Chemical mechanical polishing with napped poromeric

Abstract

A method of polishing a substrate includes polishing a substrate with a generally linear polishing sheet, polishing the substrate with polishing pad composed of a napped poromeric material, and conditioning the polishing pad.

1 . A chemical mechanical polishing apparatus, comprising: 
 a first polishing station including 
 a movable platen,  
 a generally linear polishing sheet, and  
 a drive mechanism supporting the polishing sheet with a portion of the polishing sheet extending over the platen, the drive mechanism configured to incrementally advance the polishing sheet in a linear direction relative to the platen; and  
   a second polishing station including 
 a rotatable platen,  
 a polishing pad composed of a napped poromeric material attached to the rotatable platen; and  
 a conditioner having a conditioner head to condition the polishing pad.  
   
     
     
         2 . The apparatus of  claim 1 , wherein the conditioner includes an arm, and the conditioner head is suspended on the end of the arm.  
     
     
         3 . The apparatus of  claim 2 , wherein the conditioner includes a support assembly to rotate the arm so as sweep the conditioner head over the polishing pad.  
     
     
         4 . The apparatus of  claim 1 , wherein the conditioner head includes a conditioning disk having a side impregnated with diamonds for scraping the polishing pad.  
     
     
         5 . The apparatus of  claim 1 , wherein the polishing pad is embossed or stamped with a pattern.  
     
     
         6 . The apparatus of  claim 1 , wherein the polishing pad is attached to the rotatable platen by a pressure-sensitive adhesive layer.  
     
     
         7 . The apparatus of  claim 1 , wherein the polishing pad consists of a single layer.  
     
     
         8 . A method of polishing a substrate, comprising: 
 polishing a substrate with a generally linear polishing sheet;    polishing the substrate with polishing pad composed of a napped poromeric material; and    conditioning the polishing pad.    
     
     
         9 . The method of  claim 8 , wherein conditioning the polishing pad includes scraping the napped poromeric material with diamonds.  
     
     
         10 . The method of  claim 9 , wherein conditioning the polishing pad includes sweeping the conditioner head over the polishing pad.  
     
     
         11 . The method of  claim 8 , wherein polishing the substrate with the polishing pad includes rotating the polishing pad.  
     
     
         12 . The method of  claim 8 , wherein polishing the substrate with the polishing pad occurs after polishing the substrate with the polishing sheet.  
     
     
         13 . The method of  claim 8 , wherein polishing the substrate with the polishing pad includes distributing slurry with a pattern embossed or stamped on the polishing pad.  
     
     
         14 . The method of  claim 8 , wherein the polishing pad consists of a single layer.  
     
     
         15 . An assembly for a chemical mechanical polisher, comprising: 
 a roller;    a first generally linear polishing sheet wound around the roller;    a second generally linear polishing sheet wound around the roller and spaced apart from the first polishing sheet.    
     
     
         16 . The assembly of  claim 15 , wherein the first polishing sheet and the second polishing sheet are formed of the same polishing material.  
     
     
         17 . The assembly of  claim 15 , wherein the first polishing sheet and the second polishing sheet are formed of different polishing materials.