Methods and apparatus for processing a substrate

Abstract

A method of cleaning an edge of a substrate is provided. The method comprises tensioning a first polishing film in a frame; contacting the first polishing film against an edge of a substrate; conforming the first polishing film to the edge of the substrate, the edge including an outer edge and at least one bevel; and rotating the substrate while the first polishing film remains in contact with the substrate. Numerous other aspects are provided.

1 . A method of cleaning an edge of a substrate comprising:
 tensioning a first polishing film in a frame;   contacting the first polishing film against an edge of a substrate;   conforming the first polishing film to the edge of the substrate, the edge including an outer edge and at least one bevel; and   rotating the substrate while the first polishing film remains in contact with the substrate.   
   
   
       2 . The method of  claim 1  further comprising:
 delivering a fluid to the edge of the substrate.   
   
   
       3 . The method of  claim 2  wherein delivering the fluid further comprises:
 applying at least one of water and a cleaning chemistry to the edge of the substrate via an inflatable pad.   
   
   
       4 . The method of  claim 2  wherein delivering the fluid further comprises:
 applying at least one of water and a cleaning chemistry to the edge of the substrate via the first polishing film.   
   
   
       5 . The method of  claim 1  further comprising:
 conforming a second polishing film to the edge of the substrate.   
   
   
       6 . The method of  claim 5  wherein the second polishing film includes a different type of polishing film compared to the first polishing film. 
   
   
       7 . The method of  claim 6  wherein the first and second
 polishing films contact the edge of the substrate one of sequentially and simultaneously.   
   
   
       8 . The method of  claim 1  further comprising:
 delivering fluid including sonic energy to the edge of the substrate.   
   
   
       9 . The method of  claim 1  further comprising:
 rotating the substrate for between 5 and 150 seconds.   
   
   
       10 . The method of  claim 1  wherein the frame includes one or more heads adapted to conform the first polishing film to the edge of the substrate. 
   
   
       11 . The method of  claim 10  further comprising:
 angularly translating the one or more heads and the first polishing film around an axis tangential to the outer edge of the substrate.   
   
   
       12 . The method of  claim 10  further comprising:
 circumferentially rotating, with respect to the substrate, the one or more heads around the edge of the substrate.   
   
   
       13 . The method of  claim 1  further comprising:
 advancing the first polishing film as it contacts the substrate edge.   
   
   
       14 . The method of  claim 10  wherein conforming the first polishing film further comprises:
 pressing a conformable pad portion of the head against the first polishing film.   
   
   
       15 . The method of  claim 14  further comprising:
 adjusting the pressure applied by the conformable pad against the first polishing film.   
   
   
       16 . The method of  claim 15 , wherein the pressure is adjusted by a controller based on a signal. 
   
   
       17 . The method of  claim 10  further comprising:
 oscillating the one or more heads between positions that allow the first polishing film to contact at least one bevel and the outer edge of the substrate.   
   
   
       18 . The method of  claim 10  further comprising:
 controlling the movement of the one or more heads with a controller.   
   
   
       19 . The method of  claim 10  further comprising:
 polishing a predefined portion of the edge of the substrate with the one or more heads.   
   
   
       20 . The method of  claim 1  further comprising:
 moving the edge of the substrate in a longitudinal direction; and   spanning the first polishing film between a supply spool and a take up spool in a longitudinal direction.