Plating apparatus

Abstract

A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surface to be plated facing upward. A seal material 90 contacts a peripheral edge portion of the surface, sealing the portion in a watertight manner. A cathode electrode 88 passes an electric current upon contact with the substrate. A cathode portion 38 rotates integrally with the substrate holding portion 36 . An electrode arm portion 30 is above the cathode portion 38 and movable horizontally and vertically and has an anode 98 face-down. Plating liquid is poured into a space between the surface to be plated and the anode 98 brought close to the surface to be plated. Thus, plating treatment and treatments incidental thereto can be performed by a single unit.

1 . (canceled) 
     
     
         2 . A plating method for a substrate, comprising:
 positioning an anode closely to at least part of a surface, to be plated, of the substrate which is electrically connected to a cathode electrode; and   pouring a plating liquid between the surface, to be plated, of the substrate and said anode,   wherein a plating liquid column which bridges the surface, to be plated, of the substrate and said anode is formed and the plating liquid is poured with said plating liquid column as a starting point.   
     
     
         3 . The plating method for a substrate according to  claim 2 , wherein the plating liquid is poured between the surface, to be plated, of the substrate and said anode from a plating liquid pouring path provided in part of said anode or provided around an outer peripheral portion of said anode. 
     
     
         4 . A plating method for a substrate, comprising:
 positioning an anode closely to at least part of a surface, to be plated, of the substrate which is electrically connected to a cathode electrode; and   filling a plating liquid into a space between the surface, to be plated, of the substrate and said anode, by covering the plating liquid on the surface, to be plated, of the substrate, and bringing the substrate and said anode close to each other gradually under relative rotation.   
     
     
         5 . The plating method for a substrate according to  claim 4 , wherein a plating liquid impregnated material composed of a porous substrate having water retaining properties is placed on a surface of an anode facing the substrate; and means for spreading the plating liquid between said plating liquid impregnated material and the substrate radially outwardly by relative rotation of said plating liquid impregnated material and the substrate is provided on a surface of said plating liquid impregnated material facing the substrate. 
     
     
         6 . A plating method for a substrate, comprising:
 positioning an anode closely to at least part of a surface, to be plated, of the substrate which is electrically connected to a cathode electrode; and   pouring a plating liquid between the surface, to be plated, of the substrate and said anode from a plating liquid pouring hole provided through part of said anode or a nozzle provided around the outer peripheral portion of said anode so that the plating liquid is flows in one direction and spreads over the entire surface, to be plated, of the substrate.