Substrate processing apparatus

Abstract

A substrate processing apparatus ( 1 ) has a first polishing unit ( 400 A) and a second polishing unit ( 400 B) for polishing a peripheral portion of a substrate. Each of the two polishing units ( 400 A, 400 B) includes a bevel polishing device ( 450 A, 450 B) for polishing a peripheral portion of a substrate and a notch polishing device ( 480 A, 480 B) for polishing a notch of a substrate. The substrate processing apparatus ( 1 ) has a maintenance space ( 7 ) formed between the two polishing units ( 400 A, 400 B). The bevel polishing devices ( 450 A, 450 B) in the two polishing units ( 400 A, 400 B) face the maintenance space ( 7 ) so as to be accessible from the maintenance space ( 7 ).

1 . A substrate processing apparatus comprising:
 at least two polishing units, each of said two polishing units including at least one of a bevel polishing device and a notch polishing device for polishing a peripheral portion of a substrate; and   a maintenance space formed between said two polishing units,   wherein said at least one of said bevel polishing device and said notch polishing device in each of said two polishing units faces said maintenance space so as to be accessible from said maintenance space.   
   
   
       2 . The substrate processing apparatus as recited in  claim 1 , wherein said each of said two polishing units is housed in a casing having a hatch provided at a position facing said maintenance space,
 wherein said at least one of said bevel polishing device and said notch polishing device in each of said two polishing units is accessible from the maintenance space by opening said hatch.   
   
   
       3 . The substrate processing apparatus as recited in  claim 1 , wherein said bevel polishing device includes:
 (i) a polishing tape,   (ii) a bevel polishing head for pressing said polishing tape against the peripheral portion of the substrate, and   (iii) a polishing tape supply/recovery mechanism for supplying said polishing tape to said bevel polishing head and recovering said polishing tape from said bevel polishing head, said polishing tape in said polishing tape supply/recovery mechanism being adapted to be replaced from said maintenance space,   wherein said notch polishing device includes:   (i) a polishing tape,   (ii) a notch polishing head for pressing said polishing tape against a notch of the substrate, and   (iii) a polishing tape supply/recovery mechanism for supplying said polishing tape to said notch polishing head and recovering said polishing tape from said notch polishing head, said polishing tape in said polishing tape supply/recovery mechanism being adapted to be replaced from said maintenance space.   
   
   
       4 . The substrate processing apparatus as recited in  claim 2 , wherein said casing has sidewalls on four sides thereof,
 wherein one of said bevel polishing device and said notch polishing device is disposed near a first of said sidewalls of said casing, said first of said sidewalls of said casing facing said maintenance space,   wherein another of said bevel polishing device and said notch polishing device is disposed near a second of said sidewalls of said casing which is adjacent to said first of said sidewalls of said casing, said second of said sidewalls of said casing facing a housing for said substrate processing apparatus.   
   
   
       5 . The substrate processing apparatus as recited in  claim 4 , wherein said casing has a hatch provided in said second of said sidewalls thereof,
 wherein said housing for said substrate processing apparatus has a door provided at a position facing said second of said sidewalls of said casing,   wherein said substrate processing apparatus is configured such that said bevel polishing device or said notch polishing device is accessible from an exterior of said substrate processing apparatus when said door of said housing and said hatch of said casing are opened.   
   
   
       6 . The substrate processing apparatus as recited in  claim 4 , further comprising a transfer device for transferring the substrate to and from said polishing units,
 wherein an opening for introducing the substrate into said polishing unit is formed in a third of said sidewalls of said casing, said opening facing said transfer device,   wherein a shutter is provided for closing and opening said opening.   
   
   
       7 . The substrate processing apparatus as recited in  claim 1 , wherein said bevel polishing devices or said notch polishing devices in said at least two polishing units are arranged so as to be symmetrical with interposing said maintenance space therebetween. 
   
   
       8 . The substrate processing apparatus as recited in  claim 7 , wherein operations of said bevel polishing devices or said notch polishing devices in said at least two polishing units are configured so as to be symmetrical with interposing said maintenance space therebetween. 
   
   
       9 . The substrate processing apparatus as recited in  claim 1 , wherein said polishing unit includes:
 (i) a substrate holding table for holding the substrate to be polished by said at least one of said bevel polishing device and said notch polishing device, and   (ii) at least one of a swing mechanism for swinging said substrate holding table on a horizontal plane and a horizontal movement mechanism for linearly moving said substrate holding table on a horizontal plane.   
   
   
       10 . The substrate processing apparatus as recited in  claim 1 ,wherein said at least one of said bevel polishing device and said notch polishing device is configured so as to bring a surface of a polishing tape into sliding contact with the peripheral portion or a notch of the substrate to polish the substrate,
 wherein said polishing tape has a polishing layer in which a chemically inactive resin material into which abrasive particles are dispersed is applied to a surface of a tape base.   
   
   
       11 . The substrate processing apparatus as recited in  claim 10 , wherein said polishing unit includes:
 (i) a substrate holding device for horizontally holding the substrate to be polished by said at least one of said bevel polishing device and said notch polishing device,   (ii) a first supply nozzle for supplying at least one of pure water, ultrapure water, and deionized water toward a polishing area of the substrate held by said substrate holding device, and   (iii) a second supply nozzle for supplying at least one of pure water, ultrapure water, and deionized water toward a central portion on an upper surface of the substrate.   
   
   
       12 - 14 . (canceled) 
   
   
       15 . A substrate polishing method comprising:
 moving a substrate to one of a bevel polishing device for polishing a peripheral portion of a substrate and a notch polishing device for polishing a notch of the substrate by a movement mechanism;   first polishing the peripheral portion of the substrate or the notch of the substrate by the one of the bevel polishing device and the notch polishing device;   supplying only pure water to the substrate to form a water film covering a surface of the substrate after said first polishing;   moving the substrate to another of the bevel polishing device and the notch polishing device by the movement mechanism in a state such that the water film is formed on the surface of the substrate; and   second polishing the peripheral portion of the substrate or the notch of the substrate by the other of the bevel polishing device and the notch polishing device.   
   
   
       16 . A substrate processing method of using a substrate processing apparatus having at least two polishing units each including at least one of a bevel polishing device for polishing a peripheral portion of a substrate and a notch polishing device for polishing a notch of the substrate and a transfer device for transferring the substrate into said at least two polishing units, said substrate polishing method comprising:
 arranging bevel polishing devices or notch polishing devices in said at least two polishing units so as to be symmetrical as seen from the transfer device;   transferring different substrates into the at least two polishing units, respectively, by the transfer device; and   polishing the different substrates in parallel in the at least two polishing units to remove contaminants and/or surface roughness of peripheral portions of the different substrates.   
   
   
       17 . The substrate processing method as recited in  claim 16 , further comprising operating the bevel polishing devices or the notch polishing devices in the at least two polishing units so as to be symmetrical as seen from the transfer device. 
   
   
       18 . A substrate processing method of using a substrate processing apparatus having at least two polishing units each including at least one of a bevel polishing device for polishing a peripheral portion of the substrate and a notch polishing device for polishing a notch of the substrate and a transfer device for transferring the substrate into said at least two polishing units, said substrate polishing method comprising:
 arranging bevel polishing devices or notch polishing devices in said at least two polishing units so as to be symmetrical as seen from the transfer device;   transferring a substrate sequentially into the at least two polishing units by the transfer device; and   polishing the substrate sequentially in the at least two polishing units to remove contaminants and/or surface roughness of peripheral portions of the substrate.   
   
   
       19 . The substrate polishing method as recited in  claim 18 , further comprising operating the bevel polishing devices or the notch polishing devices in the at least two polishing units so as to be symmetrical as seen from the transfer device. 
   
   
       20 . A substrate processing method of using a substrate processing apparatus having at least two polishing units each including at least one of a bevel polishing device for polishing a peripheral portion of the substrate and a notch polishing device for polishing a notch of the substrate and a transfer device for transferring the substrate into said at least two polishing units, said substrate polishing method comprising:
 arranging bevel polishing devices or notch polishing devices in said at least two polishing units so as to be symmetrical as seen from the transfer device;   selectively performing one of two polishing processes including:
 (i) transferring different substrates into the at least two polishing units, respectively, by the transfer device, and polishing the different substrates in parallel in the at least two polishing units to remove contaminants and/or surface roughness of peripheral portions of the different substrates, and 
 (ii) transferring a substrate sequentially into the at least two polishing units by the transfer device, and polishing the substrate sequentially in the at least two polishing units to remove contaminants and/or surface roughness of peripheral portions of the substrate. 
   
   
   
       21 . The substrate polishing method as recited in  claim 20 , further comprising operating the bevel polishing devices or the notch polishing devices in the at least two polishing units so as to be symmetrical as seen from the transfer device. 
   
   
       22 . The substrate processing apparatus as recited in  claim 2 , wherein said bevel polishing device includes:
 (i) a polishing tape,   (ii) a bevel polishing head for pressing said polishing tape against the peripheral portion of the substrate, and   (iii) a polishing tape supply/recovery mechanism for supplying said polishing tape to said bevel polishing head and recovering said polishing tape from said bevel polishing head, said polishing tape in said polishing tape supply/recovery mechanism being adapted to be replaced from said maintenance space,   wherein said notch polishing device includes:   (i) a polishing tape,   (ii) a notch polishing head for pressing said polishing tape against a notch of the substrate, and   (iii) a polishing tape supply/recovery mechanism for supplying said polishing tape to said notch polishing head and recovering said polishing tape from said notch polishing head, said polishing tape in said polishing tape supply/recovery mechanism being adapted to be replaced from said maintenance space.   
   
   
       23 . The substrate processing apparatus as recited in  claim 5 , further comprising a transfer device for transferring the substrate to and from said polishing units,
 wherein an opening for introducing the substrate into said polishing unit is formed in a third of said sidewalls of said casing, said opening facing said transfer device,   wherein a shutter is provided for closing and opening said opening.