Plating apparatus

Abstract

A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surface to be plated facing upward. A seal material 90 contacts a peripheral edge portion of the surface, sealing the portion in a watertight manner. A cathode electrode 88 passes an electric current upon contact with the substrate. A cathode portion 38 rotates integrally with the substrate holding portion 36 . An electrode arm portion 30 is above the cathode portion 38 and movable horizontally and vertically and has an anode 98 face-down. Plating liquid is poured into a space between the surface to be plated and the anode 98 brought close to the surface to be plated. Thus, plating treatment and treatments incidental thereto can be performed by a single unit.

1 . (canceled) 
     
     
         2 . A method for controlling an electric field state in an electrolytic treatment apparatus, comprising:
 providing a high resistance structure in at least part of an electrolytic solution filled between a substrate, to be treated, having a contact with one of electrodes consisting of an anode and a cathode, and the other electrode facing the substrate to be treated, said high resistance structure having an electrical conductivity lower than that of the electrolytic solution; and   controlling an electric field of a surface of the substrate, to be treated, by adjusting at least one of an exterior shape of said high resistance structure, an internal structure of said high resistance structure, and an attachment of a member having a different electrical conductivity.   
     
     
         3 . The method of controlling an electric field state in an electrolytic treatment apparatus according to  claim 2 , wherein said adjusting of the exterior shape is at least one of adjustment of a thickness of said high resistance structure, and adjustment of a shape on a plane of said high resistance structure. 
     
     
         4 . The method of controlling an electric field state in an electrolytic treatment apparatus according to  claim 2 , wherein said high resistance structure comprises a porous substance, and said adjusting of the internal structure of said porous substance is at least one of adjustment of a pore diameter distribution thereof, adjustment of porosity distribution thereof, adjustment of flexing rate distribution thereof, and adjustment of a combination of materials. 
     
     
         5 . The method of controlling an electric field state in an electrolytic treatment apparatus according to  claim 2 , wherein said adjusting of the attachment of said member having the different electrical conductivity is adjustment of a shielding area of said high resistance structure by means of said member having the different electrical conductivity.