Convenient Replacement of Anode in Semiconductor Electroplating Apparatus

Abstract

The convenient replacement of an anode in a semiconductor electroplating apparatus is disclosed. For example, in one disclosed embodiment, an electroplating system comprises an electroplating cell having an anode chamber, a cathode chamber, a selective transport barrier separating the anode chamber and the cathode chamber, and an anode disposed within the anode chamber. The anode comprises a plurality of pieces of anode material disposed within a removable anode holder.

1 . An electroplating system, comprising:
 an electroplating cell comprising an anode chamber, a cathode chamber, and a selective transport barrier separating the anode chamber and the cathode chamber; and   an anode disposed within the anode chamber and comprising a plurality of pieces of anode material disposed within a removable anode holder.   
   
   
       2 . The electroplating system of  claim 1 , wherein the anode pieces comprise copper pieces. 
   
   
       3 . The electroplating system of  claim 2 , wherein the copper pieces have a rounded shape with a radius in the range of 0.5-0.75 inches. 
   
   
       4 . The electroplating system of  claim 1 , wherein the anode holder comprises a titanium basket. 
   
   
       5 . The electroplating system of  claim 1 , wherein the anode holder comprises a plurality of elongate openings to admit a flow of an anolyte. 
   
   
       6 . The electroplating system of  claim 1 , further comprising a plurality of anode holders. 
   
   
       7 . The electroplating system of  claim 1 , wherein the anode holder is at least partially coated with a protective coating. 
   
   
       8 . The electroplating system of  claim 1 , further comprising a charge plate on which the anode holder rests. 
   
   
       9 . The electroplating system of  claim 8 , wherein the charge plate comprises one or more openings configured to pass a flow of plating solution received through the bottom surface of the anode holder, and wherein the electroplating system further comprises a filter disposed between the anode holder and a plating solution outflow. 
   
   
       10 . An electroplating system, comprising:
 an electroplating cell comprising an anode chamber, a cathode chamber, and a selective transport barrier separating the anode chamber and the cathode chamber;   a plurality of removable anode holders disposed within the anode chamber, each anode holder comprising a basket with one or more faces having a plurality of openings configured to admit a flow of anolyte through the anode holder; and   a plurality of copper anode pieces disposed loosely within each anode holder.   
   
   
       11 . The electroplating system of  claim 10 , wherein the removable anode holders each comprise titanium baskets. 
   
   
       12 . The electroplating system of  claim 10 , wherein at least some openings in the anode holders have an elongate shape with a small dimension that is smaller than an average smallest dimension of a used anode piece. 
   
   
       13 . The electroplating system of  claim 12 , wherein the openings have an oval or rectangular shape. 
   
   
       14 . The electroplating system of  claim 10 , wherein the anode holder is at least partially coated in a protective polymer coating. 
   
   
       15 . The electroplating system of  claim 10 , further comprising a charge plate on which the anode holder rests, wherein the charge plate comprises one or more openings configured to pass a flow of plating solution received through a bottom of the anode holder, and wherein the electroplating system further comprises a filter disposed between the anode holder and a plating solution outflow. 
   
   
       16 . In an electroplating system having an electroplating cell comprising an anode chamber, a cathode chamber separated from the anode chamber by a selective transport barrier, and an anode comprising a plurality of anode pieces contained within an anode holder, a method of servicing the anode, comprising:
 removing electroplating fluids from the cathode chamber and the anode chamber;   opening an access to the anode chamber;   removing the anode holder from the electroplating cell;   removing at least some used anode pieces from the anode holder;   adding at least some replacement anode pieces to the anode holder;   closing the access between the cathode chamber and the anode chamber; and   adding electroplating fluids to the cathode chamber and the anode chamber.   
   
   
       17 . The method of  claim 16 , wherein opening an access between the cathode chamber and the anode chamber comprises removing the selective transport barrier. 
   
   
       18 . The method of  claim 16 , wherein the anode pieces comprise copper pieces. 
   
   
       19 . The method of  claim 16 , wherein the anode comprises a plurality of anode holders, and wherein removing the anode holder from the electroplating cell comprises removing each anode holder from the plating cell. 
   
   
       20 . The method of  claim 16 , wherein the electroplating system comprises a filter disposed fluidically between the anode holder and an electroplating fluid outlet, and further comprising replacing the filter before adding electroplating fluid to the anode chamber.