Substrate delivery mechanism

Abstract

A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.

1 - 17 . (canceled)  
     
     
         18 . A substrate delivery method comprising: 
 transferring a substrate, held by a substrate holder of a holder mechanism, from said substrate holder to a substrate loader such that said substrate is received by said substrate loader,    wherein when said substrate is to be transferred from said substrate holder to said substrate loader, a substrate holder side of said substrate is put under positive pressure and a substrate loader side of said substrate is put under negative pressure.    
     
     
         19 . The substrate delivery method according to  claim 18 , wherein 
 said substrate loader side of said substrate is put under negative pressure by bringing said substrate loader into contact with said substrate and applying a negative pressure to through-holes formed in a substrate contact surface of said substrate loader.    
     
     
         20 . The substrate delivery method according to  claim 19 , further comprising: 
 after said substrate loader has received said substrate, applying a positive pressure to said through-holes formed in said substrate contact surface.    
     
     
         21 . The substrate delivery method according to  claim 20 , further comprising: 
 before said substrate is held by said substrate holder, or when said substrate holder side of said substrate is put under positive pressure, spraying a surfactant over said substrate contact surface and/or over a substrate holder side surface of said substrate.    
     
     
         22 . The substrate delivery method according to  claim 19 , further comprising: 
 before said substrate is held by said substrate holder, or when said substrate holder side of said substrate is put under positive pressure, spraying a surfactant over said substrate contact surface and/or over a substrate holder side surface of said substrate.    
     
     
         23 . The substrate delivery method according to  claim 18 , wherein 
 said substrate loader side of said substrate is put under negative pressure by bringing said substrate loader into contact with said substrate and applying a negative pressure to through-holes formed in a substrate contact surface of said substrate loader.    
     
     
         24 . The substrate delivery method according to  claim 23 , further comprising: 
 after said substrate loader has received said substrate, applying a positive pressure to said through-holes formed in said substrate contact surface.    
     
     
         25 . The substrate delivery method according to  claim 23 , further comprising: 
 before said substrate is held by said substrate holder, or when said substrate holder side of said substrate is put under positive pressure, spraying a surfactant over said substrate contact surface and/or over a substrate holder side surface of said substrate.    
     
     
         26 . The substrate delivery method according to  claim 18 , wherein said substrate holder comprises an elastic membrane as a substrate holding surface, and said substrate is to be pressed against a polishing surface by fluid pressure via said elastic membrane.  
     
     
         27 . The substrate delivery method according to  claim 18 , further comprising: 
 before said substrate is held by said substrate holder, or when said substrate holder side of said substrate is put under positive pressure, spraying a surfactant over a substrate holder side surface of said substrate.    
     
     
         28 . A substrate delivery method comprising: 
 when a sealed space defined below a substrate, held by a substrate holder of a holder mechanism, is exhausted, transferring said substrate from said substrate holder to a substrate loader such that said substrate is received by said substrate loader.    
     
     
         29 . A substrate delivery apparatus comprising: 
 a substrate holder for holding a substrate; and    a substrate loader for receiving the substrate from said substrate holder,    wherein said substrate holder is for putting the substrate under positive pressure and said substrate loader is for putting the substrate under negative pressure when the substrate is to be transferred from said substrate holder to said substrate loader.    
     
     
         30 . The substrate delivery apparatus according to  claim 29 , wherein 
 said substrate loader has through-holes to apply a negative pressure.    
     
     
         31 . The substrate delivery apparatus according to  claim 30 , wherein 
 said through-holes are for applying a positive pressure to the substrate after the substrate loader receives the substrate from said substrate holder.    
     
     
         32 . The substrate delivery apparatus according to  claim 31 , further comprising: 
 a spray mechanism for spraying a surfactant over a substrate contact surface of said substrate loader.