Integrated circuit coolant microchannel assembly with targeted channel configuration

Abstract

A microchannel structure has microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. At least one of the microchannels has a length extent and has a first section at a first location along the length extent and a second section at a second location along the length extent. The first section of the microchannel has a first aspect ratio and the second section is divided into at least two sub-channels. Each sub-channel has a respective second aspect ratio that is greater than the first aspect ratio.

1 - 7 . (canceled)  
   
   
       8 . An apparatus comprising: 
 a microchannel structure having microchannels formed therein, said microchannels to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant;    a cover positioned on the microchannel structure; and    a plate mounted on said cover, said plate having formed therein a right-angle passage to provide fluid communication between a first port on a lower horizontal surface of said plate and a second port on a vertical surface of said plate.    
   
   
       9 . The apparatus of  claim 8 , wherein said first port is aligned with an inlet formed in said cover.  
   
   
       10 . The apparatus of  claim 9 , wherein said right-angle passage is a first right-angle passage; 
 said plate also having formed therein a second right-angle passage to provide fluid communication between a third port on said lower horizontal surface of said plate and a fourth port on a vertical surface of said plate;    wherein said third port is aligned with an outlet formed in said cover.    
   
   
       11 . An apparatus comprising: 
 a microchannel structure having microchannels formed therein, said microchannels to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant;    a cover positioned on the microchannel structure and having formed therein a right-angle passage to provide fluid communication between a first port on a lower horizontal surface of said cover and a second port on a vertical surface of said cover.    
   
   
       12 . The apparatus of  claim 11 , wherein said right-angle passage is a first right-angle passage; 
 said cover also having formed therein a second right-angle passage to provide fluid communication between a third port on said lower horizontal surface of said cover and a fourth port on said vertical surface of said cover.    
   
   
       13 . The apparatus of  claim 11 , wherein said right-angle passage is a first right-angle passage and said vertical surface is a first vertical surface; 
 said cover also having formed therein a second right-angle passage to provide fluid communication between a third port on said lower horizontal surface of said cover and a fourth port on a second vertical surface of said cover, said second vertical surface being different from said first vertical surface.    
   
   
       14 . A microchannel assembly comprising: 
 a first member having a base and parallel walls extending normally from said base; and    a second member having a base and parallel walls extending normally from said base of said second member;    said second member bonded to said first member such that said parallel walls of said second member cooperate with said parallel walls of said first member to define microchannels, said microchannels to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant.    
   
   
       15 . The microchannel assembly of  claim 14 , wherein: 
 each of said parallel walls of said first member has a respective outer end;    each of said parallel walls of said second member has a respective outer end; and    the respective outer end of each of said parallel walls of said first member is bonded to the respective outer end of a respective one of said parallel walls of said second member.    
   
   
       16 . The microchannel assembly of  claim 14 , wherein: 
 each of said parallel walls of said first member has a respective outer end;    each of said parallel walls of said second member has a respective outer end;    the outer ends of the parallel walls of said first member are bonded to said base of said second member; and    the outer ends of the parallel walls of said second member are bonded to said base of said first member.    
   
   
       17 . A method comprising: 
 providing a first member having a base and parallel walls extending normally from said base;    providing a second member having a base and parallel walls extending normally from said base of said second member; and    bonding said first member to said second member to form a microchannel assembly.    
   
   
       18 . The method of  claim 17 , wherein: 
 each of said parallel walls of said first member has a respective outer end;    each of said parallel walls of said second member has a respective outer end; and    said bonding includes bonding the respective outer end of each of said parallel walls of said first member to the respective outer end of a respective one of said parallel walls of said second member.    
   
   
       19 . The method of  claim 18 , wherein: 
 each of said parallel walls of said first member has a respective outer end;    each of said parallel walls of said second member has a respective outer end; and    said bonding includes: 
 bonding the respective outer end of each of said parallel walls of said first member to the base of said second member; and  
 bonding the respective outer end of each of said parallel walls of said second member to the base of said first member.  
   
   
   
       20 . A method comprising: 
 supplying a microchannel assembly having at least one microchannel formed therein, said at least one microchannel to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant; and    flowing a coolant from opposite ends of said at least one microchannel to a central location of said at least one microchannel.    
   
   
       21 . The method of  claim 20 , wherein the coolant is flowed into said microchannel assembly via two inlets, including a first inlet located at a first end of the microchannel assembly and a second inlet located at a second end of the microchannel assembly, said second end opposite said first end.  
   
   
       22 . The method of  claim 21 , wherein the coolant is flowed out of said microchannel assembly via a plenum that is centrally located relative to said microchannel assembly.  
   
   
       23 . A method comprising: 
 supplying a microchannel assembly having at least one microchannel formed therein, said at least one microchannel to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant; and    flowing a coolant from a central location of said at least one microchannel to opposite ends of said at least one microchannel.    
   
   
       24 . The method of  claim 23 , wherein the coolant is flowed out of said microchannel assembly via two outlets, including a first outlet located at a first end of the microchannel assembly and a second outlet located at a second end of the microchannel assembly, said second end opposite said first end.  
   
   
       25 . The method of  claim 24 , wherein the coolant is flowed into said microchannel assembly via a plenum that is centrally located relative to said microchannel assembly.  
   
   
       26 . A microchannel assembly having microchannels formed therein, said microchannels to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant, said microchannel assembly having two inlets to allow coolant to flow into said microchannel assembly, said two inlets including a first inlet located at a first end of said microchannel assembly and a second inlet located at a second end of said microchannel assembly, said second end opposite said first end, said microchannel assembly also having an outlet to allow coolant to flow out of said microchannel assembly.  
   
   
       27 . The microchannel assembly of  claim 26 , wherein said outlet is between and substantially equidistant from said inlets.  
   
   
       28 . The microchannel assembly of  claim 27 , further comprising a plenum which extends across and above said microchannels at a central location of said microchannels to allow coolant to flow from said microchannels to said outlet.  
   
   
       29 . The microchannel assembly of  claim 27 , wherein said microchannels are formed in a microchannel structure, said assembly further comprising: 
 a cover positioned on the microchannel structure, said cover having at least one right-angle passage formed therein to allow fluid to flow to one of said inlets or from said outlet.    
   
   
       30 . A microchannel assembly having microchannels formed therein, said microchannels to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant, said microchannel assembly having two outlets to allow coolant to flow out of said microchannel assembly, said two outlets including a first outlet located at a first end of said microchannel assembly and a second outlet located at a second end of said microchannel assembly, said second end opposite said first end, said microchannel assembly also having an inlet to allow coolant to flow into said microchannel assembly.  
   
   
       31 . The microchannel assembly of  claim 30 , wherein said inlet is between and substantially equidistant from said outlets.  
   
   
       32 . The microchannel assembly of  claim 31 , further comprising a plenum which extends across and above said microchannels at a central location of said microchannels to allow coolant to flow from said inlet to said microchannels.  
   
   
       33 . The microchannel assembly of  claim 30 , wherein said microchannels are formed in a microchannel structure, said assembly further comprising: 
 a cover positioned on the microchannel structure, said cover having at least one right-angle passage formed therein to allow fluid to flow from one of said outlets or to said inlet.