Method of checking substrate edge processing apparatus

Abstract

A method of checking a substrate edge processing apparatus, which can accurately check the state of the substrate edge processing apparatus. The thickness of an organic film formed on a surface of a substrate is measured, and a predetermined process in which undesired substance attached to an edge of the substrate is removed is carried out on a predetermined portion of the organic film using the substrate edge processing apparatus. The film thickness of the predetermined portion is then measured. The removal amount of the organic film is calculated based on the measurement results, and the performance of the substrate edge processing apparatus is evaluated based on the calculated removal amount.

1 . A method of checking a substrate edge processing apparatus that carries out a predetermined process in which undesired substance attached to an edge of a substrate are removed, comprising:
 a first measurement step of measuring a thickness of an organic film formed on a surface of the substrate;   a processing step of carrying out the predetermined process on a predetermined portion of the organic film using the substrate edge processing apparatus;   a second measurement step of measuring a film thickness of the predetermined portion on which the predetermined process has been carried out;   a calculating step of calculating a removal amount of the organic film in said processing step based on a result of the measurement in said first measurement step and a result of the measurement in said second measurement step; and   an evaluating step of evaluating performance of the substrate edge processing apparatus based on the calculated removal amount.   
   
   
       2 . A method of checking a substrate edge processing apparatus as claimed in  claim 1 , wherein the organic film is a resist film. 
   
   
       3 . A method of checking a substrate edge processing apparatus as claimed in  claim 1 , wherein the predetermined portion is positioned 2 mm or more inside an end of the substrate. 
   
   
       4 . A method of checking a substrate edge processing apparatus as claimed in  claim 1 , wherein processing conditions in said processing step differ from processing conditions for removing the undesired substance attached to the edge of the substrate. 
   
   
       5 . A method of checking a substrate edge processing apparatus as claimed in  claim 1 , wherein in said evaluating step, a value of the removal amount calculated in said calculating step is compared with a predetermined value set in advance. 
   
   
       6 . A method of checking a substrate edge processing apparatus as claimed in  claim 1 , wherein in said processing step, laser light is irradiated toward the predetermined portion. 
   
   
       7 . A method of checking a substrate edge processing apparatus as claimed in  claim 6 , wherein in said processing step, further, ozone gas is supplied toward the predetermined portion.