US2008022254A1PendingUtilityA1

System and method for improving mask tape-out process

Assignee: TAIWAN SEMICONDUCTOR MFGPriority: Jul 20, 2006Filed: Apr 9, 2007Published: Jan 24, 2008
Est. expiryJul 20, 2026(~0 yrs left)· nominal 20-yr term from priority
G06F 30/39
41
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Claims

Abstract

An integrated circuit (IC) design system includes an IC design module for generating various portions of a mask layout according to a predefined specification of an integrated circuit, a mask module for assembling the various portions of the mask layout and forming a tape-out of the mask layout for mask manufacturing, and an e-LOP module operable to convert at least a subset of the various portions of the mask layout in a GDS format at a design stage prior to forming the tape-out.

Claims

exact text as granted — not AI-modified
1 . An integrated circuit (IC) design system, comprising:
 an IC design module to generate various portions of a mask layout according to a predefined specification of an integrated circuit;   a mask module for assembling the various portions of the mask layout and forming a tape-out of the mask layout for mask manufacturing; and   an e-LOP module operable to convert at least a subset of the various portions of the mask layout in an electronic format at a design stage prior to forming the tape-out.   
   
   
       2 . The IC design system of  claim 1 , wherein the design stage includes a design rule check (DRC). 
   
   
       3 . The IC design system of  claim 1 , wherein the electronic format includes a GDS format. 
   
   
       4 . The IC design system of  claim 1 , further comprising a viewing module for viewing the various portions of the mask layout after it has been converted by the e-LOP module. 
   
   
       5 . The IC design system of  claim 4 , wherein the viewing module is accessed via an Internet. 
   
   
       6 . A method of designing integrated circuit (IC) mask, comprising:
 generating an integrated circuit in various portions of a mask layout according to a predefined specification of an integrated circuit;   integrating the various portions of the mask layout into a tape-out of the mask layout for mask manufacturing; and   converting a subset of the various portions of the mask layout into a set of mask data in a GDS format prior to integrating the various portions of the mask layout.   
   
   
       7 . The method of  claim 2 , wherein the converting the subset of various portions of the mask layout comprises implementing various logical operations to the various portions of the mask layout. 
   
   
       8 . The method of  claim 2 , wherein the set of mask data is viewable through a GDS viewing tools. 
   
   
       9 . The method of  claim 2 , wherein the set of mask data is transferable through Internet.

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