Inventor · disambiguated record
Sen-Hou Ko
Also filed as: KO SEN-HOU
43 granted patents·25 pending applications·1,799 citations·filing 1995–2016
99Inventor score
Top patents by PatentIndex Score
68 records- 0199US6520847B2Polishing pad having a grooved pattern for use in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted Feb 18, 2003·90 cites·20 claims
- 0299US5964653ACarrier head with a flexible membrane for a chemical mechanical polishing systemAPPLIED MATERIALS INC·Filed 1997·Granted Oct 12, 1999·194 cites·18 claims
- 0398US6824455B2Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatusAPPLIED MATERIALS INC·Filed 2003·Granted Nov 30, 2004·67 cites·18 claims
- 0498US6699115B2Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatusAPPLIED MATERIALS INC·Filed 2002·Granted Mar 2, 2004·63 cites·12 claims
- 0598US6183354B1Carrier head with a flexible membrane for a chemical mechanical polishing systemAPPLIED MATERIALS INC·Filed 1997·Granted Feb 6, 2001·276 cites·92 claims
- 0697US5921855APolishing pad having a grooved pattern for use in a chemical mechanical polishing systemAPPLIED MATERIALS INC·Filed 1997·Granted Jul 13, 1999·207 cites·15 claims
- 0797US5795215AMethod and apparatus for using a retaining ring to control the edge effectAPPLIED MATERIALS INC·Filed 1996·Granted Aug 18, 1998·243 cites·5 claims
- 0893US7993485B2Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2005·Granted Aug 9, 2011·24 cites·23 claims
- 0993US7182680B2Apparatus for conditioning processing padsAPPLIED MATERIALS INC·Filed 2005·Granted Feb 27, 2007·15 cites·1 claims
- 1093US6896584B2Method of controlling carrier head with multiple chambersAPPLIED MATERIALS INC·Filed 2003·Granted May 24, 2005·29 cites·18 claims
- 1192US7175505B1Method for adjusting substrate processing times in a substrate polishing systemAPPLIED MATERIALS INC·Filed 2006·Granted Feb 13, 2007·21 cites·23 claims
- 1292US6146259ACarrier head with local pressure control for a chemical mechanical polishing apparatusAPPLIED MATERIALS INC·Filed 1997·Granted Nov 14, 2000·81 cites·28 claims
- 1391US8125654B2Methods and apparatus for measuring substrate edge thickness during polishingBENVEGNU DOMINIC J·Filed 2009·Granted Feb 28, 2012·19 cites·16 claims
- 1491US6991528B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted Jan 31, 2006·45 cites·27 claims
- 1590US6648740B2Carrier head with a flexible membrane to form multiple chambersAPPLIED MATERIALS INC·Filed 2002·Granted Nov 18, 2003·22 cites·18 claims
- 1688US7207878B2Conductive polishing article for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Apr 24, 2007·11 cites·19 claims
- 1788US6669538B2Pad cleaning for a CMP systemAPPLIED MATERIALS INC·Filed 2000·Granted Dec 30, 2003·32 cites·7 claims
- 1887US6913518B2Profile control platenAPPLIED MATERIALS INC·Filed 2003·Granted Jul 5, 2005·25 cites·15 claims
- 1987US6277010B1Carrier head with a flexible membrane for a chemical mechanical polishing systemAPPLIED MATERIALS INC·Filed 2000·Granted Aug 21, 2001·18 cites·10 claims
- 2086US6386955B2Carrier head with a flexible membrane for a chemical mechanical polishing systemAPPLIED MATERIALS INC·Filed 2000·Granted May 14, 2002·23 cites·10 claims
- 2185US6506104B2Carrier head with a flexible membraneAPPLIED MATERIALS INC·Filed 2001·Granted Jan 14, 2003·16 cites·15 claims
- 2284US6106378ACarrier head with a flexible membrane for a chemical mechanical polishing systemAPPLIED MATERIALS INC·Filed 1999·Granted Aug 22, 2000·44 cites·10 claims
- 2382US6511367B2Carrier head with local pressure control for a chemical mechanical polishing apparatusAPPLIED MATERIALS INC·Filed 2002·Granted Jan 28, 2003·17 cites·17 claims
- 2481US6540594B2Carrier head with a flexible membrane for a chemical mechanical polishing systemAPPLIED MATERIALS INC·Filed 2002·Granted Apr 1, 2003·16 cites·19 claims
- 2581US5938507ALinear conditioner apparatus for a chemical mechanical polishing systemAPPLIED MATERIALS INC·Filed 1995·Granted Aug 17, 1999·56 cites·18 claims
- 2680US8142260B2Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing padsKOLLATA EASHWER·Filed 2008·Granted Mar 27, 2012·10 cites·20 claims
- 2778US7040971B2Carrier head with a flexible membraneAPPLIED MATERIALS INC·Filed 2004·Granted May 9, 2006·13 cites·35 claims
- 2876US8813293B2Apparatus and methods for brush and pad conditioningAPPLIED MATERIALS INC·Filed 2013·Granted Aug 26, 2014·2 cites·20 claims
- 2976US7666061B2Method for conditioning processing padsAPPLIED MATERIALS INC·Filed 2007·Granted Feb 23, 2010·4 cites·7 claims
- 3076US6857946B2Carrier head with a flexureAPPLIED MATERIALS INC·Filed 2003·Granted Feb 22, 2005·12 cites·30 claims
- 3175US8550879B2Polishing pad conditionerCHEN HUNG CHIH·Filed 2008·Granted Oct 8, 2013·5 cites·14 claims
- 3273US8458843B2Apparatus and methods for brush and pad conditioningKO SEN-HOU·Filed 2009·Granted Jun 11, 2013·4 cites·15 claims
- 3373US6656842B2Barrier layer buffing after Cu CMPAPPLIED MATERIALS INC·Filed 1999·Granted Dec 2, 2003·41 cites·16 claims
- 3473US6432826B1Planarized Cu cleaning for reduced defectsAPPLIED MATERIALS INC·Filed 1999·Granted Aug 13, 2002·35 cites·30 claims
- 3571US9711381B2Methods and apparatus for post-chemical mechanical planarization substrate cleaningAPPLIED MATERIALS INC·Filed 2014·Granted Jul 18, 2017·2 cites·13 claims
- 3670US6368191B1Carrier head with local pressure control for a chemical mechanical polishing apparatusAPPLIED MATERIALS INC·Filed 2000·Granted Apr 9, 2002·10 cites·17 claims
- 3763US7749048B2Polishing pad conditioning processAPPLIED MATERIALS INC·Filed 2007·Granted Jul 6, 2010·2 cites·11 claims
- 3856US2014360976A1Apparatus and methods for brush and pad conditioningAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 3955US7828626B2Apparatus for conditioning processing padsAPPLIED MATERIALS INC·Filed 2008·Granted Nov 9, 2010·0 cites·18 claims
- 4054US9508575B2Disk/pad clean with wafer and wafer edge/bevel clean module for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2014·Granted Nov 29, 2016·0 cites·18 claims
- 4153US7104267B2Planarized copper cleaning for reduced defectsAPPLIED MATERIALS INC·Filed 2000·Granted Sep 12, 2006·3 cites·54 claims
- 4253US2009036033A1Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 4353US2009017731A1Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 4453US2009029629A1Methods and apparatus for polishing an edge of a substrateAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 4553US2009036042A1Methods and apparatus for polishing an edge of a substrateAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 4650US2007238393A1Methods and apparatus for polishing an edge of a substrateSHIN HO S·Filed 2007·Application pending·0 cites
- 4750US2005142995A1Method of controlling carrier head with multiple chambersFiled 2005·Application pending·0 cites
- 4848US7115024B2Profile control platenAPPLIED MATERIALS INC·Filed 2005·Granted Oct 3, 2006·0 cites·17 claims
- 4948US2010105291A1Methods and apparatus for polishing a notch of a substrateAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 5048US2017040160A1Design of disk/pad clean with wafer and wafer edge/bevel clean module for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2016·Application pending·0 cites
Showing the top 50 of 68 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →