Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
Abstract
Provided are a composition for forming porous film which can form a porous film having practical mechanical strength in a simple and low cost process; a porous film and a method for forming the film; and an inexpensive, high-performing and highly reliable semiconductor device comprising the porous film inside. More specifically, provided is a composition for forming porous film, comprising a polymer which is obtainable by hydrolyzing and condensing one or more silane compounds represented by Formula (1), or preferably by hydrolyzing and co-condensing one or more silane compounds represented by Formula (1) and one more silane compounds represented by Formula (2), Formulas (1) and (2) being: (R 1 ) a Si(R 2 ) 4-a (1) (R 3 ) b Si(R 4 ) 4-b (2) Also provided is a method for forming porous film comprising a step of applying said composition on a substrate to form film and a step of transforming the film into porous film.
Claims
exact text as granted — not AI-modified1 - 9 . (canceled)
10 . A porous film prepared from a composition comprising:
an acid or base generator for generating an acid or a base by its thermal decomposition; and a polymer which is obtainable by hydrolyzing and condensing one or more silane compounds represented by Formula (1): (R 1 ) a Si(R 2 ) 4-a (1) wherein R 1 represents a straight chain or branched monovalent hydrocarbon having 6 to 20 carbons which may be substituted or unsubstituted and when there are R 1 s the R 1 s each may be independently same or different; R 2 represents a hydrolysable group and when there are R 2 s, the R 2 s each may be independently same or different; and a is an integer of 1 to 3.
11 . The porous film according to claim 10 wherein the film is an interlevel insulator film.
12 . A semiconductor device comprising an internal porous film formed by a composition comprising an acid or base generator for generating acid or base by its thermal decomposition and a polymer prepared from one or more silane compounds.
13 . The semiconductor device according to claim 12 wherein said polymer is obtainable prepared by hydrolyzing and condensing one or more silane compounds represented by Formula (1):
(R 1 ) a Si(R 2 ) 4-a (1)
wherein R 1 represents a straight chain or branched monovalent hydrocarbon having 6 to 20 carbons which may be substituted or unsubstituted and when there are R 1 s, the R 1 s each may be independently same or different; R 2 represents a hydrolysable group and when there are R 2 s, the R 2 s each may be independently same or different; and a is an integer of 1 to 3.
14 . The semiconductor device according to claim 12 wherein said polymer is prepared by hydrolyzing and co-condensing one or more silane compounds represented by Formula (1) and one more silane compounds represented by Formula (2), Formulas (1) and (2) being:
(R 1 ) a Si(R 2 ) 4-a (1) (R 3 ) b Si(R 4 ) 4-b (2)
wherein R 1 represents a straight chain or branched monovalent hydrocarbon having 6 to 20 carbons which may be substituted or unsubstituted and when there are R 1 s, the R 1 s each may be independently same or different; R 2 represents a hydrolysable group and when there are R 2 s, the R 2 s each may be independently same or different; and a is an integer of 1 to 3; R 3 represents a straight chain or branched monovalent hydrocarbon having 1 to 5 carbons which may be substituted or unsubstituted and when there are R 3 s, the R 3 s each may be independently same or different; R 4 represents a hydrolysable group and when there are R 4 s, the R 4 s each may be independently same or different; and b is an integer of 0 to 3.
15 . The semiconductor device according to claim 14 wherein said polymer is a silanol group-containing hydrolysate having number-average molecular weight of 100 or more, and in said polymer 30 to 80 mol % of structural units derived from said silane compound represented by Formula (2) is represented by Formula (3):
Si(OH) c (R 5 ) 4-c (3)
wherein R 5 represents a siloxane residue or R 3 , and c is an integer of 1 or 2.
16 . The semiconductor device according to claim 13 wherein the decomposition temperature of said acid or base generator is lower than the decomposition temperature of R 1 of said polymer.
17 . The semiconductor device according to claim 16 wherein said acid or base generator has a decomposition temperature of 250° C. or less.
18 . The semiconductor device according to claim 17 wherein said acid or base generator is a diazo compound represented by Formula (4) or (5):
wherein R and R′ each independently represents an alkyl group, an aromatic group, an aralkyl group or a fluoroalkyl group and R and R′ may be same or different.
19 . The semiconductor device according to claim 12 wherein said porous film is between metal interconnections in a same layer of multi-level interconnects, or is between upper and lower metal interconnection layers.
20 . The porous film according to claim 10 wherein the decomposition temperature of the acid or base generator is lower than the decomposition temperature of R 1 of said polymer.
21 . The porous film according to claim 20 wherein the acid or base generator has decomposition temperature of 250° C. or less.
22 . The porous film according to claim 21 wherein said acid or base generator is a diazo compound represented by Formula (4) or (5):
wherein R and R′ each independently represents an alkyl group, an aromatic group, an aralkyl group or a fluoroalkyl group and R and R′ may be same or different.
23 . A porous film comprising:
an acid or base for generating an acid or a base by its thermal decomposition; and a polymer which is prepared by hydrolyzing and co-condensing one or more silane compounds represented by Formula (1) and one more silane compounds represented by Formula (2), Formulas (1) and (2) being: (R 1 ) a Si(R 2 ) 4-a (1) (R 1 ) b Si(R 4 ) 4-b (2) wherein R 1 represents a straight chain or branched monovalent hydrocarbon having 6 to 20 carbons which may be substituted or unsubstituted and when there are R 1 s, the R 1 s each may be independently same or different; R 2 represents a hydrolysable group and when there are R 2 s, the R 2 s each may be independently same or different; and a is an integer of 1 to 3; R 3 represents a straight chain or branched monovalent hydrocarbon having 1 to 5 carbons which may be substituted or unsubstituted and when there are R 3 s, the R 3 s each may be independently same or different; R 4 represents a hydrolysable group and when there are R 4 s, the R 4 s each may be independently same or different; and b is an integer of 0 to 3.
24 . The porous film according to claim 23 wherein said polymer is a silanol group-containing hydrolysate having number-average molecular weight of 100 or more, and in said polymer 30 to 80 mol % of structural units derived from said silane compound represented by Formula (2) is represented by Formula (3):
Si(OH) c (R 5 ) 4-c (3)
wherein R 5 represents a siloxane residue or R 3 , and c is an integer of 1 or 2.
25 . The porous film according to claim 23 wherein the decomposition temperature of the acid or base generator is lower than the decomposition temperature of R 1 of said polymer.
26 . The porous film according to claim 25 wherein the acid or base generator has decomposition temperature of 250° C. or less.
27 . The porous film according to claim 26 wherein said acid or base generator is a diazo compound represented by Formula (4) or (5):
wherein R and R′ each independently represents an alkyl group, an aromatic group, an aralkyl group or a fluoroalkyl group and R and R′ may be same or different.
28 . The porous film according to claim 23 wherein the film is an interlevel insulator film.Join the waitlist — get patent alerts
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