High density integrated circuit apparatus, test probe and methods of use thereof

Abstract

The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving mi array of wires disposed in the elastomer and in electrical contact with the space transformer. The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

1 - 48 . (canceled) 
   
   
       49 . A structure comprising:
 a plurality of first substrates adapted to be mounted to a second substrate;   each of the first substrate having two opposite surfaces;   free standing flexible conductors extending from one of the two surfaces shaped so that a free end thereof laterally movers when pressed against a surface;   terminals on an other of the two opposite surfaces;   means, within each of the first substrates, for connecting the terminals to the contacts; and   the plurality of the first substrates are mounted on to the second substrate.   
   
   
       50 - 59 . (canceled) 
   
   
       60 . A probe card structure according to  claim 49  wherein said freestanding flexible conductors are shaped to flex and wipe the area of the electronic device, the freestanding flexible conductors substantially compliantly respond when the flexible contact elements are withdrawn from contacting the electronic component. 
   
   
       61 . (canceled) 
   
   
       62 . A structure according to  claim 60  wherein the flexible contact elements can be repeatably assembled and disassembled so that said flexible contact element can recontact, reflex and rewipe the area of the electronic device. 
   
   
       63 . (canceled) 
   
   
       64 . A structure according to  claim 60  wherein the rewiped area is an area selected from the group consisting of an area of the same or a different electronic device. 
   
   
       65 . A structure according to  claim 60 , wherein the electronic device is a semiconductor wafer. 
   
   
       66 . (canceled) 
   
   
       67 . A structure according to  claim 60 , wherein there are electrical connections between the second substrates and the first substrate. 
   
   
       68 . A structure according to  claim 60 , wherein the first substrate is a space transformer. 
   
   
       69 . A structure according to  claim 60 , wherein the electronic device is a semiconductor wafer; and the flexible contact elements of the second substrate contact individual semiconductor dies on the semiconductor wafer. 
   
   
       70 . A structure according to  claim 60 , wherein the electronic device is a semiconductor wafer; and the flexible contact elements of the second substrate contacts at least one integrated circuit on the semiconductor wafer. 
   
   
       71 . A structure according to  claim 60 , wherein the first substrate with the second substrate mounted thereto is mounted to an electrical testing apparatus by a plurality of electrical connections. 
   
   
       72 . A structure according to  claim 60 , further including plurality of groups of said plurality of the flexible electrical contact elements. 
   
   
       73 . A structure according to  claim 60 , wherein there is selected from the group consisting of a least one of said second substrates mounted to said first substrate and a plurality of said second substrates mounted to said first substrate 
   
   
       74 . (canceled) 
   
   
       75 . A structure according to  claim 49  wherein said free standing flexible conductors comprise a coating. 
   
   
       76 . A structure according to  claim 75  wherein said coating is selected from the group consisting of Au, Cr, Co, Ni and Pd. 
   
   
       77 . A structure according to  claim 76  wherein said free standing flexible conductor comprises gold, gold alloy, copper, copper alloy, aluminum, nickel, palladium and platinum. 
   
   
       78 . A structure comprising:
 at least one first substrate adapted to be mounted to a second substrate;   said at least one first substrate has two opposite surfaces;   free standing flexible conductors extending from one of the two surfaces shaped so that a free end thereof laterally movers when pressed against a surface;   terminals on an other of the two opposite surfaces;   means, within each of the first substrates, for connecting the terminals to the contacts;   said at least one first substrate is mounted on to the second substrate; and   aligning the second substrate to the first substrate to align the flexible contact elements to the electronic component.   
   
   
       79 . A structure according to  claim 78  wherein said freestanding flexible conductors comprise a coating. 
   
   
       80 . A structure according to  claim 79  wherein said coating is selected from the group consisting of Au, Cr, Co, Ni and Pd. 
   
   
       81 . A structure according to  claim 80  wherein said free standing flexible conductor comprises gold, gold alloy, copper, copper alloy, aluminum, nickel, palladium and platinum. 
   
   
       82 . A structure according to  claim 78  wherein said freestanding flexible conductors are shaped to flex and wipe the area of the electronic device, the freestanding flexible conductors substantially compliantly respond when the flexible contact elements are withdrawn from contacting the electronic component. 
   
   
       83 . A structure comprising:
 a first substrate adapted to be mounted to a second substrate;   the first substrate having two opposite surfaces;   free standing flexible conductors extending from one of the two surfaces shaped so that a free end thereof laterally movers when pressed against a surface;   terminals on an other of the two opposite surfaces;   means, within the first substrate, for connecting the terminals to the contacts; and   the plurality of the first substrates are mounted on to the second substrate.   
   
   
       84 . A structure according to  claim 83  wherein said freestanding flexible conductors comprise a coating. 
   
   
       85 . A structure according to  claim 84  wherein said coating is selected from the group consisting of Au, Cr, Co, Ni and Pd. 
   
   
       86 . A structure according to  claim 85  wherein said free standing flexible conductor comprises gold, gold alloy, copper, copper alloy, aluminum, nickel, palladium and platinum. 
   
   
       87 . A structure according to  claim 83  wherein said freestanding flexible conductors are shaped to flex and wipe the area of the electronic device, the freestanding flexible conductors substantially compliantly respond when the flexible contact elements are withdrawn from contacting the electronic component. 
   
   
       88 - 90 . (canceled)