Inventor · disambiguated record
Mou-Shiung Lin
Also filed as: LIN MOU-SHIUNG
356 granted patents·70 pending applications·9,052 citations·filing 1993–2025
99Inventor score
Top patents by PatentIndex Score
426 records- 0199US11887930B2Vertical interconnect elevator based on through silicon viasICOMETRUE CO LTD·Filed 2020·Granted Jan 30, 2024·10 cites·27 claims
- 0299US11159166B2Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cellsICOMETRUE CO LTD·Filed 2020·Granted Oct 26, 2021·11 cites·43 claims
- 0399US10447274B2Logic drive based on standard commodity FPGA IC chips using non-volatile memory cellsICOMETRUE CO LTD·Filed 2018·Granted Oct 15, 2019·61 cites·20 claims
- 0499US8503186B2System-in packagesLIN MOU-SHIUNG·Filed 2010·Granted Aug 6, 2013·143 cites·20 claims
- 0599US7969006B2Integrated circuit chips with fine-line metal and over-passivation metalMEGICA CORP·Filed 2007·Granted Jun 28, 2011·96 cites·46 claims
- 0699US7902679B2Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bumpMEGICA CORP·Filed 2007·Granted Mar 8, 2011·111 cites·20 claims
- 0799US6818545B2Low fabrication cost, fine pitch and high reliability solder bumpMEGIC CORP·Filed 2001·Granted Nov 16, 2004·271 cites·35 claims
- 0899US6495442B1Post passivation interconnection schemes on top of the IC chipsMEGIC CORP·Filed 2000·Granted Dec 17, 2002·207 cites·23 claims
- 0999US6303423B1Method for forming high performance system-on-chip using post passivation processMEGIC CORP·Filed 2000·Granted Oct 16, 2001·272 cites·35 claims
- 1099US6103552AWafer scale packaging schemeFiled 1998·Granted Aug 15, 2000·361 cites·30 claims
- 1198US12327790B2Vertical interconnect elevator based on through silicon viasICOMETRUE CO LTD·Filed 2024·Granted Jun 10, 2025·4 cites·29 claims
- 1298US12327816B2Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chipICOMETRUE CO LTD·Filed 2023·Granted Jun 10, 2025·4 cites·34 claims
- 1398US11227838B2Logic drive based on multichip package comprising standard commodity FPGA IC chip with cooperating or supporting circuitsICOMETRUE CO LTD·Filed 2020·Granted Jan 18, 2022·4 cites·38 claims
- 1498US11211334B2Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chipICOMETRUE CO LTD·Filed 2019·Granted Dec 28, 2021·35 cites·36 claims
- 1598US10892011B2Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cellsICOMETRUE CO LTD·Filed 2019·Granted Jan 12, 2021·42 cites·35 claims
- 1698US8456856B2Integrated circuit chip using top post-passivation technology and bottom structure technologyLIN MOU-SHIUNG·Filed 2010·Granted Jun 4, 2013·138 cites·20 claims
- 1798US8164171B2System-in packagesLIN MOU-SHIUNG·Filed 2010·Granted Apr 24, 2012·95 cites·20 claims
- 1898US7465654B2Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structuresMEGICA CORP·Filed 2005·Granted Dec 16, 2008·60 cites·20 claims
- 1998US6759275B1Method for making high-performance RF integrated circuitsMEGIC CORP·Filed 2001·Granted Jul 6, 2004·175 cites·11 claims
- 2098US6649509B1Post passivation metal scheme for high-performance integrated circuit devicesMEGIC CORP·Filed 2001·Granted Nov 18, 2003·156 cites·110 claims
- 2198US6605528B1Post passivation metal scheme for high-performance integrated circuit devicesMEGIC CORP·Filed 2001·Granted Aug 12, 2003·151 cites·69 claims
- 2298US6455885B1Inductor structure for high performance system-on-chip using post passivation processMEGIC CORP·Filed 2001·Granted Sep 24, 2002·178 cites·21 claims
- 2398US6180426B1High performance sub-system design and assemblyFiled 1999·Granted Jan 30, 2001·151 cites·12 claims
- 2497US12278192B2Logic drive based on multichip package comprising standard commodity FPGA IC chip with cooperating or supporting circuitsICOMETRUE CO LTD·Filed 2023·Granted Apr 15, 2025·2 cites·22 claims
- 2597US11394386B2Logic drive using standard commodity programmable logic IC chipsICOMETRUE CO LTD·Filed 2020·Granted Jul 19, 2022·3 cites·20 claims
- 2697US10957679B2Logic drive based on standardized commodity programmable logic semiconductor IC chipsICOMETRUE CO LTD·Filed 2018·Granted Mar 23, 2021·14 cites·20 claims
- 2797US10489544B2Logic drive based on standard commodity FPGA IC chipsICOMETRUE CO LTD·Filed 2017·Granted Nov 26, 2019·11 cites·22 claims
- 2897US8148806B2Multiple chips bonded to packaging structure with low noise and multiple selectable functionsLIN MOU-SHIUNG·Filed 2008·Granted Apr 3, 2012·46 cites·34 claims
- 2997US8021918B2Integrated circuit chips with fine-line metal and over-passivation metalMEGICA CORP·Filed 2007·Granted Sep 20, 2011·45 cites·34 claims
- 3097US7045901B2Chip-on-chip connection with second chip located in rectangular open window hole in printed circuit boardMEGIC CORP·Filed 2003·Granted May 16, 2006·91 cites·8 claims
- 3197US6756295B2Chip structure and process for forming the sameMEGIC CORP·Filed 2002·Granted Jun 29, 2004·141 cites·35 claims
- 3297US6734563B2Post passivation interconnection schemes on top of the IC chipsMEGIC CORP·Filed 2002·Granted May 11, 2004·79 cites·23 claims
- 3397US6673698B1Thin film semiconductor package utilizing a glass substrate with composite polymer/metal interconnect layersMEGIC CORP·Filed 2002·Granted Jan 6, 2004·100 cites·15 claims
- 3497US6426556B1Reliable metal bumps on top of I/O pads with test probe marksMEGIC CORP·Filed 2001·Granted Jul 30, 2002·177 cites·66 claims
- 3596US12368438B2Logic drive based on standard commodity FPGA IC chips using non-volatile memory cellsICOMETRUE CO LTD·Filed 2023·Granted Jul 22, 2025·1 cites·27 claims
- 3696US11637056B23D chip package based on through-silicon-via interconnection elevatorICOMETRUE CO LTD·Filed 2020·Granted Apr 25, 2023·3 cites·28 claims
- 3796US10630296B2Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cellsICOMETRUE CO LTD·Filed 2018·Granted Apr 21, 2020·13 cites·26 claims
- 3896US8809951B2Chip packages having dual DMOS devices with power management integrated circuitsMEGICA CORP·Filed 2013·Granted Aug 19, 2014·22 cites·24 claims
- 3996US8193555B2Image and light sensor chip packagesLIN MOU-SHIUNG·Filed 2010·Granted Jun 5, 2012·29 cites·6 claims
- 4096US8072070B2Low fabrication cost, fine pitch and high reliability solder bumpLEE JIN-YUAN·Filed 2009·Granted Dec 6, 2011·32 cites·23 claims
- 4196US8004092B2Semiconductor chip with post-passivation scheme formed over passivation layerMEGICA CORP·Filed 2008·Granted Aug 23, 2011·42 cites·42 claims
- 4296US7863739B2Low fabrication cost, fine pitch and high reliability solder bumpMEGICA CORP·Filed 2007·Granted Jan 4, 2011·28 cites·48 claims
- 4396US7582556B2Circuitry component and method for forming the sameMEGICA CORP·Filed 2006·Granted Sep 1, 2009·40 cites·31 claims
- 4496US7582966B2Semiconductor chip and method for fabricating the sameMEGICA CORP·Filed 2007·Granted Sep 1, 2009·35 cites·20 claims
- 4596US7521812B2Method of wire bonding over active area of a semiconductor circuitMEGICA CORP·Filed 2007·Granted Apr 21, 2009·37 cites·13 claims
- 4696US7482693B2Top layers of metal for high performance IC'sLIN MOU-SHIUNG·Filed 2007·Granted Jan 27, 2009·24 cites·17 claims
- 4796US7473999B2Semiconductor chip and process for forming the sameMEGICA CORP·Filed 2006·Granted Jan 6, 2009·40 cites·20 claims
- 4896US7468545B2Post passivation structure for a semiconductor device and packaging process for sameMEGICA CORP·Filed 2006·Granted Dec 23, 2008·40 cites·23 claims
- 4996US7397121B2Semiconductor chip with post-passivation scheme formed over passivation layerMEGICA CORP·Filed 2005·Granted Jul 8, 2008·49 cites·20 claims
- 5096US7382052B2Post passivation interconnection schemes on top of IC chipLIN MOU-SHIUNG·Filed 2007·Granted Jun 3, 2008·20 cites·20 claims
Showing the top 50 of 426 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →