Inventor · disambiguated record
Shih-Hsiung Lin
Also filed as: LIN I SHIH-HSIUNG · LIN SHIH-HSIUNG
29 granted patents·8 pending applications·646 citations·filing 1996–2024
97Inventor score
Top patents by PatentIndex Score
37 records- 0196US7242099B2Chip package with multiple chips connected by bumpsMEGICA CORP·Filed 2003·Granted Jul 10, 2007·175 cites·82 claims
- 0295US8021921B2Method of joining chips utilizing copper pillarMEGICA CORP·Filed 2008·Granted Sep 20, 2011·33 cites·20 claims
- 0393US8421222B2Chip package having a chip combined with a substrate via a copper pillarLIN MOU-SHIUNG·Filed 2011·Granted Apr 16, 2013·11 cites·18 claims
- 0493US7208834B2Bonding structure with pillar and capMEGICA CORP·Filed 2004·Granted Apr 24, 2007·59 cites·32 claims
- 0592US11955506B2Fabrication method of display deviceAU OPTRONICS CORP·Filed 2021·Granted Apr 9, 2024·2 cites·16 claims
- 0692US8294279B2Chip package with dam bar restricting flow of underfillCHEN KE-HUNG·Filed 2006·Granted Oct 23, 2012·43 cites·19 claims
- 0792US6784087B2Method of fabricating cylindrical bonding structureMEGIC CORP·Filed 2002·Granted Aug 31, 2004·60 cites·23 claims
- 0891US8461679B2Method for fabricating circuit componentLEE JIN-YUAN·Filed 2011·Granted Jun 11, 2013·9 cites·22 claims
- 0991US8368193B2Chip packageMEGICA CORP·Filed 2011·Granted Feb 5, 2013·6 cites·39 claims
- 1090US8044475B2Chip packageMEGICA CORP·Filed 2009·Granted Oct 25, 2011·11 cites·53 claims
- 1190US7960270B2Method for fabricating circuit componentMEGICA CORP·Filed 2007·Granted Jun 14, 2011·14 cites·9 claims
- 1290US7382005B2Circuit component with bump formed over chipMEGICA CORP·Filed 2005·Granted Jun 3, 2008·15 cites·44 claims
- 1390US6207475B1Method for dispensing underfill and devices formedIND TECH RES INST·Filed 1999·Granted Mar 27, 2001·128 cites·12 claims
- 1486US7508059B2Stacked chip package with redistribution linesMEGICA CORP·Filed 2006·Granted Mar 24, 2009·12 cites·20 claims
- 1586US7495304B2Chip packageMEGICA CORP·Filed 2006·Granted Feb 24, 2009·7 cites·20 claims
- 1683US8426958B2Stacked chip package with redistribution linesLIN MOU-SHIUNG·Filed 2011·Granted Apr 23, 2013·5 cites·26 claims
- 1782US7960272B2Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packagingMEGICA CORP·Filed 2007·Granted Jun 14, 2011·9 cites·38 claims
- 1881US7973401B2Stacked chip package with redistribution linesMEGICA CORP·Filed 2008·Granted Jul 5, 2011·8 cites·23 claims
- 1979US8440272B2Method for forming post passivation Au layer with clean surfaceLIN MOU-SHIUNG·Filed 2007·Granted May 14, 2013·9 cites·20 claims
- 2077US8232192B2Process of bonding circuitry componentsLIN MOU-SHIUNG·Filed 2005·Granted Jul 31, 2012·8 cites·67 claims
- 2171US12490562B2Display panel comprising multiple pixel structures including repaired pixel structureAUO CORP·Filed 2022·Granted Dec 2, 2025·0 cites·14 claims
- 2269US12433081B2Display device, light-emitting diode substrate, and fabrication method of display deviceAU OPTRONICS CORP·Filed 2021·Granted Sep 30, 2025·0 cites·22 claims
- 2367US8890336B2Cylindrical bonding structure and method of manufactureLEE JIN-YUAN·Filed 2008·Granted Nov 18, 2014·2 cites·20 claims
- 2462US8344524B2Wire bonding method for preventing polymer crackingMEGICA CORP·Filed 2006·Granted Jan 1, 2013·2 cites·20 claims
- 2559US2025081684A1Display panel and method of fabricating the sameAUO CORP·Filed 2023·Application pending·0 cites
- 2659US2025169253A1Display device and manufacturing method thereofAUO CORP·Filed 2023·Application pending·0 cites
- 2758US11948928B2Display apparatus and manufacturing method thereofAU OPTRONICS CORP·Filed 2021·Granted Apr 2, 2024·0 cites·17 claims
- 2857US2025374726A1Transparent display apparatusAUO CORP·Filed 2024·Application pending·0 cites
- 2955US5741382AMethod for preparing oriented discontinuous long fiber reinforced thermoplastic resin composite sheet productNAT SCIENCE COUNCIL·Filed 1996·Granted Apr 21, 1998·18 cites·16 claims
- 3054US2008211105A1Method of assembling chipsMEGICA CORP·Filed 2008·Application pending·0 cites
- 3154US2008241992A1Method of assembling chipsMEGICA CORP·Filed 2008·Application pending·0 cites
- 3253US12426420B2Light-emitting diode element and method for manufacturing display apparatusAUO CORP·Filed 2022·Granted Sep 23, 2025·0 cites·8 claims
- 3353US12412873B2Display panel having vertical light emitting device and flip chip light emitting deviceAU OPTRONICS CORP·Filed 2022·Granted Sep 9, 2025·0 cites·14 claims
- 3447US2014104513A1Electronic apparatusAU OPTRONICS CORP·Filed 2013·Application pending·0 cites
- 3544US2008131981A1Method for forming Au-bump with clean surfaceLIN SHIH-HSIUNG·Filed 2007·Application pending·0 cites
- 3639US2003127734A1Cylindrical bonding structure and method of manufactureFiled 2002·Application pending·0 cites
- 3736US8633908B2Method of fabricating electronic apparatusCHANG YI-SHAN·Filed 2010·Granted Jan 21, 2014·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →