High density cantilevered probe for electronic devices

Abstract

Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.

1 - 54 . (canceled)  
   
   
       55 . A structure for making electrical contact to an electronic devices contact locations comprising: 
 a substrate having a first electrical contact location thereon;    a first electrical conductor having a first end in electrical contact with said first contact location and a second end extending in a substantially perpendicular direction away therefrom;    providing a second electrical conductor;    said second end of said first electrical conductor terminating at a surface of and in electrical contact with a said second electrical conductor at a first electrical contact location of said second electrical conductor;    said second electrical conductor projecting away from said first electrical conductor;    said second electrical conductor comprising a raised contact tip conductor in a substantially perpendicular direction with respect to said second electrical conductor forming a cantilevered electrical contact structure end in electrical contact with said second electrical conductor, said raised contact tip end is adapted for electrically contacting said electronic device contact locations;    said second electrically conductive beam has a bottom surface at least a portion of which is disposed facing as spaced apart from said substrate.    
   
   
       56 . (canceled)  
   
   
       57 . A structure according to  claim 55 , further including a material that is a layer of flexible material which cantilevers from said second end on which said second electrical conductor is disposed.  
   
   
       58 . A structure according to  claim 57  wherein said material is compressible.  
   
   
       59 . A structure according to  claim 58 , wherein said material extends from said second end to said first contact location.  
   
   
       60 . A structure according to  claim 57 , wherein said second end extends through an opening in said material and is flattened to affix said first conductor to said material.  
   
   
       61 . A structure according to  claim 55 , wherein said first electrical conductor is a wire which is bonded at said first end to said first electrical contact location.  
   
   
       62 . A structure according to  claim 55 , wherein said second conductor is a wire which is ball bonded at said third end to said second contact location.  
   
   
       63 . A structure according to  claim 55 , wherein said raised contact tip is a plated protuberance on said second electrical conductor.  
   
   
       64 . A structure according to  claim 62 , wherein said first conductor is a wire ball bonded to said first electrical conductor at said first end and wherein said second end is flattened riveting said second end to said second electrical conductor.  
   
   
       65 . A structure according to  claim 62 , wherein said first conductor is a wire ball bonded to said first electrical conductor at said first end and wherein said second end is flattened riveting said second end to said material.  
   
   
       66 . A structure according to  claim 55 , further including moving said raised contact tip end into engagement with said electronic device contact locations.  
   
   
       67 . A method according to  claim 66 , further including electrically testing an electronic device through said electronic device contact locations.  
   
   
       68 . A method according to  claim 67 , wherein said substrate has a surface containing a plurality of electrical connectors for providing electrical signals to said ends raised contact top conductor.  
   
   
       69 . A method according to  claim 55 , wherein said first electrical contact location is on a first side of said substrate, said substrate has third electrical contact location on a second side, said third electrical contact location is in electrical communication with said first electrical contact location; said third electrical contact locations provide means for applying electrical signals to said electronic device contact locations.  
   
   
       70 . A structure according to  claim 55 , wherein a layer of elastomer material is added between said first surface of the substrate and the plurality of flexible electrically conductive beams, said layer of elastomeric material is patterned to be beneath said plurality of flexible electrically conductive beams.  
   
   
       71 . A structure according to  claim 55 , wherein a plated bump is added to at least one of said of flexible electrically conductive beams at said cantilevered end thereof.  
   
   
       72 . A structure according to  claim 55 , wherein a raised probe tip is formed at said cantilevered end of said flexible conductive beam, said raised probe tip extends outward from said cantilevered end, away from said first surface of said substrate.  
   
   
       73 . A structure according to  claim 72 , wherein said raised probe tips are plated pumps.  
   
   
       74 . A structure according to  claim 55 , wherein said structures is an electrical connector.