Substrate supports for use with programmable material consolidation apparatus and systems

Abstract

A programmed material consolidation apparatus includes at least one fabrication site and a material consolidation system associated with the at least one fabrication site. The at least one fabrication site may be configured to receive one or more fabrication substrates, such as semiconductor substrates. A machine vision system with a translatable or locationally fixed camera may be associated with the at least one fabrication site and the material consolidation system. A cleaning component may also be associated with the at least one fabrication site. The cleaning component may share one or more elements with the at least one fabrication site, or may be separate therefrom. The programmed material consolidation apparatus may also include a substrate handling system, which places fabrication substrates at appropriate locations of the programmed material consolidation apparatus.

1 . A programmable material consolidation apparatus, comprising: 
 a retention system including a support surface for supporting at least one substrate on or adjacent to which one or more objects are to be formed, the support surface including at least one feature configured to prevent lateral movement of the at least one substrate; and    a selective material consolidation system configured to form the one or more objects on the at least one substrate.    
   
   
       2 . The programmable material consolidation apparatus of  claim 1 , wherein the retention system further includes: 
 at least one raised element around at least a portion of a periphery of the support surface.    
   
   
       3 . The programmable material consolidation apparatus of  claim 2 , wherein the at least one raised element is configured to prevent lateral movement of the at least one substrate.  
   
   
       4 . The programmable material consolidation apparatus of  claim 2 , wherein the at least one raised element extends around an entire extent of the periphery of the support surface.  
   
   
       5 . The programmable material consolidation apparatus of  claim 4 , wherein the retention system comprises at least one access element comprising at least one recess in at least an interior portion of the at least one raised element for facilitating removal of the at least one substrate from a receptacle formed by the support surface and the at least one raised element of the retention system.  
   
   
       6 . The programmable material consolidation apparatus of  claim 2 , wherein the at least one raised element comprises cured photopolymer.  
   
   
       7 . The programmable material consolidation apparatus of  claim 2 , further comprising: 
 a planarization element configured to be drawn across a surface of unconsolidated material located over at least a portion of the at least one substrate and within an interior of a periphery defined by the at least one raised element.    
   
   
       8 . The programmable material consolidation apparatus of  claim 7 , wherein an upper surface of the at least one raised element defines a level at which the planarization element is translated across the surface of the unconsolidated material.  
   
   
       9 . The programmable material consolidation apparatus of  claim 7 , wherein the planarization element comprises a meniscus blade or an air knife.  
   
   
       10 . The programmable material consolidation apparatus of  claim 1 , wherein the retention system further includes: 
 at least one sealing element at the support surface thereof and positioned to underlie at least a periphery of the at least one substrate to prevent unconsolidated material from contacting a lower surface of the at least one substrate when the at least one substrate is positioned over the support surface.    
   
   
       11 . The programmable material consolidation apparatus of  claim 10 , wherein the at least one sealing element comprises a compressible, resilient member.  
   
   
       12 . The programmable material consolidation apparatus of  claim 10 , wherein the retention system further includes: 
 at least one pressure port formed in the support surface and located within an interior defined by the at least one sealing element; and    at least one pressure source in communication with the at least one pressure port.    
   
   
       13 . The programmable material consolidation apparatus of  claim 12 , wherein the at least one pressure port is configured and oriented to facilitate a circulating air flow over the support surface.  
   
   
       14 . The programmable material consolidation apparatus of  claim 1 , further comprising an ejection element configured to break a seal between the at least one substrate and the support surface and to facilitate removal of the at least one substrate from the retention system.  
   
   
       15 . The programmable material consolidation apparatus of  claim 14 , wherein the ejection element includes: 
 at least one recess formed in the support surface;    at least one piston configured to be retained within the at least one recess; and    at least one actuator associated with the at least one piston so as to cause at least a portion of the    at least one piston to exit the at least one recess and to protrude from the support surface.    
   
   
       16 . The programmable material consolidation apparatus of  claim 15 , wherein the ejection element includes: 
 at least one pressure port formed in the support surface; and    a positive pressure source in communication with the at least one pressure port.    
   
   
       17 . The programmable material consolidation apparatus of  claim 16 , wherein the at least one pressure port is configured and oriented to facilitate a circulating air flow over the support surface.