Liquid processing apparatus, liquid processing method, and storage medium

Abstract

A liquid processing apparatus 1 comprises a casing 5, a substrate holding mechanism 20 that holds a wafer (substrate to be processed) W, a process-liquid supplying mechanism 30 that supplies a process liquid, a draining cup 12 that receives a process liquid, and a draining pipe 13 that discharges a process liquid outside. The process-liquid supplying mechanism 30 includes a first chemical-liquid supply mechanism that supplies a hydrofluoric process liquid, and a drying-liquid supplying mechanism that supplies an organic solvent for drying a wafer W. A control part 50 causes the first chemical-liquid supplying mechanism to supply a hydrofluoric process liquid, and then causes the drying-liquid supplying mechanism to supply an organic solvent. In addition, before the control part 50 causes the drying-liquid supplying mechanism to supply an organic solvent, the control part causes a cleaning mechanism 10 to remove an alkaline component in a casing 5.

1 . A liquid processing apparatus comprising:
 a casing;   a substrate holding mechanism disposed in the casing, the substrate holding mechanism being configured to hold a substrate to be processed;   a process-liquid supplying mechanism configured to supply a process liquid to the substrate to be processed held by the substrate holding mechanism;   a draining cup configured to cover the substrate to be processed held by the substrate holding mechanism in the casing from an outer peripheral side, the draining cup being configured to receive a process liquid that has been used for cleaning the substrate to be processed; and   a draining pipe connected to the draining cup, the draining pipe being configured to discharge outside the process liquid having passed through the draining cup;   wherein:   the process-liquid supplying mechanism has a first chemical-liquid supplying mechanism configured to supply a hydrofluoric process liquid, and a drying-liquid supplying mechanism configured to supply an organic solvent for drying the substrate to be processed;   there is provided a removing mechanism configured to remove an alkaline component in the casing, or an invasion preventing mechanism configured to prevent invasion of an alkaline component into the casing;   the first chemical-liquid supplying mechanism, the drying-liquid supplying mechanism, and the removing mechanism or the invasion preventing mechanism, are controlled by a control part;   the control part causes the first chemical-liquid supplying mechanism to supply a hydrofluoric process liquid, and thereafter the control part causes the drying-liquid supplying mechanism to supply an organic solvent for drying the substrate to be processed; and   before the control part causes the drying-liquid supplying mechanism to supply an organic solvent, the control part causes the removing mechanism to remove an alkaline component in the casing, or causes the invasion preventing mechanism to prevent invasion of an alkaline component into the casing.   
     
     
         2 . The liquid processing apparatus according to  claim 1 , wherein
 before the control part causes the first chemical-liquid supplying mechanism to supply a hydrofluoric process liquid, the control part causes the removing mechanism to remove an alkaline component in the casing.   
     
     
         3 . The liquid processing apparatus according to  claim 1 , wherein
 the invasion preventing mechanism is formed of a pressurizing mechanism that increases an air pressure in the casing.   
     
     
         4 . The liquid processing apparatus according to  claim 1 , wherein
 the removing mechanism is formed of a cleaning mechanism that supplies a cleaning liquid to the draining cup so as to remove the alkaline component adhering to the draining cup.   
     
     
         5 . The liquid processing apparatus according to  claim 4 , wherein:
 the process-liquid supplying mechanism has a second chemical-liquid supplying mechanism controlled by the control part, the second chemical-liquid supplying mechanism being configured to supply an alkaline process liquid; and   the control part causes the cleaning mechanism to supply a cleaning liquid to the draining cup so as to remove the alkaline component adhering to the draining cup, after the control part causes the second chemical-liquid supplying mechanism to supply an alkaline process liquid, and before the control part causes the first chemical-liquid supplying mechanism to supply a hydrofluoric process liquid.   
     
     
         6 . The liquid processing apparatus according to  claim 4  further comprising a blocking mechanism disposed in the draining pipe, the blocking mechanism being configured to stop a flow of a process liquid passing through the draining pipe, wherein:
 the process-liquid supplying mechanism has a cleaning-liquid supplying mechanism configured to supply a cleaning liquid to the substrate to be processed held on the substrate holding mechanism;   the cleaning mechanism is composed of the cleaning-liquid supplying mechanism, the draining pipe, and the blocking mechanism; and   the control part causes the blocking mechanism to block the draining pipe to store a cleaning liquid in the draining pipe and the draining cup, so as to remove the alkaline component adhering to the draining cup.   
     
     
         7 . The liquid processing apparatus according to  claim 4 , wherein
 the cleaning mechanism has a cleaning-liquid jetting mechanism configured to jet a cleaning liquid to the draining cup so as to remove the alkaline component adhering to the draining cup.   
     
     
         8 . The liquid processing apparatus according to  claim 1 , further comprising:
 a gas introducing part disposed in the casing, the gas introducing part being configured to supply a gas to the substrate to be processed held by the substrate holding mechanism from above; and   an exhaust cup positioned to surround the draining cup in the casing, the exhaust cup being configured to take thereinto a gas having passed through the substrate to be processed, and then to discharge the gas.   
     
     
         9 . A liquid processing method using a liquid processing apparatus having a casing; a substrate holding mechanism disposed in the casing, the substrate holding mechanism being configured to hold a substrate to be processed; a process-liquid supplying mechanism configured to supply a process liquid to the substrate to be -processed held by the substrate holding mechanism; a draining cup configured to cover the substrate to be processed held by the substrate holding mechanism in the casing from an outer peripheral side, the draining cup being configured to receive a process liquid that has been used for cleaning the substrate to be processed; and a draining pipe connected to the draining cup, the draining pipe being configured to discharge outside the process liquid having passed through the draining cup; the liquid processing method comprising:
 a holding step in which the substrate to be processed is held by the substrate holding mechanism;   a rotating step in which the substrate to be processed held by the substrate holding mechanism is rotated by the rotating mechanism; and   a process-liquid supplying step in which a process liquid is supplied by the process-liquid supplying mechanism to the substrate to be processed held by the substrate holding mechanism;   wherein:   the process-liquid supplying step includes: a first chemical-liquid supplying step in which a hydrofluoric process liquid is supplied; and a drying-liquid supplying step, after the first chemical-liquid supplying step, in which an organic solvent for drying the substrate to be processed is supplied; and   before the drying-liquid supplying step, there is performed a removing step in which an alkaline component in the casing is removed, or an invasion preventing step in which invasion of an alkaline component into the casing is prevented.   
     
     
         10 . The liquid processing method according to  claim 9 , wherein
 the removing step is performed, before the first chemical-liquid supplying step in which a hydrofluoric process liquid is supplied.   
     
     
         11 . The liquid processing method according to  claim 9 , wherein
 the invasion preventing step prevents the invasion of an alkaline component into the casing, by increasing an air pressure in the casing.   
     
     
         12 . The liquid processing method according to  claim 9 , wherein
 the removing step removes the alkaline component adhering to the draining cup, by supplying a cleaning liquid to the draining cup.   
     
     
         13 . The liquid processing method according to  claim 12 , wherein:
 the process-liquid supplying step includes, before the first chemical-liquid supplying step in which a hydrofluoric process liquid is supplied, a second chemical-liquid supplying step in which an alkaline process liquid is supplied; and   the alkaline component adhering to the draining cup is removed by supplying a cleaning liquid to the draining cup, after the second chemical-liquid supplying step in which an alkaline process liquid is supplied, and before the first chemical-liquid supplying step in which a hydrofluoric process liquid is supplied.   
     
     
         14 . The liquid processing method according to  claim 12 , wherein
 a flow of the cleaning liquid, which has been supplied from the process-liquid supplying mechanism and passes through the draining pipe, is stopped by means of a blocking mechanism disposed in the draining pipe, so that the process liquid is stored in the draining pipe and the draining cup whereby the cleaning liquid is supplied to the draining cup, so as to remove the alkaline component adhering to the draining cup.   
     
     
         15 . The liquid processing method according to  claim 12 , wherein
 the cleaning step removes the alkaline component adhering to the draining cup, by jetting a cleaning liquid to the draining cup.   
     
     
         16 . A storage medium storing a computer program executable by a computer to perform a liquid processing method,
 wherein the liquid processing method using a liquid processing apparatus having: a substrate holding mechanism being configured to hold a substrate to be processed; a process-liquid supplying mechanism configured to supply a process liquid to the substrate to be processed held by the substrate holding mechanism; a draining cup configured to cover the substrate to be processed held by the substrate holding mechanism from an outer peripheral side, the draining cup being configured to receive a process liquid that has been used for cleaning the substrate to be processed; a draining pipe connected to the draining cup, the draining pipe being configured to discharge outside the process liquid having passed through the draining cup; and a casing capable of accommodating at least the substrate holding mechanism and the draining cup; the liquid processing method comprising:   a holding step in which the substrate to be processed is held by the substrate holding mechanism;   a rotating step in which the substrate to be processed held by the substrate holding mechanism is rotated by the rotating mechanism; and   a process-liquid supplying step in which a process liquid is supplied by the process-liquid supplying mechanism to the substrate to be processed held by the substrate holding mechanism;   wherein:   the process-liquid supplying step includes: a first chemical-liquid supplying step in which a hydrofluoric process liquid is supplied; and a drying-liquid supplying step, after the first chemical-liquid supplying step, in which an organic solvent for drying the substrate to be processed is supplied; and   before the drying-liquid supplying step, there is performed a removing step in which an alkaline component in the casing is removed, or an invasion preventing step in which invasion of an alkaline component into the casing is prevented.