US2008241992A1PendingUtilityA1

Method of assembling chips

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Assignee: MEGICA CORPPriority: Mar 5, 2001Filed: Apr 25, 2008Published: Oct 2, 2008
Est. expiryMar 5, 2021(expired)· nominal 20-yr term from priority
Inventors:Mou-Shiung LinShih-Hsiung Lin
H10W 90/756H10W 90/754H10W 90/736H10W 90/734H10W 90/724H10W 90/722H10W 74/15H10W 74/00H10W 72/9415H10W 72/01271H10W 72/01255H10W 72/01235H10W 72/01215H10W 72/951H10W 72/884H10W 72/536H10W 72/255H10W 72/252H10W 72/223H10W 72/222H10W 72/075H10W 72/073H10W 72/072H10W 72/29H10W 70/681H10W 90/00H10W 70/60H10W 72/20
54
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Claims

Abstract

A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method for fabricating a chip package, comprising:
 providing a copper pillar on a chip and a gold-containing layer over said copper pillar, wherein said gold-containing layer has a thickness less than a thickness of said copper pillar;   screen printing a tin-containing layer on a substrate; and   joining said gold-containing layer with said tin-containing layer using a process comprising a reflow process.   
     
     
         2 . The method of  claim 1 , wherein said screen printing said tin-containing layer is performed with said tin-containing layer comprising silver. 
     
     
         3 . The method of  claim 1 , wherein said screen printing said tin-containing layer is performed with said tin-containing layer comprising silver and copper. 
     
     
         4 . The method of  claim 1 , wherein said screen printing said tin-containing layer is performed with said tin-containing layer comprising lead. 
     
     
         5 . The method of  claim 1 , wherein said screen printing said tin-containing layer is performed with said tin-containing layer mixed with a flux. 
     
     
         6 . The method of  claim 1 , wherein said screen printing said tin-containing layer is performed with said tin-containing layer having a thickness less than said thickness of said copper pillar. 
     
     
         7 . The method of  claim 1 , wherein said thickness of said copper pillar is greater than a transverse dimension of said copper pillar. 
     
     
         8 . A method for fabricating a chip package, comprising:
 providing a copper pillar on a chip and a first tin-containing layer over said copper pillar, wherein said first tin-containing layer has a thickness less than a thickness of said copper pillar;   screen printing a second tin-containing layer on a substrate; and   joining said first tin-containing layer with said second tin-containing layer using a process comprising a reflow process.   
     
     
         9 . The method of  claim 8 , wherein said screen printing said second tin-containing layer is performed with said second tin-containing layer comprising silver. 
     
     
         10 . The method of  claim 8 , wherein said screen printing said second tin-containing layer is performed with said second tin-containing layer comprising silver and copper. 
     
     
         11 . The method of  claim 8 , wherein said screen printing said second tin-containing layer is performed with said second tin-containing layer comprising lead. 
     
     
         12 . The method of  claim 8 , wherein said screen printing said second tin-containing layer is performed with said second tin-containing layer mixed with a flux. 
     
     
         13 . The method of  claim 8 , wherein said screen printing said second tin-containing layer is performed with said second tin-containing layer having a thickness less than said thickness of said copper pillar. 
     
     
         14 . The method of  claim 8 , wherein said thickness of said copper pillar is greater than a transverse dimension of said copper pillar. 
     
     
         15 . The method of  claim 8 , wherein said providing said first tin-containing layer is performed with said first tin-containing layer comprising silver. 
     
     
         16 . A method for fabricating a chip package, comprising:
 providing a copper pillar on a chip and a gold-containing layer over said copper pillar, wherein said gold-containing layer has a thickness less than a thickness of said copper pillar;   providing a substrate with a tin-containing layer; and   joining said gold-containing layer with said tin-containing layer.   
     
     
         17 . The method of  claim 16 , wherein said joining said gold-containing layer with said tin-containing layer comprises a reflow process. 
     
     
         18 . The method of  claim 16 , wherein said providing said substrate is performed with said tin-containing layer comprising silver. 
     
     
         19 . The method of  claim 16 , wherein said providing said substrate is performed with said tin-containing layer having a thickness less than said thickness of said copper pillar. 
     
     
         20 . The method of  claim 16 , wherein said thickness of said copper pillar is greater than a transverse dimension of said copper pillar.

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