Contact assembly cleaning in an electrochemical mechanical processing apparatus

Abstract

Embodiments of the invention generally provide a method and apparatus for cleaning an electrical contact in an electrochemical mechanical planarizing apparatus. In one embodiment, a method for cleaning a contact assembly in an electroprocessing apparatus includes the steps of draining electrolyte from the contact assembly and flowing a rinsing fluid into the contact assembly. In another embodiment, a method for cleaning a contact assembly in an electroprocessing apparatus includes the steps of preventing fluid from passing between an interface of the contact assembly and a pad disposed outward thereof, flowing a rinsing fluid into the contact assembly and draining fluid flowing out of the contact assembly.

1 . A method for cleaning a contact assembly in an electroprocessing apparatus, comprising: 
 draining electrolyte from the contact assembly; and    flowing a rinsing fluid into the contact assembly.    
     
     
         2 . The method of  claim 1 , wherein flowing the rinsing fluid into the contact assembly comprises: 
 flowing deionized water into the contact assembly.    
     
     
         3 . The method of  claim 1 , wherein flowing the rinsing fluid into the contact assembly comprises: 
 providing an agent that restores an electric property of the contact assembly.    
     
     
         4 . The method of  claim 1  further comprising: 
 draining the rinsing fluid from the contact assembly; and    flowing electrolyte into the contact assembly.    
     
     
         5 . The method of  claim 1 , wherein draining electrolyte from the contact assembly further comprises: 
 draining a plenum disposed in a platen.    
     
     
         6 . The method of  claim 1 , wherein draining electrolyte from the contact assembly further comprises: 
 sucking the fluid out of the contact assembly.    
     
     
         7 . The method of  claim 1  further comprising: 
 rotating the platen while draining the rinsing fluid from the contact assembly.    
     
     
         8 . A method for cleaning a contact assembly in an electroprocessing apparatus, comprising: 
 preventing fluid from passing between an interface of the contact assembly and a pad disposed outward thereof;    flowing a rinsing fluid into the contact assembly; and    draining fluid flowing out of the contact assembly.    
     
     
         9 . The method of  claim 8 , wherein draining fluid flowing out of the contact assembly further comprises: 
 sucking the fluid through a passage formed radially outward of the contact assembly.    
     
     
         10 . The method of  claim 8  further comprising: 
 rotating the platen flowing the rinsing fluid into the contact assembly.    
     
     
         11 . The method of  claim 8  further comprising: 
 flowing electrolyte into the contact assembly to displace the rinsing fluid; and    removing the rinsing fluid.    
     
     
         12 . An electroprocessing apparatus, comprising: 
 a platen;    a processing pad disposed on the platen;    a contact assembly coupled to the platen; and    a drain formed through the platen and disposed radially outwards of the contact assembly.    
     
     
         13 . The apparatus of  claim 12 , wherein the drain further comprises: 
 a selectively sealable channel formed through the platen.    
     
     
         14 . The apparatus of  claim 12 , wherein the selectively sealable channel further comprises: 
 a valve arranged to selectively seal the channel.    
     
     
         15 . The apparatus of  claim 12  further comprising: 
 a polishing fluid channel formed through the platen to a surface of the processing pad fluid inward of the drain.    
     
     
         16 . The apparatus of  claim 15  further comprising: 
 a plenum fluidly coupled to the polishing fluid channel and the drain.    
     
     
         17 . The apparatus of  claim 16 , wherein the plenum is formed below the surface of the processing pad.  
     
     
         18 . The apparatus of  claim 17 , wherein the plenum is formed in the platen.  
     
     
         19 . The apparatus of  claim 12 , wherein the drain is formed through the processing pad.  
     
     
         20 . The apparatus of  claim 12  further comprising: 
 an electrolyte delivery passageway for providing electrolyte to a surface of the processing pad, wherein the drain and electrolyte delivery passageway are separate.