comprises a photoactive layer.  
     
     
         35 . The microfeature workpiece of  claim 32  wherein the second portion of the opening defines a recessed surface extending generally parallel to the second surface of the dielectric structure.  
     
     
         36 . The microfeature workpiece of  claim 32  wherein the second portion of the opening is spaced apart laterally from the first portion of the opening.  
     
     
         37 . The microfeature workpiece of  claim 32  wherein the opening further includes a third portion extending between the first and second portions.  
     
     
         38 . The microfeature workpiece of  claim 32  wherein the first portion has a first lateral dimension and the second portion has a second lateral dimension greater than the first lateral dimension.  
     
     
         39 . The microfeature workpiece of  claim 32  wherein the conductive layer is disposed across the second surface of the dielectric structure.  
     
     
         40 . The microfeature workpiece of  claim 32  wherein the conductive layer includes an external surface generally coplanar with the second surface of the dielectric structure.  
     
     
         41 . The microfeature workpiece of  claim 32  wherein the conductive layer includes an external surface recessed relative to the second surface of the dielectric structure.  
     
     
         42 . A microfeature workpiece, comprising: 
 a substrate;    a microelectronic die formed in and/or on the substrate, the die having an integrated circuit and a terminal electrically coupled to the integrated circuit;    a first dielectric layer on the substrate; and    a second dielectric layer on the first dielectric layer, the second dielectric layer including (a) an opening having a first portion aligned with the terminal and exposing a section of the first dielectric layer and a second portion adjacent to the first portion, (b) a first thickness spaced apart from the opening, and (c) a second thickness at the second portion of the opening, the first thickness being greater than the second thickness.    
     
     
         43 . The microfeature workpiece of  claim 42  wherein the second dielectric layer comprises a photoactive layer.  
     
     
         44 . The microfeature workpiece of  claim 42  wherein: 
 the second dielectric layer has a first surface attached to the first dielectric layer and a second surface opposite the first surface; and    the second portion of the opening defines a recessed surface extending generally parallel to the second surface of the second dielectric layer.    
     
     
         45 . The microfeature workpiece of  claim 42  wherein the second portion of the opening is spaced apart laterally from the first portion of the opening.  
     
     
         46 . The microfeature workpiece of  claim 42  wherein the opening further includes a third portion extending between the first and second portions.  
     
     
         47 . The microfeature workpiece of  claim 42  wherein the first portion of the opening has a first depth and the second portion of the opening has a second depth less than the first depth.  
     
     
         48 . The microfeature workpiece of  claim 42  wherein the first portion has a first lateral dimension and the second portion has a second lateral dimension greater than the first lateral dimension.