Methods and apparatus for processing a substrate

Abstract

Methods and apparatus for cleaning an edge of a substrate are provided. The invention includes a polishing film having a polishing side and a second side; an inflatable pad disposed adjacent the second side of the polishing film; a frame adapted to support the polishing film and the inflatable pad; and a substrate rotation driver adapted to rotate a substrate against the polishing side of the polishing film, wherein the polishing film is disposed between an edge of the substrate and the inflatable pad so that the inflatable pad and polishing film contour to the edge of the substrate with the polishing film contacting the edge of the substrate. Numerous other aspects are provided.

1 . An apparatus adapted to polish an edge of a substrate comprising:
 a polishing film having a polishing side and a second side;   an inflatable pad disposed adjacent the second side of the polishing film;   a frame adapted to support the polishing film and the inflatable pad; and   a substrate rotation driver adapted to rotate a substrate against the polishing side of the polishing film,   wherein the polishing film is disposed between an edge of the substrate and the inflatable pad so that the inflatable pad and polishing film contour to the edge of the substrate with the polishing film contacting the edge of the substrate.   
   
   
       2 . The apparatus of  claim 1  wherein the inflatable pad is selectively inflatable. 
   
   
       3 . The apparatus of  claim 2  wherein the edge of the substrate includes an outer edge and at least one bevel, and
 wherein the inflatable pad is adapted to inflate so that the inflatable pad and polishing film contour to the outer edge and the at least one bevel.   
   
   
       4 . The apparatus of  3  wherein the inflatable pad is adapted to wrap around the outer edge and the at least one bevel. 
   
   
       5 . The apparatus of  claim 1  wherein the inflatable pad includes one or more inflatable bladders. 
   
   
       6 . The apparatus of  claim 2  wherein the edge of the substrate includes an outer edge, a first bevel, and a second bevel, and
 wherein the substrate includes a device region and an exclusion region, and   wherein the inflatable pad is adapted to selectively inflate so that the inflatable pad and polishing film selectively contour to one or more of the outer edge, the first bevel, the second bevel, and the exclusion region.   
   
   
       7 . The apparatus of  claim 6  wherein the inflatable pad and polishing film are precluded from contacting the device region. 
   
   
       8 . The apparatus of  claim 1  wherein the polishing film, the inflatable pad, and the frame are contained in a replaceable cassette. 
   
   
       9 . The apparatus of  claim 1  wherein the frame is further adapted to angularly translate the polishing film around an axis tangential to the edge of the substrate. 
   
   
       10 . The apparatus of  claim 9  wherein the frame is further adapted to continuously oscillate about the edge of the substrate. 
   
   
       11 . The apparatus of  claim 1  wherein the frame is further adapted to circumferentially rotate, with respect to the substrate, the polishing film around the edge of the substrate. 
   
   
       12 . The apparatus of  claim 1  further comprising a fluid supply channel, and wherein the fluid supply channel is adapted to deliver at least one of water and a cleaning chemistry to the edge of the substrate. 
   
   
       13 . The apparatus of  claim 12  wherein the fluid supply channel is further adapted to deliver fluid to the edge of the substrate via the polishing film. 
   
   
       14 . The apparatus of  claim 12  wherein the fluid supply channel is further adapted to deliver fluid to the edge of the substrate via the inflatable pad. 
   
   
       15 . The apparatus of  claim 14  wherein the inflatable pad is permeable and inflatable with the fluid. 
   
   
       16 . The apparatus of  claim 12  wherein the fluid supply channel is adapted to deliver sonicated fluid to the edge of the substrate. 
   
   
       17 . The apparatus of  claim 1  wherein the polishing film is tensioned between a supply spool and a take-up spool. 
   
   
       18 . The apparatus of  claim 17  wherein the frame further comprises a polishing head. 
   
   
       19 . The apparatus of  claim 18  wherein the polishing head is adapted to support the polishing film tensioned between the supply spool and the take-up spool and the inflatable pad. 
   
   
       20 . The apparatus of  claim 1  wherein the polishing film is disposed one of orthogonally or longitudinally to the edge of the substrate.