High density cantilevered probe for electronic devices

Abstract

Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.

1 - 55 . (canceled)  
   
   
       56 . A high density probe for making electrical contact with a plurality of raised, flat or recessed contacts on an integrated circuit device comprising: 
 a first substrate having a first surface;    said first surface having a plurality of contact locations;    a plurality of first short studs extending outward from said contact locations, away from said first surface on said substrate;    a plurality of flexible electrically conductive beams having a plurality of electrical contact locations corresponding to said plurality of said first short studs;    said plurality of flexible electrically conductive beams project from said contact location on said second electrical conductor as a cantilevered electrically conductive beam substantially parallel to said first surface of said substrate;    a raised tip end on a surface of said plurality of flexible electrically conductive beams;    said plurality of electrically conductive beams have a bottom surface at least a portion of which is disposed facing and spread apart from said substrate.    
   
   
       57 . A structure according to  claim 56 , wherein said raised tip ends are formed from a plurality of second ball bonds attached to said plurality of flexible electrically conductive beams with a plurality of second short studs extending outward from said second ball bonds, away from flexible electrically conductive beams.  
   
   
       58 . A structure according to  claim 56 , wherein said plurality of flexible electrically conductive beams are completely separated from adjacent beams.  
   
   
       59 . A structure according to  claim 56 , wherein the action of making electrical contact with said plurality of raised, flat or recessed contacts on said integrated circuit device causes said plurality of raised tip ends to wipe against said contacts on said integrated circuit device.  
   
   
       60 . A structure according to  claim 56 , wherein said substrate is selected from the group consisting of: 
 a multilayer ceramic substrates with thick film wiring,    a multilayer ceramic substrates with thin film wiring,    a metallized ceramic substrates with thin film wiring,    an epoxy glass laminate substrates with copper wiring and    a silicon substrate with thin film wiring.    
   
   
       61 . A structure according to  claim 56 , wherein said electrically conductive beam comprises a layer of flexible polymer material with said second electrical conductor disposed thereon.  
   
   
       62 . A method according to  claim 56 , wherein said raised contact tips are plated bumps disposed on said flexible electrically conductive beam.  
   
   
       63 . A structure according to  claim 56 , wherein a layer of elastomer material is added between said first surface of the substrate and the plurality of flexible electrically conductive beams, said layer of elastomeric material is patterned to be beneath said plurality of flexible electrically conductive beams.  
   
   
       64 . A structure according to  claim 56 , wherein a plated bump is added to at least one of said of flexible electrically conductive beams at said cantilevered end thereof.  
   
   
       65 . A structure according to  claim 56 , wherein a raised probe tip is formed at said cantilevered end of said flexible electrically conductive beam, said raised probe tip extends outward from said cantilevered end, away from said first surface of said substrate.  
   
   
       66 . A structure according to  claim 65 , wherein said raised probe tips are plated pumps.  
   
   
       67 . A structure according to  claim 56 , wherein said structures is an electrical connector.