Assignee
THALLNER ERICH
AT·34 granted patents·5 pending applications·100 citations·filing 2004–2020
Top patents by PatentIndex Score
39 records- 0194US7909374B2Handling device and handling method for wafersTHALLNER ERICH·Filed 2007·Granted Mar 22, 2011·24 cites·15 claims
- 0293US7910454B2Combination of a substrate and a waferTHALLNER ERICH·Filed 2006·Granted Mar 22, 2011·14 cites·28 claims
- 0391US8443864B2Device for stripping a wafer from a carrierTHALLNER ERICH·Filed 2010·Granted May 21, 2013·10 cites·23 claims
- 0488US8536020B2Combination of a substrate and a waferTHALLNER ERICH·Filed 2012·Granted Sep 17, 2013·5 cites·7 claims
- 0585US8157615B2Device and process for applying and/or detaching a wafer to/from a carrierTHALLNER ERICH·Filed 2009·Granted Apr 17, 2012·10 cites·15 claims
- 0682US8087708B2Handling device and handling method for wafersTHALLNER ERICH·Filed 2011·Granted Jan 3, 2012·4 cites·7 claims
- 0779US8293063B2Combination of a substrate and a waferTHALLNER ERICH·Filed 2012·Granted Oct 23, 2012·2 cites·6 claims
- 0878US8157307B2Handling device and handling method for wafersTHALLNER ERICH·Filed 2011·Granted Apr 17, 2012·3 cites·8 claims
- 0977US8156981B2Combination of a substrate and a waferTHALLNER ERICH·Filed 2010·Granted Apr 17, 2012·2 cites·20 claims
- 1075US8586132B2Device and method for coating a micro- and/or nano-structured structural substrate and coated structural substrateTHALLNER ERICH·Filed 2012·Granted Nov 19, 2013·4 cites·19 claims
- 1171US7811898B2Method and device for bonding wafersTHALLNER ERICH·Filed 2006·Granted Oct 12, 2010·3 cites·13 claims
- 1270US8926775B2Method and device for bonding two wafersTHALLNER ERICH·Filed 2012·Granted Jan 6, 2015·2 cites·12 claims
- 1368US9682539B2Substrate composite, method and device for bonding of substratesTHALLNER ERICH·Filed 2012·Granted Jun 20, 2017·2 cites·14 claims
- 1468US7998833B2Method for bonding wafersTHALLNER ERICH·Filed 2009·Granted Aug 16, 2011·2 cites·13 claims
- 1567US9478501B2Substrate processing and alignmentTHALLNER ERICH·Filed 2007·Granted Oct 25, 2016·2 cites·20 claims
- 1667US8118290B2Method for holding wafers and device for fixing two parallel arranged wafers relative to one anotherTHALLNER ERICH·Filed 2007·Granted Feb 21, 2012·2 cites·11 claims
- 1765US10014202B2Device and method for aligning substratesTHALLNER ERICH·Filed 2012·Granted Jul 3, 2018·1 cites·15 claims
- 1864US9052422B2Method and device for producing a microlensTHALLNER ERICH·Filed 2010·Granted Jun 9, 2015·1 cites·8 claims
- 1964US8142701B2Method and device for producing a nanopatterned discTHALLNER ERICH·Filed 2008·Granted Mar 27, 2012·1 cites·6 claims
- 2063US9343348B2Substrate-product substrate combination and device and method for producing a substrate-product substrate combinationTHALLNER ERICH·Filed 2012·Granted May 17, 2016·1 cites·4 claims
- 2162US7547611B2Process and device for bonding wafersTHALLNER ERICH·Filed 2007·Granted Jun 16, 2009·1 cites·10 claims
- 2261US8802542B2Combination of a substrate and a waferTHALLNER ERICH·Filed 2013·Granted Aug 12, 2014·0 cites·9 claims
- 2359US8664082B2Combination of a substrate and a waferTHALLNER ERICH·Filed 2013·Granted Mar 4, 2014·0 cites·3 claims
- 2456US12581906B2Method for bonding and debonding substratesTHALLNER ERICH·Filed 2020·Granted Mar 17, 2026·0 cites·17 claims
- 2556US8349701B2Combination of a substrate and a waferTHALLNER ERICH·Filed 2010·Granted Jan 8, 2013·0 cites·26 claims
- 2655US7246445B2Alignment deviceTHALLNER ERICH·Filed 2004·Granted Jul 24, 2007·4 cites·18 claims
- 2754US8591794B2Method and device for producing a nanopatterned discTHALLNER ERICH·Filed 2011·Granted Nov 26, 2013·0 cites·6 claims
- 2853US8875766B2Device and method for the application of a sheet-like jointing means onto a contact area of a waferTHALLNER ERICH·Filed 2013·Granted Nov 4, 2014·0 cites·10 claims
- 2953US2018269096A1Device and method for aligning substratesTHALLNER ERICH·Filed 2018·Application pending·0 cites
- 3051US2009274872A1Device and Method for Coating a Micro-and/or Nano-Structured Structural Substrate and Coated Structural SubstrateTHALLNER ERICH·Filed 2007·Application pending·0 cites
- 3150US7722350B2Apparatus for imprinting and/or embossing substratesTHALLNER ERICH·Filed 2008·Granted May 25, 2010·0 cites·14 claims
- 3249US8500930B2Device and method for the application of a sheet-like jointing means onto a contact area of a waferTHALLNER ERICH·Filed 2005·Granted Aug 6, 2013·0 cites·8 claims
- 3349US2017033053A1Substrate processing and alignmentTHALLNER ERICH·Filed 2016·Application pending·0 cites
- 3448US8212989B2Device for transferring structures which are provided in a mask onto a substrateTHALLNER ERICH·Filed 2008·Granted Jul 3, 2012·0 cites·18 claims
- 3548US7598152B2Device and method for bonding wafersTHALLNER ERICH·Filed 2005·Granted Oct 6, 2009·0 cites·9 claims
- 3646US10276409B2Sample holder, device and method for detaching of a first substrateTHALLNER ERICH·Filed 2014·Granted Apr 30, 2019·0 cites·15 claims
- 3745US2009158947A1Stamp Comprising a Nanostamping Structure, Device and Method for the Production ThereofTHALLNER ERICH·Filed 2006·Application pending·0 cites
- 3843US7432701B2Adjusting device and arrangement for adjusting a waferTHALLNER ERICH·Filed 2005·Granted Oct 7, 2008·0 cites·19 claims
- 3942US2007237897A1Device and method for coating a microstructured and/or nanostructured structural substrateTHALLNER ERICH·Filed 2006·Application pending·0 cites
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