Device and Method for Coating a Micro-and/or Nano-Structured Structural Substrate and Coated Structural Substrate

Abstract

The present invention relates to a device ( 1 ) and a method for coating a microstructured and/or nanostructured structured substrate ( 8 ). According to the present invention, the coating is performed in a vacuum chamber ( 3 ). The pressure level in the vacuum chamber ( 3 ) is elevated during or after the charging of the vacuum chamber ( 3 ) with coating substance.

1 . A device for coating a microstructured and/or nanostructured structured substrate ( 8 ), having a carrier unit ( 9 ) situated in a vacuum chamber ( 3 ) for the structured substrate ( 8 ) and having introduction means ( 14 ,  5 ) for introducing coating substance from a coating substance reservoir into the vacuum chamber ( 3 ) and having means ( 5 ,  6 ,  2 ) for changing the pressure level in the vacuum chamber ( 3 ) characterized in that the coating substance can be introduced by adjusting the difference in pressure between the vacuum chamber ( 3 ) and the coating substance reservoir. 
   
   
       2 . The device according to  claim 1 ,
 characterized in that the introduction means ( 14 ) are implemented as an inlet line and/or spray nozzle and/or atomizer nozzle and/or ultrasonic atomizer.   
   
   
       3 . The device according to  claim 1 ,
 characterized in that the carrier unit ( 9 ) has heating and/or cooling elements ( 11 ) for heating and/or cooling the structured substrate ( 8 ).   
   
   
       4 . The device according to  claim 1 ,
 characterized in that the structured substrate ( 8 ) is rotatable using the carrier unit ( 9 ).   
   
   
       5 . The device according to  claim 1 ,
 characterized in that a misting chamber ( 2 ) having misting means ( 20 ) for misting the coating substance, which is connected via at least one connection line ( 5 ) having a shutoff valve ( 6 ) to the vacuum chamber ( 3 ), is provided as a combined introduction and pressure changing means.   
   
   
       6 . The device according to  claim 5 ,
 characterized in that at least one heating element ( 15 ) is provided for heating the misting chamber ( 2 ).   
   
   
       7 . The device according to  claims 5  or  6 ,
 characterized in that the misting chamber ( 2 ) is implemented as changeable in volume.   
   
   
       8 . The device according to  claims 5  or  6 ,
 characterized in that at least one sensor is provided inside the misting chamber ( 2 ) for detecting the coating substance concentration.   
   
   
       9 . A method for coating a microstructured and/or nanostructured structured substrate ( 8 ), particularly using a device ( 1 ) according to  claim 1 , having the following method steps:
 charging a vacuum chamber ( 3 ) with a structured substrate ( 8 );   evacuating the vacuum chamber ( 3 );   introducing a coating substance from a coating substance reservoir into the vacuum chamber ( 3 ) before and/or while and/or after it is evacuated by means of a difference in pressure between the vacuum chamber ( 3 ) and the coating substance reservoir;   elevating the pressure in the vacuum chamber ( 3 ) while and/or after the coating substance is introduced.   
   
   
       10 . The method according to  claim 9 ,
 characterized in that the coating substance, particularly after the evacuation of the vacuum chamber ( 3 ), is introduced into the vacuum chamber in liquid form and/or is misted in the vacuum chamber ( 3 ).   
   
   
       11 . The method according to  claims 9  or  10 ,
 characterized in that the structured substrate ( 8 ) is heated in the vacuum chamber ( 3 ), preferably over a predetermined time span.   
   
   
       12 . The method according to  claims 9  or  10 ,
 characterized in that the structured substrate ( 8 ) is cooled, preferably before the coating substance is introduced, particularly after heating the structured substrate ( 8 ).   
   
   
       13 . The method according to  claims 9  or  10 ,
 characterized in that the coating substance is misted in a misting chamber ( 2 ), and the coating substance is introduced into the vacuum chamber ( 3 ) by opening at least one shutoff valve ( 6 ) and at least one connection line ( 5 ) between misting chamber ( 2 ) and vacuum chamber ( 3 ), preferably after reaching a desired coating substance concentration in the misting chamber ( 3 ).   
   
   
       14 . The method according to  claim 13 ,
 characterized in that the pressure level in the misting chamber ( 2 ) before the shutoff valve ( 6 ) is opened is higher than the pressure level of the evacuated vacuum chamber ( 3 ), and the pressure level in the misting chamber ( 2 ) preferably corresponds to atmospheric pressure.   
   
   
       15 . The method according to  claim 13 ,
 characterized in that the misting chamber ( 2 ) is heated before and/or while the coating substance is misted.   
   
   
       16 . The method according to  claim 9 ,
 characterized in that structured substrate ( 8 ) made of semiconductor substrate or embossed or molded plastic material or glass substrate, preferably a wafer, having depressions ( 8   v ), preferably pits or holes, having a depth of approximately 10 nm to approximately 400 μm, is used.   
   
   
       17 . The method according to  claim 16 ,
 characterized in that the width or the diameter of the depressions ( 8   v ) is less than their depth.   
   
   
       18 . The method according to  claim 9 ,
 characterized in that photoresist and/or surface activation agent and/or solvent and/or adhesion promoter is/are used as the coating substrate.   
   
   
       19 . The method according to  claim 9 ,
 characterized in that the method steps after the charging of the vacuum chamber ( 3 ) with the structured substrate ( 8 ) are repeated multiple times, preferably using different coating substances.   
   
   
       20 . A use of a device according to  claim 1  for coating a microstructured and/or nanostructured structured substrate ( 8 ) with a coating substance. 
   
   
       21 . A microstructured and/or nanostructured structured substrate with a coating applied by a method according to  claim 9 . 
   
   
       22 . A microstructured and/or nanostructured structured substrate with a coating applied by a device according to  claim 1 . 
   
   
       23 . A structured substrate ( 8 ) according to  claim 21 , wherein the depressions ( 8   v ) having a ratio of opening diameter of the depressions ( 8   v ) to depth of the depressions ( 8   v ) between 1 to 2 and 1 to 20, preferably between 1 to 4 and 1 to 20, are homogeneously coated with an almost uniform layer thickness, with a coating substance ( 24 ). 
   
   
       24 . A device for coating a microstructured and/or nanostructured structured substrate ( 8 ) having a carrier unit ( 9 ) for the structured substrate ( 8 ) situated in a chamber and having introduction means ( 14 ,  5 ) for introducing coating substance ( 24 ) from a coating substance reservoir into the chamber in liquid form, preferably as liquid jet, the coating substance ( 24 ) having a solvent content of at least 25% by volume, in particular at least 40% by volume, preferably at least 60% by volume, most preferably at least 70% by volume and having means ( 5 ,  6 ,  2 ) for changing the pressure level in the vacuum chamber ( 3 ) characterized in that the coating substance can be introduced by adjusting the difference in pressure between the vacuum chamber ( 3 ) and the coating substance reservoir. 
   
   
       25 . A method for coating a microstructured and/or nanostructured structured substrate ( 8 ), in particular by means of a device ( 1 ) according to  claim 24 , with the following process steps:
 charging a chamber with a structured substrate ( 8 );   introducing a coating substance ( 24 ) into the chamber in liquid form, preferably as liquid jet, the coating substance ( 24 ) from a coating substance reservoir having a solvent content of at least 25% by volume, in particular at least 40% by volume, preferably at least 60% by volume, most preferably at least 70% by volume by means of a difference in pressure between the vacuum chamber ( 3 ) and the coating substance reservoir.   
   
   
       26 . The use of a coating substance ( 24 ) having a solvent content of at least 60% by volume, in particular at least 70% by volume, for coating a microstructured and/or nanostructured structured substrate ( 8 ), in particular by applying the coating substance ( 24 ) in liquid form, preferably as liquid jet.