Coat/develop module with shared dispense

Abstract

An apparatus for dispensing fluid during semiconductor substrate processing operations. The apparatus includes a central fluid dispense bank comprising a plurality of dispense nozzles coupled to a plurality of fluid sources and a first processing chamber positioned to a first side of the central fluid dispense bank. The apparatus also includes a second processing chamber positioned to a second side of the central fluid dispense bank and a dispense arm adapted to translate between the central fluid dispense bank, the first processing chamber, and the second processing chamber.

1 . A method of dispensing fluid onto a semiconductor substrate using an apparatus comprising a central fluid dispense bank including a plurality of dispense nozzles, a first and second processing chamber, and a dispense arm; the method comprising:
 selecting a first dispense nozzle from the plurality of dispense nozzles;   moving the dispense arm to a first position in the first processing chamber;   dispensing a first fluid from the first dispense nozzle; and   returning the dispense arm to a second position above the central fluid dispense bank.   
   
   
       2 . The method of  claim 1  wherein the step of selecting comprises positioning the dispense arm over the first dispense nozzle, gripping the nozzle, and removing the first dispense nozzle from the central fluid dispense bank. 
   
   
       3 . The method of  claim 1  further comprising returning the first dispense nozzle to the central fluid dispense bank. 
   
   
       4 . The method of  claim 1  further comprising:
 moving the first dispense nozzle to a third position in the second processing chamber;   dispensing the first fluid from the first dispense nozzle; and   returning the dispense arm to a second position above the central fluid dispense bank.   
   
   
       5 . The method of  claim 4  further comprising returning the first dispense nozzle to the central fluid dispense bank. 
   
   
       6 . A track lithography tool comprising:
 a front end module adapted to receive FOUPs containing a plurality of substrates;   a central module comprising a plurality of processing tools;   a rear module coupled to a scanner; and   at least one robot adapted to receive a substrate from the front end module and deliver the substrate to either a processing tool and/or the rear module, wherein one of the plurality of processing tools is an apparatus for dispensing fluid during semiconductor substrate processing operations, the apparatus comprising:   a central fluid dispense bank comprising a plurality of dispense nozzles coupled to a plurality of fluid sources;   a first processing chamber positioned to a first side of the central fluid dispense bank;   a second processing chamber positioned to a second side of the central fluid dispense bank; and   a dispense arm adapted to translate between the central fluid dispense bank, the first processing chamber, and the second processing chamber.