Polishing platen and polishing apparatus

Abstract

The present invention provides a polishing platen which does not require a large force for removing a polishing pad from an upper surface of the polishing platen and can thus make it relatively easy to remove the polishing pad therefrom. The present invention also provides a polishing apparatus having such polishing platen. The polishing platen ( 12 ) according to the present invention includes a surface to which a polishing pad is attached. The surface of the polishing platen ( 12 ) includes a combination of a first surface ( 20 ) and a second surface ( 21 ) having a surface roughness which is different from that of the first surface ( 20 ).

1 . A polishing platen, comprising:
 a surface to which a polishing pad is attached, said surface comprising a combination of a first surface and a second surface having a surface roughness which is different from that of said first surface.   
     
     
         2 . A polishing apparatus for polishing a substrate, said apparatus comprising:
 a polishing platen having an upper surface;   a polishing pad attached to said upper surface of said polishing platen, said polishing pad having a front surface and a rear surface; and   structure for pressing a substrate against said front surface of said polishing pad and polishing the substrate by relative movement between said polishing platen and the substrate,   wherein said upper surface of said polishing platen comprises a combination of a first surface and a second surface having a surface roughness which is different from that of said first surface, and   said rear surface of said polishing pad is attached to said upper surface of said polishing platen with an adhesive.   
     
     
         3 . A polishing apparatus for polishing a substrate, said apparatus comprising:
 a polishing platen having an upper surface;   a polishing pad attached to said upper surface of said polishing platen, said polishing pad having a front surface and a rear surface; and   structure for pressing a substrate against said front surface of said polishing pad and polishing the substrate by relative movement between said polishing platen and the substrate,   wherein said upper surface of said polishing platen comprises a combination of at least one mirror surface portion and at least one rough surface portion, and   said rear surface of said polishing pad is attached to said upper surface of said polishing platen with an adhesive.   
     
     
         4 . The polishing apparatus according to  claim 3 , wherein:
 said upper surface of said polishing platen has a circular shape;   said at least one rough surface portion comprises a circular rough surface portion arranged at a center of said upper surface; and   said at least one mirror surface portion comprises a belt-shaped mirror surface portion arranged around said circular rough surface portion.   
     
     
         5 . The polishing apparatus according to  claim 3 , wherein:
 said upper surface of said polishing platen has a circular shape;   said at least one mirror surface portion comprises a plurality of belt-shaped mirror surface portions;   said at least one rough surface portion comprises a plurality of belt-shaped rough surface portions; and   said plurality of mirror surface portions and said plurality of rough surface portions are arranged alternately and concentrically.   
     
     
         6 . The polishing apparatus according to  claim 3 , wherein:
 said upper surface of said polishing platen has a circular shape; and   said at least one mirror surface portion comprises a plurality of mirror surface portions distributed evenly within said at least one rough surface portion.   
     
     
         7 . The polishing apparatus according to  claim 3 , wherein:
 said upper surface of said polishing platen has a circular shape; and   said at least one rough surface portion comprises a plurality of rough surface portions distributed evenly within said at least one mirror surface portion.   
     
     
         8 . The polishing apparatus according to  claim 3 , wherein:
 said upper surface of said polishing platen has a circular shape;   said at least one mirror surface portion comprises a plurality of belt-shaped mirror surface portions extending radially from a center of said upper surface of said polishing platen; and   said at least one rough surface portion is provided between said plurality of mirror surface portions.   
     
     
         9 . The polishing apparatus according to  claim 3 , wherein:
 said upper surface of said polishing platen has a circular shape;   said at least one rough surface portion comprises a plurality of belt-shaped rough surface portions extending radially from a center of said upper surface of said polishing platen; and   said at least one mirror surface portion is provided between said plurality of rough surface portions.   
     
     
         10 . A polishing apparatus for polishing a substrate, said apparatus comprising:
 a polishing platen having an upper surface;   a polishing pad attached to said upper surface of said polishing platen, said polishing pad having a front surface and a rear surface; and   structure for pressing a substrate against said front surface of said polishing pad and polishing the substrate by relative movement between said polishing platen and the substrate,   wherein said upper surface of said polishing platen comprises a combination of at least one mirror surface portion and at least one rough surface portion, and   said rear surface of said polishing pad is attached to said at least one mirror surface portion with an adhesive.   
     
     
         11 . (canceled)