High density cantilevered probe for electronic devices

Abstract

Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.

1 - 32 . (canceled)  
   
   
       33 . A method for fabricating a structure for making electrical contact to an electronic components contact locations comprising: 
 providing a substrate having a first electrical contact location thereon;    providing a first electrical conductor having a first end in electrical contact with said first contact location and a second end extending in a substantially perpendicular direction away therefrom;    providing a second electrical conductor;    said second end of said first electrical conductor terminating at a surface of and in electrical contact with a said second electrical conductor at a first electrical contact location of said second electrical conductor;    said second electrical conductor projecting away from said first electrical conductor;    providing to said second electrical conductor a raised contact tip conductor in a substantially perpendicular direction with respect to said second electrical conductor forming a cantilevered electrical contact structure end in electrical contact with said second electrical conductor, said raised contact tip end is adapted for electrically contacting said electronic component contact locations;    said second electrically conductive beam has a bottom surface at least a portion of which is disposed facing as spaced apart from said substrate.    
   
   
       34 . A method according to  claim 33 , wherein said method provides a material that is a layer of flexible material which cantilevers from said second end on which said second electrical conductor is disposed.  
   
   
       35 . A method according to  claim 33 . wherein said material is compressible.  
   
   
       36 . A method according to  claim 35 , wherein said material extends from said second end to said first contact location.  
   
   
       37 . A method according to  claim 34 , wherein said second end extends through an opening in said material and is flattened to affix said first conductor to said material.  
   
   
       38 . A method according to  claim 33 , wherein said first electrical conductor is a wire which is bonded at said first end to said first electrical contact location.  
   
   
       39 . A method according to  claim 33 , wherein said second conductor is a wire which is ball bonded at said third end to said second contact location.  
   
   
       40 . A method according to  claim 33 , wherein said raised contact tip is a plated protuberance on said second electrical conductor.  
   
   
       41 . A method according to  claim 39 , wherein said first conductor is a wire ball bonded to said first electrical conductor at said first end and wherein said second end is flattened riveting said second end to said second electrical conductor.  
   
   
       42 . A method according to  claim 39 , wherein said first conductor is a wire ball bonded to said first electrical conductor at said first end and wherein said second end is flattened riveting said second end to said material.  
   
   
       43 . A method according to  claim 33 , further including moving said raised contact tip end into engagement with said electronic component contact locations.  
   
   
       44 . A method according to  claim 43 , further including electrically testing an electronic component through said electronic component contact locations.  
   
   
       45 . A method according to  claim 44 , wherein said substrate has a surface containing a plurality of electrical connectors for providing electrical signals to said ends raised contact top conductor.  
   
   
       46 . A method according to  claim 33 , wherein said first electrical contact location is on a first side of said substrate, said substrate has third electrical contact location on a second side, said third electrical contact location is in electrical communication with said first electrical contact location; said third electrical contact locations provide means for applying electrical signals to said electronic component contact locations.  
   
   
       47 . A method for fabricating high density probe for making electrical contact with a plurality of raised, flat or recessed contacts on an integrated circuit component comprising: 
 providing a first substrate having a first surface;    providing said first surface having a plurality of contact locations;    providing a plurality of first short studs extending outward from said contact locations, away from said first surface on said substrate;    providing a plurality of flexible electrically conductive beams having a plurality of electrical contact locations corresponding to said plurality of said first short studs;    said plurality of flexible electrically conductive beams project from said contact location on said second electrical conductor as a cantilevered electrically conductive beam substantially parallel to said first surface of said substrate;    providing a raised tip end on a surface of said plurality of flexible electrically conductive beams;    said plurality of electrically conductive beams have a bottom surface at least a portion of which is disposed facing and spread apart from said substrate.    
   
   
       48 . A method according to  claim 47 , wherein said raised tip ends are formed from a plurality of second ball bonds attached to said plurality of flexible electrically conductive beams with a plurality of second short studs extending outward from said second ball bonds, away from flexible electrically conductive beams.  
   
   
       49 . A method according to  claim 47 , wherein said plurality of flexible electrically conductive beams are completely separated from adjacent beams.  
   
   
       50 . A method according to  claim 47 , wherein the action of making electrical contact with said plurality of raised, flat or recessed contacts on said integrated circuit component causes said plurality of raised tip ends to wipe against said contacts on said integrated circuit component.  
   
   
       51 . A method according to  claim 47 , wherein said substrate is selected from the group consisting of: 
 a multilayer ceramic substrates with thick film wiring,    a multilayer ceramic substrates with thin film wiring,    a metallized ceramic substrates with thin film wiring,    an epoxy glass laminate substrates with copper wiring and    a silicon substrate with thin film wiring.    
   
   
       52 . A method according to  claim 47 , wherein said electrically conductive beam comprises a layer of flexible polymer material with said second electrical conductor disposed thereon.  
   
   
       53 . A method according to  claim 47 , wherein said raised contact tips are plated bumps disposed on said flexible electrically conductive beam.