Device and method for aligning substrates

Abstract

A device for aligning and bringing a large-area substrate into contact with a carrier substrate comprising: a substrate holding means for attaching the substrate ; a carrier substrate holding means for attaching the carrier substrate; detection means for detection of a peripheral contour of the substrate attached to the substrate holding means and detection of a peripheral contour of the carrier substrate attached to the carrier substrate holding means relative to a contact plane of the substrate with the carrier substrate; aligning means for aligning the substrate relative to the carrier substrate; and contacting means for bringing the substrate into contact with the carrier substrate.

Having described the invention, the following is claimed: 
     
         1 . A device for detecting positions of a substrate and a carrier substrate fixed to the substrate, the device comprising:
 a first substrate holder configured to fix the substrate; and   detecting means for at least sectionwise detecting positions of the fixed substrate and for at least sectionwise detecting positions of the fixed carrier substrate.   
     
     
         2 . The device according to  claim 1 , wherein a distance between a peripheral edge of the substrate and a peripheral edge of the carrier substrate in a radial direction from respective centers of the substrate and the carrier substrate is in a range of 5 μm to 10 μm. 
     
     
         3 . The device according to  claim 1 , wherein the first substrate holder is fixed in a carrier unit, the carrier unit being configured to move the first substrate holder in x- and y-directions. 
     
     
         4 . The device according to  claim 3 , wherein the carrier unit is further configured to rotate the first substrate holder. 
     
     
         5 . The device according to  claim 1 , wherein the first substrate holder is fixed in a carrier unit, the carrier unit comprising the detecting means. 
     
     
         6 . The device according to  claim 5 , wherein the detecting means is configured to scan the fixed substrate and the fixed carrier substrate in a narrow band range in a vertical direction. 
     
     
         7 . The device according to  claim 6 , wherein the detecting means scans the fixed substrate and the fixed carrier substrate simultaneously. 
     
     
         8 . The device according to  claim 1 , wherein the detecting means comprises one or more optical scanning units that are configured to detect the positions of the fixed substrate and the positions of the fixed carrier substrate. 
     
     
         9 . The device according to  claim 8 , wherein the optical scanning units are further configured to simultaneously scan respective peripheral contours of the fixed substrate and the fixed carrier substrate. 
     
     
         10 . The device according to  claim 9 , wherein the optical scanning units comprise respective distance-measuring elements that are configured to continuously determine a distance from the peripheral contours to the respective distance-measuring elements. 
     
     
         11 . The device according to  claim 9 , wherein the optical scanning units are further configured to produce a gap profile that simultaneously measures respective outside geometries of the fixed substrate and the fixed carrier substrate to calculate an outside diameter of the substrate and the carrier substrate that is the greatest and a distance from the respective peripheral contours of the fixed substrate and the fixed carrier substrate with respect to one another. 
     
     
         12 . A method for detecting positions of a substrate and a carrier substrate, comprising:
 fixing the substrate to a first substrate holder;   fixing the carrier substrate to the substrate; and   at least sectionwise detecting positions of the fixed substrate and at least sectionwise detecting positions of the fixed carrier substrate.   
     
     
         13 . The method according to  claim 12 , wherein the sectionwise detecting positions of the fixed substrate and the sectionwise detecting positions of the fixed carrier substrate are simultaneously performed. 
     
     
         14 . The method according to  claim 12 , wherein the sectionwise detecting positions of the fixed substrate and the sectionwise detecting positions of the fixed carrier substrate comprise scanning the fixed substrate and the fixed carrier substrate in a narrow band range in a vertical direction. 
     
     
         15 . The method according to  claim 12 , wherein the sectionwise detecting positions of the fixed substrate and the sectionwise detecting positions of the fixed carrier substrate comprise optically scanning respective peripheral contours of the fixed substrate and the fixed carrier substrate simultaneously. 
     
     
         16 . The method according to  claim 15 , wherein the optically scanning comprises producing a gap profile that simultaneously measures respective outside geometries of the fixed substrate and the fixed carrier substrate to calculate an outside diameter of the substrate and the carrier substrate that is the greatest and a distance from the respective peripheral contours of the fixed substrate and the fixed carrier substrate with respect to one another.