Apparatus and methods for electrochemical processing of microelectronic workpieces

Abstract

An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.

1 - 90 . (canceled)  
   
   
       91 . A method of electrochemically processing a microelectronic workpiece in a reaction vessel having a workpiece processing zone, the method comprising: 
 directing a first fluid flow of one of a catholyte or an anlolyte through a first portion of the reaction vessel and to the processing zone;    contacting a surface of a microelectronic workpiece with the first fluid flow;    directing a second fluid flow of the other of the catholyte or the anolyte through a first electrode compartment in the reaction vessel in which a first electrode is positioned and through a second electrode compartment in the reaction vessel in which a second electrode is positioned;    inhibiting the first fluid flow from flowing into the second fluid flow; and    passing selected ions between the first and second fluid flows.    
   
   
       92 . The method of  claim 91 , further comprising: 
 applying a first electrical potential to the first electrode and applying a second electrical potential to the second electrode; and    changing at least one of the first electrical potential and/or the second electrical potential while the surface of the workpiece contacts the first fluid flow.    
   
   
       93 . The method of  claim 91  wherein inhibiting the first fluid flow from flowing into the second fluid flow comprises positioning an interface member between the first fluid flow and the second fluid flow.  
   
   
       94 . The method of  claim 93  wherein the interface member comprises a filter in the reaction vessel between the processing zone and at least one of the first and second electrode compartments.  
   
   
       95 . The method of  claim 93  wherein: 
 the first fluid flow comprises a catholyte and the second fluid flow comprises an anolyte;    the interface member comprises a porous filter; and    passing ions between the first fluid flow and the second fluid flow comprises passing ions and fluids through the porous filter.    
   
   
       96 . The method of  claim 93  wherein the interface member comprises an ion-membrane in the reaction vessel located between the processing zone and at least one of the first and second electrode compartments.  
   
   
       97 . The method of  claim 93  wherein: 
 the first fluid flow comprises a catholyte and the second fluid flow comprises an anolyte;    the interface member comprises an ion-membrane in the reaction vessel between the processing zone and at least one of the first and second electrode compartments; and    passing ions between the first fluid flow and the second fluid flow comprises moving ions through the ion-membrane while preventing fluids from crossing the membrane.    
   
   
       98 . A method of electrochemically processing a microelectronic workpiece in a reaction vessel having a workpiece processing zone, the method comprising: 
 directing a first fluid flow of a catholyte through an upper portion of the reaction vessel and to the processing zone;    contacting a surface of a microelectronic workpiece with the first fluid flow;    directing a second fluid flow of an anolyte through a first electrode compartment in the reaction vessel in which a first electrode is positioned and through a second electrode compartment in the reaction vessel in which a second electrode is positioned;    preventing the first fluid flow from contacting the second fluid flow; and    passing selected ions between the first and second fluid flows.    
   
   
       99 . The method of  claim 98 , further comprising: 
 applying a first electrical potential to the first electrode and applying a second electrical potential to the second electrode; and    changing at least one of the first electrical potential and/or the second electrical potential while the surface of the workpiece contacts the first fluid flow.    
   
   
       100 . The method of  claim 98  wherein preventing the first fluid flow from contacting the second fluid flow comprises positioning an interface member between the first fluid flow and the second fluid flow.  
   
   
       101 . The method of  claim 100  wherein the interface member comprises an ion-membrane in the reaction vessel located between the processing zone and at least one of the first and second electrode compartments.  
   
   
       102 . The method of  claim 100  wherein: 
 the first fluid flow comprises a catholyte and the second fluid flow comprises an anolyte;    the interface member comprises an ion-membrane in the reaction vessel between the processing zone and at least one of the first and second electrode compartments; and    passing ions between the first fluid flow and the second fluid flow comprises moving ions through the ion-membrane while preventing fluids from crossing the membrane.    
   
   
       103 . A method of electrochemically processing a microelectronic workpiece in a reaction vessel having a workpiece processing zone, the method comprising: 
 directing a first fluid flow of a catholyte through an upper portion of the reaction vessel and to the processing zone;    contacting a surface of a microelectronic workpiece with the first fluid flow;    directing a second fluid flow of an anolyte through a first electrode compartment in the reaction vessel in which a first electrode is positioned and through a second electrode compartment in the reaction vessel in which a second electrode is positioned;    establishing an electrical field in the first fluid flow having a first field component generated by the first electrode and a second field component generated by the second electrode; and    passing selected ions across an ion-membrane between the catholyte and the anolyte.    
   
   
       104 . The method of  claim 103 , further comprising: 
 applying a first electrical potential to the first electrode and applying a second electrical potential to the second electrode; and    changing at least one of the first electrical potential and/or the second electrical potential while the surface of the workpiece contacts the first fluid flow.    
   
   
       105 . The method of  claim 103  wherein passing ions across the ion-membrane comprises moving ions through the ion-membrane while preventing fluids from passing thought the membrane.